Core Viewpoint - Kuake Intelligent has indicated that HBF and HBM structures are similar, both relying on Chiplet heterogeneous integration, CoWoS packaging, and 3D stacking [1] Group 1: Technology Development - The company is currently developing TCB thermal compression bonding equipment specifically for HBM stacking processes [1] - Future iterations of the equipment will be based on specific applications of HBF [1]

格隆汇2月12日丨快克智能(603203.SH)在互动平台表示，HBF与HBM结构类似，均依托Chiplet异构集 成、CoWoS封装与3D堆叠。公司TCB热压键合设备目前针对HBM堆叠工艺进行开发，未来可根据HBF 具体应用进行设备迭代。 ...