Core Viewpoint - The company is actively monitoring and engaging with advanced packaging technology trends, including HBF, and is developing materials suitable for HBF manufacturing processes [1] Group 1: Company Developments - The company has stable mass production capabilities for functional wet electronic chemicals, solder balls, and EMC epoxy encapsulants applicable to HBF manufacturing processes [1] - The HBF packaging process involves wafer thinning, stacking, and encapsulation, for which the company has developed temporary bonding materials, LMC liquid encapsulation materials, and GMC particle encapsulation materials [1] - Currently, these materials are in the verification and introduction stage and have not yet generated significant revenue [1] Group 2: Collaboration and Future Prospects - The company is closely collaborating with relevant manufacturers to develop and test related materials [1] - The goal of this collaboration is to enhance the maturity and reliability of the HBF process technology [1]