WMCM封装技术

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2nm苹果芯片,四款齐发!
半导体芯闻· 2025-09-16 10:33
Core Viewpoint - TSMC is set to begin mass production of 2nm wafers in Q4 2023, with Apple securing nearly half of the initial capacity, primarily for the A20 and A20 Pro chips expected in the iPhone 18 series in 2026 [2]. Group 1 - Apple plans to produce four SoCs based on the 2nm process, utilizing a new packaging technology that represents a significant upgrade over current solutions [2]. - Qualcomm and MediaTek are also expected to launch their first 2nm chipsets in 2026, but Apple is likely to take the lead due to broader application across multiple products [2]. - The A20 and A20 Pro are anticipated to occupy a significant portion of TSMC's initial 2nm capacity, with Apple adopting advanced WMCM (Wafer-Level Multi-Chip Module) packaging technology [2]. Group 2 - The new 2nm chips will also include the M6 series processors for the new MacBook Pro, which may mark the transition from mini-LED to OLED screens [3]. - The successor to Apple Vision Pro is expected to be released in 2026, featuring the R2 co-processor built on TSMC's 2nm process [3]. - TSMC's 2nm technology is in high demand, with monthly wafer output projected to reach 100,000 by the end of 2026, despite the high cost of $30,000 per wafer [3].