我们认为半导体行业景气度的持续提升，尤其是人工智能技术的快速迭代催生了相关应用领域需求的持 续增长，有望持续带动公司湿电子化学品以及EMC 环氧塑封料等材料的营业收入上涨。屏幕显示材料 业务市场版图在收购JNC 株式会社旗下液晶业务板块后有望扩张。紫外固化光纤涂覆材料有望受益于 新型光纤技术发展。综上，首次覆盖给予 "增持"投资评级。 2）面板行业市场规模持续扩大，显示技术迭代正推动行业从"量增"向"质变"转型。3）光纤光缆材料持 续变革，新型光纤技术研究提速。未来几年，光纤光缆产业将处于新型光纤技术研究提速和部署应用的 关键时期，全球的光纤光缆需求呈现持续增长的态势。4）有机合成材料产品终端应用领域广泛且持续 拓展，在国家"双碳"战略以及相关环保政策的强驱动下，光引发剂作为光固化技术的关键材料，将迎来 增长机遇。医药中间体和化学原料药产品种类多、附加值高、用途广、产业关联度大，直接服务于国民 经济的诸多行业的各个领域，未来发展潜力巨大。 紫外固化材料起家，业务范围不断扩展。自成立以来，公司从光通信领域紫外固化材料的自主研发和生 产开始，不断寻求行业间技术协同，目前已将核心业务范围逐步拓展至半导体材料、屏幕显 ...

证券研究报告 | 公司深度报告 2026 年 02 月 25 日 飞凯材料（300398.SZ） 半导体材料业务增长可期，屏幕显示材料市场版图有望 扩张 我们认为半导体行业景气度的持续提升，尤其是人工智能技术的快速迭代催生 了相关应用领域需求的持续增长，有望持续带动公司湿电子化学品以及 EMC 环 氧塑封料等材料的营业收入上涨。屏幕显示材料业务市场版图在收购 JNC 株式 会社旗下液晶业务板块后有望扩张。紫外固化光纤涂覆材料有望受益于新型光 纤技术发展。综上，首次覆盖给予 "增持"投资评级。 ❑ 风险提示：宏观经济及产业政策波动风险、新产品研发和技术替代风险、可 增持（首次） 周期/化工 目标估值：NA 当前股价：31.98 元 基础数据 | 总股本（百万股） | 567 | | --- | --- | | 已上市流通股（百万股） | 564 | | 总市值（十亿元） | 18.1 | | 流通市值（十亿元） | 18.0 | | 每股净资产（MRQ） | 8.7 | | ROE（TTM） | 6.7 | | 资产负债率 | 27.4% | | 主要股东 | 飞凯控股有限公司 | | 主要股东持股比例 | 2 ...

Industry Insights - TianShu ZhiXin, a leader in the domestic AI computing sector, announced three significant updates: a roadmap for its fourth-generation chip architecture aiming to surpass NVIDIA's Rubin architecture by 2027, the launch of the "Tongyang" series edge computing products outperforming NVIDIA's AGX Orin, and the first disclosure of large-scale implementation results and benchmark clients across multiple industries. This indicates a comprehensive acceleration in technology, product, and commercialization dimensions for domestic self-developed GPUs [3] - The satellite communication industry chain has become a recent market focus as global low-orbit satellite networks enter a phase of intensive construction. Data from Wind shows that the satellite communication sector index has risen approximately 40% over the past two months, with several satellite communication-related chip companies experiencing significant gains. Market participants believe that as the large-scale launch of satellite internet approaches, chips, as core components, are likely to be the first to benefit from the surge in demand [3] Company Developments - Feikai Materials stated on January 26 that it is closely monitoring advanced packaging technology trends, including HBF. The company has stable mass production of functional wet electronic chemicals, solder balls, and EMC epoxy encapsulants applicable to HBF manufacturing processes. The development of temporary bonding materials and LMC liquid packaging materials is currently in the verification phase, with no large-scale revenue yet. The company is collaborating with relevant manufacturers to enhance the maturity and reliability of HBF process technology [4] - Jefferies noted that the surge in artificial intelligence spending has entered a new phase, with pricing power shifting from chip designers or cloud platforms to memory manufacturers. The market widely anticipates that the "super cycle" in memory driven by the AI boom will continue. According to Counterpoint's analysis, memory prices are expected to rise by 50% in the first quarter of 2026 [4] Related ETFs - The Sci-Tech Semiconductor ETF (588170) and its linked funds track the Shanghai Stock Exchange Sci-Tech Board semiconductor materials and equipment theme index, encompassing semiconductor equipment (60%) and semiconductor materials (25%) within the hard technology sector. The semiconductor equipment and materials industry is a crucial area for domestic substitution, characterized by low domestic replacement rates and high ceilings for domestic substitution, benefiting from the semiconductor demand driven by the AI revolution, expansion, and technological restructuring and mergers [5] - The Huaxia Semiconductor Equipment ETF (562590) and its linked funds focus on semiconductor equipment (63%) and semiconductor materials (24%), emphasizing the upstream semiconductor sector [5]

Core Viewpoint - The company is actively monitoring and engaging with advanced packaging technology trends, particularly HBF, and is developing materials that can be applied in HBF manufacturing processes [1] Group 1: Company Developments - The company has stable mass production capabilities for functional wet electronic chemicals, solder balls, and EMC epoxy encapsulants, which are applicable in HBF manufacturing processes [1] - The company is currently in the verification and introduction phase for temporary bonding materials, LMC liquid encapsulation materials, and GMC particle encapsulation materials that are compatible with HBF process conditions [1] - The company is collaborating closely with relevant manufacturers to develop and test related materials, aiming to enhance the maturity and reliability of the HBF process [1] Group 2: Future Outlook - The company plans to leverage its existing collaboration foundation to continuously iterate and innovate its material technologies [1] - The goal is to establish a solid technical advantage and enhance market influence in advanced packaging fields such as HBF [1]

Core Viewpoint - Feikai Materials (300398) is actively involved in the semiconductor advanced packaging sector, focusing on the production of functional wet electronic chemicals, solder balls, and EMC epoxy encapsulants, which are applicable in HBF and HBM manufacturing processes [1] Group 1: Product Development - The company has achieved stable mass production of functional wet electronic chemicals, solder balls, and EMC epoxy encapsulants for HBF and HBM manufacturing processes [1] - The packaging processes for HBF and HBM involve wafer thinning, stacking, and encapsulation, for which the company has developed temporary bonding materials, LMC liquid encapsulation materials, and GMC particle encapsulation materials [1] - Currently, these materials are in the verification and introduction stage and have not yet generated scaled revenue [1] Group 2: Collaboration and Innovation - The company is closely collaborating with relevant manufacturers to develop and test related materials, aiming to enhance the maturity and reliability of HBF and HBM process technologies [1] - Future efforts will continue to focus on customer cutting-edge demands, driving the iteration and innovation of material technologies [1]

Core Viewpoint - The company is actively monitoring and engaging with advanced packaging technology trends, including HBF, and is developing materials suitable for HBF manufacturing processes [1] Group 1: Company Developments - The company has stable mass production capabilities for functional wet electronic chemicals, solder balls, and EMC epoxy encapsulants applicable to HBF manufacturing processes [1] - The HBF packaging process involves wafer thinning, stacking, and encapsulation, for which the company has developed temporary bonding materials, LMC liquid encapsulation materials, and GMC particle encapsulation materials [1] - Currently, these materials are in the verification and introduction stage and have not yet generated significant revenue [1] Group 2: Collaboration and Future Prospects - The company is closely collaborating with relevant manufacturers to develop and test related materials [1] - The goal of this collaboration is to enhance the maturity and reliability of the HBF process technology [1]

Investment Rating - The investment rating for the company is maintained at "Buy" with a target price of RMB 25.74 [1][4]. Core Insights - The company reported Q3 revenue of RMB 880 million, a year-over-year increase of 15% and a quarter-over-quarter increase of 15.47%. However, the net profit attributable to shareholders was RMB 74.06 million, down 14% year-over-year and down 24% quarter-over-quarter [1]. - The overall gross margin for the first three quarters of 2025 increased by 0.4 percentage points to 36.2%, driven by the favorable conditions in the semiconductor materials sector [2]. - The company has ongoing projects, including a significant breakthrough in semiconductor advanced packaging materials, which could disrupt the market dominated by foreign competitors [3]. Summary by Sections Financial Performance - For the first three quarters of 2025, the company achieved revenue of RMB 2.34 billion, a year-over-year increase of 8%, and a net profit of RMB 290 million, up 41% year-over-year [1]. - The company’s Q3 net profit was below expectations due to increased expenses and reduced asset disposal gains [1]. Industry Position - The semiconductor materials sector is experiencing a sustained uptrend, benefiting from increased demand in various applications, including consumer electronics and optical fiber materials [2]. - The company is advancing its projects, including a new liquid crystal materials mixing and R&D center, which is expected to enhance its capabilities in high-end liquid crystal materials [3]. Profit Forecast and Valuation - The profit forecast for the company is maintained at RMB 374 million, RMB 394 million, and RMB 437 million for the years 2025, 2026, and 2027, respectively, with corresponding EPS of RMB 0.66, RMB 0.70, and RMB 0.77 [4][10]. - The target price is set at RMB 25.74, reflecting a price-to-earnings ratio of 39x for 2025, considering the growth potential of ongoing projects [4].

Core Viewpoint - The company Feike Materials (300398) is currently focusing on expanding its market share in advanced packaging and high-end applications, following a strategy that prioritized stability in traditional markets [1] Group 1: Company Strategy - The company has historically concentrated on securing its position in mature application areas such as power devices, power discrete components, home appliances, and photovoltaics [1] - The company is now gradually releasing production capacity to target advanced packaging, IGBT, and third-generation semiconductor sectors [1] Group 2: Investment and Development - The company is investing in the construction of a dedicated high-performance EMC production line for advanced packaging [1] - The new production line aims to focus on high value-added products, with expectations of positive market feedback based on existing channel resources and customer base once operational [1]

Financial Performance - The company achieved a revenue of approximately 1.462 billion RMB in the first half of 2025, representing a year-on-year growth of 3.80% [2] - Net profit attributable to shareholders was about 217 million RMB, an increase of 80.45% compared to the same period last year [3] - The net profit excluding non-recurring gains and losses was approximately 176 million RMB, reflecting a growth of 40.47% year-on-year [3] Business Segments Performance - Semiconductor materials revenue grew by 1.14% year-on-year; excluding the impact of the divestiture of a subsidiary, the actual growth was about 11% [3] - Screen display materials revenue increased by 4.56% year-on-year, with liquid crystal business remaining stable and OLED protective films generating approximately 10 million RMB in revenue [3] - UV curing materials revenue rose by 6.89% year-on-year, with significant growth in optical fiber coatings [3] - Organic synthesis materials segment saw an overall revenue growth of approximately 9.90% year-on-year [3] Strategic Acquisitions - The company completed the acquisition of JNC Corporation's subsidiaries, contributing to revenue growth by including their income in the consolidated financial statements [2] Future Outlook - The company aims to deepen its focus on niche markets within the materials industry and enhance collaboration with industry partners for sustainable growth [4] - The semiconductor sector is expected to benefit from ongoing demand driven by artificial intelligence and consumer electronics [17] Cost Management and Profitability - The net profit excluding non-recurring items increased by 27.68% quarter-on-quarter, attributed to lower raw material prices and effective cost control measures [5][6] - The impact of recent price increases in photoinitiators on gross margins is expected to be minimal due to effective supply chain management [7] Product Development and Market Expansion - The company is actively pursuing new product registrations for TMO products in multiple regions, with strong sales performance anticipated for the year [8] - In advanced packaging, the company has made significant progress in developing key materials and plans to expand its product offerings [9][10] - The company is also working on automotive exterior coatings, with ongoing testing and certification processes [12] Market Dynamics - The global liquid crystal market has an annual demand of approximately 900 tons, with small and medium-sized liquid crystal demand accounting for about 200 tons, offering higher value and profitability [11] - The company is strategically positioning itself to capture market share in the high-value small-sized liquid crystal segment following the acquisition of JNC's liquid crystal business [11]

Core Viewpoint - Feikai Materials reported a steady growth in revenue and significant increase in net profit for the first half of 2025, indicating resilience in its business despite challenges in specific segments [1][2]. Group 1: Financial Performance - In H1 2025, the company achieved revenue of 1.46 billion yuan, a year-on-year increase of 3.8%, and a net profit attributable to shareholders of 217 million yuan, up 80% year-on-year (non-recurring profit increased by 40%) [1]. - For Q2 2025, the company recorded revenue of 760 million yuan, a 2.9% increase year-on-year, and a net profit of 97 million yuan, reflecting a 61% year-on-year growth [1]. - The company proposed an interim dividend of 0.04 yuan per share (before tax) [1]. Group 2: Segment Performance - The screen display materials segment generated revenue of 706 million yuan, up 4.6% year-on-year, although the gross margin decreased by 1.4 percentage points to 38.3% [2]. - The semiconductor materials segment achieved revenue of 331 million yuan, a 1.1% increase year-on-year, with a gross margin improvement of 1.27 percentage points to 37.94% [2]. - The ultraviolet curing materials segment reported revenue of 307 million yuan, a 6.7% increase year-on-year, but the gross margin fell by 1.38 percentage points to 36.71% [2]. - The sale of 100% equity in Dairui Technology contributed 55.68 million yuan to investment income, enhancing overall performance [2]. Group 3: Strategic Opportunities - The company is actively positioning itself in the integrated circuit sector, capitalizing on the demand for advanced packaging materials driven by AI and the advancement of process technologies [3]. - The EMC epoxy encapsulant is transitioning from mid-to-low-end applications to high-margin advanced packaging, with new high-performance GMC and LMC products under development [3]. - The OLED market continues to grow, and the company is leveraging its strengths in liquid crystal materials to strategically position itself for future opportunities [3]. - The development of new types of optical fibers, such as hollow-core fibers, is creating new demand for fiber coating materials, where the company holds a leading position [3]. Group 4: Profit Forecast and Valuation - The company has adjusted its revenue growth forecast upward, leading to an increase in net profit estimates for 2025-2027 to 374 million, 394 million, and 437 million yuan, respectively [4]. - The earnings per share (EPS) estimates have been revised to 0.66, 0.70, and 0.77 yuan for 2025-2027 [4]. - Based on comparable company valuations, a target price of 24.42 yuan has been set for 2025, reflecting a 37x price-to-earnings ratio, with a maintained "buy" rating [4].