Core Viewpoint - The article discusses the evolution of integrated circuits (IC) driven by rapid advancements in AI computing power and increasing demand for high-bandwidth interconnects, highlighting a cyclical trend of "separation and integration" in the industry [2]. Group 1: Industry Trends - The transition from single chips to larger-scale System on Chips (SoC) and then to Chiplet/multi-die configurations is emphasized as a key trend in IC evolution [2]. - The industry is entering a post-Moore's Law phase, where advanced packaging and heterogeneous integration are critical, necessitating tighter collaboration across the supply chain to address system-level constraints [2]. Group 2: Forum Details - On March 26, a forum titled "From Ecological Construction to Application Landing: Chiplet and Advanced Packaging Industry Collaboration" will be held, organized by Silicon Chip Technology in collaboration with various industry partners [2][6]. - The forum aims to connect representatives from design, manufacturing, testing, equipment, EDA, and application sectors to focus on the engineering implementation path of standards, chiplet libraries, and next-generation 2.5D/3D EDA toolchains [2][6]. Group 3: Forum Highlights - The forum will showcase advanced packaging industry collaborative application solutions based on typical case studies, demonstrating how to translate standards and collaboration mechanisms into executable engineering processes [9]. - A session will be dedicated to the establishment of advanced packaging standards by the China Electronics Standardization Association, aiming to move from discussion to actionable engineering rules [10]. Group 4: Collaborative Opportunities - The event will facilitate discussions among representatives from design, manufacturing, testing, materials, equipment, EDA, and application sectors to align key requirements and collaboration boundaries, thereby reducing information discrepancies across different stages [11]. - Through roundtable discussions and on-site exchanges, the forum aims to promote joint verification and supply-demand matching, creating concrete opportunities for future project collaborations [11].