Investment Rating - The report maintains an "Overweight" rating for the industry, highlighting the growing demand for cooling solutions in interconnect systems as a significant investment opportunity [1]. Core Insights - The report emphasizes that the demand for AI computing power is surging, leading to increased power consumption in AI clusters. This trend is pushing the thermal management requirements from traditional chip-level solutions to include interconnect systems, making connector cooling a critical aspect of thermal management strategies [4][19]. - The report suggests that the global demand for computing power is expected to grow rapidly, driving the need for advanced cooling solutions in AI cluster interconnects. Companies such as Invec (002837), Ruikeda (688800), and AVIC Optoelectronics (002179) are highlighted as key players to watch in this market [4][19]. Summary by Sections 1. Power Consumption Surge and Cooling Demand Growth - AI computing power is experiencing exponential growth, with significant increases in power density from single chips to cabinet levels, surpassing traditional data center design limits. For instance, NVIDIA's GPU TDP is projected to rise from 700W for the H100 to 3700W for the VR200 NVL44 CPX by 2026 [4][19][20]. - The report notes that the average power density of data center cabinets is expected to increase significantly, with projections indicating that by 2025, the average power per cabinet will reach 25kW [21]. 2. Connector Cooling as a Key Thermal Management Component - The report discusses the expansion of thermal management boundaries from chips to interconnect systems, where components like high-speed connectors and optical modules are becoming significant heat sources [4][29]. - It highlights the transition of connector cooling from passive to active management, emphasizing the need for innovative thermal solutions to address the rising temperatures associated with high-power applications [39][45]. 3. Key Companies and Investment Strategies - The report identifies key companies in the connector cooling market, including Invec, Ruikeda, and AVIC Optoelectronics, suggesting that investors should focus on these firms as they capitalize on the growing demand for cooling solutions in AI clusters [4][19]. - The investment strategy outlined in the report encourages stakeholders to pay attention to the evolving landscape of AI computing and the associated thermal management needs, which present substantial investment opportunities [4][19].