Core Viewpoint - Kuake Intelligent has indicated that HBF and HBM structures are similar, both relying on Chiplet heterogeneous integration, CoWoS packaging, and 3D stacking [1] Group 1: Technology Development - The company is currently developing TCB thermal compression bonding equipment specifically for HBM stacking processes [1] - Future iterations of the equipment will be based on specific applications of HBF [1]

Core Viewpoint - The company is developing TCB (Thermal Compression Bonding) equipment specifically for HBM (High Bandwidth Memory) stacking processes, with future iterations planned based on specific applications of HBF (High Bandwidth Fabric) [1] Group 1 - The structures of HBF and HBM are similar, both relying on Chiplet heterogeneous integration, CoWoS (Chip-on-Wafer-on-Substrate) packaging, and 3D stacking [1] - The company's TCB equipment is currently focused on the development for HBM stacking technology [1]