Core Insights - Chipone Technology has successfully established itself as a leading player in the semiconductor IP industry, being recognized as "China's first semiconductor IP stock" after its listing on the STAR Market in August 2020 [1][2] - The company has achieved significant milestones, including being included in the STAR 50 index and successfully completing a refinancing issuance under the "light asset, high R&D investment" recognition standard [1][3] - As of the end of Q1 2025, Chipone's order backlog reached a record high of 2.456 billion yuan, maintaining a high level for six consecutive quarters, indicating strong demand and growth potential [1][3] Company Development - Chipone Technology was founded in 2001 and has evolved from providing standard cell libraries to offering comprehensive chip customization services and semiconductor IP licensing [2] - The company initially aimed for a NASDAQ listing but chose to return to the Chinese capital market, benefiting from the reforms and growth prospects of the STAR Market [2] R&D and Market Position - Chipone ranks first in China and eighth globally in semiconductor IP licensing revenue as of 2024, with a strong focus on high R&D investment, maintaining over 30% of revenue allocated to R&D from 2020 to 2024 [3][4] - The company has successfully developed 5nm system-on-chip (SoC) technology and is executing multiple projects in the 4nm/5nm range, showcasing its advanced design capabilities [3] Strategic Growth and Financing - The recent A-share private placement marks a significant step for Chipone, allowing for more flexible fund allocation towards R&D and innovation, which is crucial for maintaining competitive advantages [4][5] - The company is also exploring mergers and acquisitions to enhance its industry position and foster ecosystem development, leveraging its status as a leading semiconductor IP provider [5][6] AI and Chiplet Technology - The rise of artificial intelligence has created substantial demand for high-performance chips, particularly in the AI ASIC sector, where Chipone has made significant advancements [6][7] - Chipone's neural network processor (NPU) IP has been adopted in 142 AI chip models across various sectors, including servers and automotive, with over 100 million units shipped [6][7] - The company has been proactive in developing Chiplet technology, which allows for modular integration of chips, enhancing performance while balancing costs, particularly in cloud AI and high-end automotive applications [8]

Fundraising Overview - The company, Chiplet Microelectronics (Shanghai) Co., Ltd., has received approval from the China Securities Regulatory Commission to issue shares to specific investors, raising a total of RMB 1,806,856,851.88 [1][2] Special Account and Supervision Agreement - The company has established a special account for the raised funds, which will only be used for the designated projects and not for any other purposes [2][3] - A tripartite supervision agreement has been signed between the company, the sponsoring institution (Guotai Junan Securities Co., Ltd.), and the banks holding the funds to ensure proper management and usage of the raised capital [2][3] Specific Projects and Fund Allocation - The funds will be allocated to research and development projects in the fields of AIGC (Artificial Intelligence Generated Content) and smart mobility, specifically for the Chiplet solution platform [3][4] - The agreement stipulates that the funds must be used solely for the specified projects, ensuring investor protection and compliance with relevant regulations [4][5] Monitoring and Reporting - The sponsoring institution is responsible for ongoing supervision of the fund usage, conducting at least biannual on-site inspections to verify compliance with the agreement [6][7] - The company is required to notify the sponsoring institution of any significant expenditures from the special account and provide detailed expenditure reports [8][9]

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自 semiengineering 。 从SoC到多芯片集成的转变，需要在封装内部布置更多、更智能的控制器，以确保性能最优、信号 完整且无宕机。 在传统的平面SoC中，许多此类功能通常由单个CPU或MCU统一管理。但随着逻辑电路越来越多 地被拆解成多个小芯片（chiplet），并通过TSV（硅通孔）、混合键合或标准铜线相互连接，其 内部交互变得更加复杂。制程变化或不均匀老化可能导致数据路径减慢，加上不同负载、功能域以 及热量、噪声等物理效应对计算位置的影响，使得对处理任务的管理变得更加重要。 核心挑战在于，在开发这些可能耗资超过1亿美元、用于超大规模数据中心的高度定制AI芯片时， 既要保证足够的性能提升和功耗节省，又要确保足够的共性设计，以便重复利用设计和制造流程、 材料以及IP（其中越来越多是chiplet）。 这要求对多芯片设备的更多元素进行管理，并具备足够 的弹性，以便在需要时重路由数据，最小化中断。 Siemens数字工业软件CEO Mike Ellow表示："这关键在于系统能否根据实时运行状态自我调优。 否则，一旦系统部署运行，再经历首次OTA远 ...

Credo Technology Group Holding Ltd (CRDO) is emerging as a powerhouse as the world races to build the next generation of AI data centers. Credo has seen explosive growth, with fiscal 2025 revenues hitting $436.8 million, a 126% year-over-year increase driven by strong demand for its innovative and energy-efficient high- performance connectivity solutions. Demand continues to accelerate, particularly among hyperscaler customers supporting advanced AI services. In the fourth quarter of fiscal 2025, revenues s ...

299.90%。2025 年第一季度，公司实现营业收入 60.92 亿元，同 比增长 15.34%；公司实现归属于母公司股东的净利润 1.01 亿元， 同比增长 2.94%。其他 2024 年度及 2025 年第一季度详细情况， 可以关注公司对外披露的公告。 四、投资者关注的主要问题 证券代码：002156 证券简称：通富微电 通富微电子股份有限公司投资者关系活动记录表 编号：2025-003 | 投资者关系活动 | ☑特定对象调研 □分析师会议 | | --- | --- | | 类别 | □媒体采访 □业绩说明会 | | | □新闻发布会 □路演活动 | | | □现场参观 | | | □其他 （请文字说明其他活动内容） | | 参与单位名称及 | 东北证券：黄磊；国信证券：胡剑 | | 人员姓名 | | | 时间 | 2025 年 6 月 25 日 | | 地点 | 公司会议室 | | 上市公司接待人 | 董事会秘书 蒋澍 | | 员姓名 | | | | 一、公司概况 | | | 通富微电是集成电路封装测试服务提供商，为全球客户提供 | | | 设计仿真和封装测试一站式服务。公司的产品、技术、服务全方 ...

SAN JOSE, Calif., June 18, 2025 /PRNewswire/ -- QuickLogic Corporation (NASDAQ: QUIK), a developer of embedded FPGA (eFPGA) Hard IP, ruggedized FPGAs, and endpoint AI solutions, today announced it will exhibit at the 2025 Chips to Systems Conference (DAC) in San Francisco.Visit Booth #2222 to explore QuickLogic's advanced eFPGA Hard IP and chiplet solutions designed to help accelerate SoC and ASIC development and learn how QuickLogic's silicon-proven eFPGA Hard IP enables post-manufacturing flexibility, hel ...

Investor Presentation | Japan M Foundation Japan Summer School: Semiconductor Production Equipment June 13, 2025 03:18 AM GMT Morgan Stanley MUFG Securities Co., Ltd.+ Tetsuya Wadaki Equity Analyst Tetsuya.Wadaki@morganstanleymufg.com +81 3 6836-8890 Semiconductor Production Equipment Japan Industry View Attractive Morgan Stanley does and seeks to do business with companies covered in Morgan Stanley Research. As a result, investors should be aware that the firm may have a conflict of interest that could aff ...

国芯网[原:中国半导体论坛] 振兴国产半导体产业！ 不拘中国、 放眼世界 ！ 关注 世界半导体论坛 ↓ ↓ ↓ 6月17日消息，据报道， 华为近期申请了一项"四芯片"（quad-chiplet）封装设计专利，可能用于下一 代AI芯片！ 报道称，这项"四芯片"设计与英伟达Rubin Ultra的架构相似，但华为似乎在开发自有先进封装技术。若 技术成功，华为不仅能与台积电一较高下，还可能追上英伟达的AI GPU。 专利内容显示，该专利类似桥接（如台积CoWoS-L），而非单纯中间层的技术。 此外，为了满足AI训练 处理器需求，芯片预期搭配多组HBM，通过中间层互连。 此前，任正非接受采访时表示， 芯片问题其实没必要担心，用叠加和集群等方法，计算结果上与最先进 水平是相当的。 ***************END*************** 半导体公众号推荐 半导体论坛百万微信群 加群步骤： 第一步：扫描下方二维码，关注国芯网微信公众号。 第二步：在公众号里面回复"加群"，按照提示操作即可。 虽然当下先进制程方面落后一代，但先进封装部分却可能与台积电处于同一水准。 如此一来，中国厂商 可以用成熟程制造多个芯片，再 ...

《关于深化科创板改革服务科技创新和新质生产力发展的八条措施》（以下简称"科创板八条"）发布即 将满一周年。一年来，"科创板八条"相关举措绝大部分已完成或取得阶段性进展，改革成效初步显现。 在"科创板八条"发布一周年之际，多位科创板公司掌门人纷纷发声，对进一步深化科创板改革建言献 策。 艾力斯董事长杜锦豪表示，自"科创板八条"实施以来，公司积极响应政策要求，深入开展"提质增效重 回报"行动方案，持续加大研发投入，加大对外合作拓展，不断引进新的品种等，"作为首批探索New- Co模式实现产品海外授权的企业，公司持续推进伏美替尼的全球化工作，与合作方共同将海外临床成 果早日转化为公司可持续业绩"。 晶合集成董事长蔡国智表示，"科创板八条"助力公司利用资本市场提高融资效率和创新激励机制。融资 方面，晶合集成于2024年高效注册20亿元科技创新公司债券，为公司持续高质量发展提供了大力支持。 人才激励方面，晶合集成于2025年成功落地了第二期股权激励计划，利用科创板限制性股票等特色工 具，为公司激励核心团队、吸引和留住高端人才提供了机制保障。 在科创板上市以来，晶合集成自主研发的40nm工艺OLED显示驱动芯片已实现量产 ...

公众号记得加星标⭐️，第一时间看推送不会错过。 来源：内容 综合自 wccftech 。 在 上 月 底 ， AI 芯 片 霸 主 英 伟 达 黄 仁 勋 在 全 球 媒 体 问 答 中 表 示 ， 关 于 英 伟 达 芯 片 与 特 殊 应 用 IC （ASIC）之间的比拼，他坚定地表示，英伟达的增长速度会持续超过ASIC。 对于上述看法，黄仁勋的理由是，这世界上有会出现很多ASIC专案，但其中大约九成会失败，就像 会一直有新创公司冒出头，但大部分都会以败局告终。就算其中有些逃过此命运，但长时间下来，也 可能难以为继。 相较之下，黄仁勋认为，英伟达要延续并不难，这也是他的职责所在。由于英伟达的步伐很快，所以 如果有人想要打造ASIC，可能得比该公司的ASIC还要好才行。 黄仁勋说，市场竞争确实很激烈，但英伟达的技术进展很快，对架构持续进行最佳化，而且也努力让 成本尽速降低，如今已被广泛采用。 ASIC必须得英伟达竞争，且各种ASIC之间也要相互竞争。 毫无疑问，GPU龙头在人工智能领域进展迅速，通过快速引入新架构，打破了规模和性能方面的限 制。NVIDIA 并不担心在当今的人工智能市场中被边缘化，相反，他们 ...