Investment Rating - The industry rating is "Outperform the Market" [6][12] Core Insights - The release of GPT-5 has catalyzed growth in the AI sector, with significant advancements in programming and overall performance compared to competitors [2] - Major tech companies are increasing their investments in AI, with Alphabet's Q2 revenue growing by 13.8% and net profit by 19.4%, Microsoft's Q4 revenue up by 18%, and Meta's Q2 revenue increasing by 22% [3] - The demand for AI-driven servers, data storage, and high-speed network infrastructure is creating new growth opportunities in the PCB market, particularly for high-density interconnect (HDI) products [3][4] Summary by Sections Investment Opportunities - Focus on PCB equipment companies such as Dazhu CNC, Ding Tai High-Tech, and others [4] - Attention to PCBA equipment firms like Kaige Precision Machinery and others [4] - Advanced packaging companies such as Chipbond Technology and others are highlighted [4] Market Trends - The AI sector's growth is expected to drive demand for more complex and higher-performance PCB products, supporting intricate computing and data processing needs [3][4]

Core Insights - The article emphasizes the significance of computing power in the AI industry, particularly highlighting that a single training session consumes $7.8 million worth of computing resources, which may lead OpenAI to delay the commercial launch of GPT-5 due to a computing power shortage [1] - It forecasts that the penetration rate of liquid cooling in AI servers will more than double by 2025 compared to 2023, with one company already having its liquid cooling board orders booked until the second quarter of next year [1] - The transition to large models is expected to drive core growth for advanced packaging, indicating that manufacturers of packaging materials and equipment are entering a high-growth phase [1] Summary by Sections - **Computing Power and AI Development** - The article discusses the critical role of computing power in AI, noting the substantial cost associated with training AI models, which could impact future developments like GPT-5 [1] - **Liquid Cooling Technology in AI Servers** - It highlights the anticipated increase in liquid cooling technology adoption in AI servers, projecting a significant rise in penetration rates by 2025, with current orders indicating strong demand [1] - **Advanced Packaging Growth** - The article points out that the shift towards large models in AI is creating new growth opportunities for advanced packaging, suggesting a positive outlook for companies involved in this sector [1]

Core Insights - The advanced packaging market is projected to grow from $38 billion to $79 billion by 2030, driven by diverse demands and challenges while maintaining a continuous upward trend [2] - The advanced packaging supply chain is one of the most dynamic sub-sectors of the global semiconductor supply chain, influenced by various factors including capacity constraints, yield challenges, and geopolitical regulations [5] - High-end performance packaging is expected to reach $8 billion in 2024 and exceed $28 billion by 2030, with a compound annual growth rate (CAGR) of 23% [11] Market Growth and Trends - Advanced packaging is experiencing record breakthroughs and expanding its technology portfolio, including new versions of existing technologies like Intel's EMIB and Foveros [8] - The high-end packaging market's largest segment is telecommunications and infrastructure, generating over 67% of revenue in 2024, while the mobile and consumer market is the fastest-growing segment with a CAGR of 50% [11] - The adoption of hybrid bonding technology is increasing, making it more challenging for OSAT manufacturers, as only those with wafer fab capabilities can absorb significant yield losses [14] Supply Chain Dynamics - New alliances are forming to address supply chain challenges, with key advanced packaging technologies being licensed to support transitions to new business models [5] - Major memory manufacturers like Yangtze Memory Technologies, Samsung, SK Hynix, and Micron are expected to dominate the high-end packaging market, capturing 54% of the market share by 2024 [14] - Leading OSAT companies are focusing on high-end packaging solutions based on ultra-high-definition fan-out (UHD FO) and Mold interposer technologies [15] Technological Innovations - The main technological trend in high-end performance packaging is the reduction of interconnect spacing, which is crucial for integrating more complex chips and ensuring lower power consumption [16] - 3D SoC hybrid bonding is emerging as a key technology pillar for next-generation advanced packaging, allowing for smaller interconnect spacing and increased surface area [16] - Chipsets and heterogeneous integration are driving high-end performance packaging applications, with major players like Intel and AMD adopting these technologies in their products [17]

Group 1 - The article highlights significant announcements in the stock market from Sunday to Thursday, including "suspensions and resumption of trading, shareholding changes, investment wins, acquisitions, earnings reports, unlocks, and high transfers" [1] - Important announcements are marked in red to assist investors in identifying investment hotspots and preventing various black swan events, providing ample time for analysis and selection of suitable listed companies [1] Group 2 - A company is developing a new generation of anti-tumor candidate drugs, focusing on innovative pharmaceuticals, synthetic biology, and the pet economy [1] - Another company is providing equipment for downstream optical module customers, with a focus on optical modules, advanced packaging, robotics, Huawei, and AI glasses [1] - A company is collaborating with Zhiyuan Robotics on business projects, emphasizing advanced packaging, storage chips, CPO, Huawei HiSilicon, and robotics [1]

Core Insights - The report highlights the successful trial of brain-machine interfaces for restoring paralysis, indicating advancements in domestic core technology and potential investment opportunities in related stocks such as Innovation Medical and Sanbo Brain Science [7] - The Democratic Republic of the Congo has extended its ban on raw material exports for three months, which is expected to elevate cobalt prices, presenting investment prospects in companies like Huayou Cobalt and Tengyuan Mining [7] - Huawei's patent for "four-chip packaging" has drawn attention to advanced packaging materials, with potential implications for stocks like Feikai Materials and Debang Technology [7] Industry Dynamics - The report notes the successful trial of brain-machine interfaces, which could lead to significant advancements in medical technology and related investments [7] - The extension of the cobalt export ban in the Democratic Republic of the Congo is likely to impact global cobalt prices, creating opportunities for investment in mining companies [7] - The exposure of Huawei's advanced packaging technology may influence the semiconductor and materials sectors, highlighting potential growth areas for investors [7] Company Focus - Cangge Mining plans to sign a financial services agreement with Zijin Finance, aiming to become a member unit for three years [9] - Yipin Hong's wholly-owned subsidiary has received a registration certificate for injectable Zolpidem, indicating progress in pharmaceutical development [9] - Naipu Mining's application for issuing convertible bonds has been accepted by the Shenzhen Stock Exchange, suggesting potential capital raising for expansion [9] - Tianrongxin is involved in key infrastructure security projects for digital currencies in the financial sector, reflecting its strategic positioning in emerging technologies [9] Market Review and Outlook - On June 23, the market experienced a rebound, with the Shanghai Composite Index leading the gains, and a total trading volume of 1.12 trillion yuan, an increase of 549 billion yuan from the previous trading day [11] - The report notes that over 4,400 stocks rose, with significant gains in sectors such as stablecoin concepts, shipping, and solid-state batteries, indicating a positive market sentiment [11] - The outlook suggests that while the market is rebounding, the lack of substantial incremental capital may hinder a sustained upward trend, with the Shanghai Composite Index expected to fluctuate between 3,410 and 3,330 [11] - Key themes to watch include shipping, oil and gas, stablecoins, and solid-state batteries, as these sectors show the best continuity in performance [11]

Core Viewpoint - The article discusses UMC's potential acquisition of a factory from Han Yu Crystal in Tainan Science Park, emphasizing the company's strategic focus on expanding advanced packaging capabilities in Taiwan and Singapore [1][3]. Group 1: Company Strategy - UMC is exploring opportunities for operational and profit enhancement, including factory acquisitions, technology collaborations, and new investments, with Taiwan remaining a key expansion option [3][5]. - The company plans to integrate wafer fabrication with advanced packaging solutions, moving beyond traditional foundry services to high-value areas [4][5]. Group 2: Technological Development - UMC has established 2.5D advanced packaging capabilities in Singapore and is leveraging wafer-to-wafer bonding technology, which is crucial for 3D IC manufacturing [4][5]. - The company is currently focused on 12nm process technology in collaboration with Intel, while also looking to diversify into compound semiconductors and specialized materials [4][5]. Group 3: Production Capacity - UMC's interposer production currently stands at approximately 6,000 units per month, with no immediate plans for capacity expansion [5]. - Future efforts will concentrate on developing integrated technologies with higher added value, providing comprehensive system-level solutions for clients [5].

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 势银研究： 势银产业研究服务 势银数据： 势银数据产品服务 势银咨询： 势银咨询顾问服务 重要会议： 4月29日，2025势银异质异构集成封装产业大会（浙江宁波） 点此报名 添加文末微信，加 先进封装 群 更多内容详见4月29日于甬江实验室举办的 2025势银异质异构集成封装产业大会 本文核心观点及关键数据摘自势银（TrendBank） 《2025先进封装技术及材料市场研究》 ，报告共计51页。该市场研究报告展现了2025全 球及中国先进封装产品、先进IC载板及先进封装用胶膜材料等最新市场趋势及技术发展、供应链动态等详实内容，同时涵盖了当下产业热点的 中国FOPLP技术布局及市场发展预测、玻璃芯封装载板竞争格局及市场发展预测，该报告旨在助力产业链企业掌握最新市场发展态势，支撑其 内部做好战略调整；帮助政府机构了解中国本土先进封装产业链成熟度，并因地制宜的做好产业招引与培育；支撑投资机构了解中国本土先进 封装市场及技术现状，为先进封装产业链项目投资做决策依据。具体订阅联系详见文末。 核心观点 1 3大应用场景 先进封装的主要应用 ...