Group 1 - Nvidia requires overseas customers to pay full prepayment for its H200 AI chips, with orders exceeding 2 million units, and TSMC has been asked to increase production [2] - Sinopec and China National Aviation Fuel are undergoing a restructuring approved by the State Council, aiming to reduce aviation fuel supply costs and enhance industry competitiveness [2] - Alibaba's Taobao Flash Sale has made significant progress, targeting to achieve absolute market share leadership by 2026, reflecting an upgrade in the company's competitive strategy in the e-commerce sector [2] - Nestlé has expanded its global recall of infant formula to at least 50 countries, including China, with regulatory bodies urging the company to manage the recall effectively [2] - TSMC maintains high capacity utilization for advanced processes, with continued demand for 3nm processes, and has paused new project initiations while encouraging clients to evaluate the adoption of 2nm processes [2] Group 2 - Zhongwei Company’s major shareholder plans to reduce its stake by up to 2%, which may exert short-term pressure on the company's stock price [4] - Huaxia Happiness is expected to report a loss in 2025, facing dual pressures from operational losses and arbitration involving its controlling shareholder [4] - Jiechuang Intelligent plans to procure IT equipment and components worth up to 4 billion yuan to enhance its cloud computing infrastructure [4] - Pritchard anticipates no large-scale orders for LCP film products in the brain-computer interface sector in the short term, advising the market to view the concept rationally [4] - Unisoc has initiated IPO counseling, benefiting from the AI-driven demand growth in storage chips, contributing to a wave of IPOs in the industry [4] Group 3 - Changxin Technology's application for an IPO on the Sci-Tech Innovation Board has been officially accepted, marking a significant step in its listing process [5] - Geely Automobile has obtained an L3-level autonomous driving road test license for its Zeekr 9X model, covering an area of 9,224 square kilometers [5] - HSBC's proposal to privatize Hang Seng Bank has been approved by the bank's court meeting and shareholder meeting, with the delisting expected on January 27, 2026 [5] - JD.com has established a "Chameleon Business Department" to oversee the development and commercialization of core AI products [5] - Anta Sports has made a takeover offer to acquire 29% of Puma from the Pinault family, although negotiations are reportedly stalled [5] Group 4 - Apple’s market value has dropped to third globally, with its annual shareholder meeting scheduled for February 24, and CEO Cook's total compensation for 2025 set at $74.3 million [6] - Alphabet has risen to second globally, driven by its AI business, and is enhancing collaboration with Siemens on industrial AI operating systems [6] - Meta Platforms is under scrutiny by China's Ministry of Commerce regarding its acquisition of the AI platform Manus, with delays in the release of AI smart glasses [6] - Microsoft has partnered with Shopify, PayPal, and Stripe to launch a retail AI Copilot Checkout feature, while restructuring its GitHub team to strengthen AI development [6] - Amazon has adjusted its target price and is requiring employees to provide proof of work efficiency, indicating potential personnel optimization [6] Group 5 - Samsung Electronics has regained the top share in the global DRAM market and is in talks with Qualcomm for 2nm chip foundry collaboration [9] - Toyota has announced the independence of Gazoo Racing as a high-performance sub-brand and launched new models in the European market [9] - LG Electronics' CEO presented a profit-oriented growth strategy at CES 2026, focusing on sustainable development [9] - Mitsubishi UFJ Financial Group plans to establish a full-service bank in the EU to expand overseas financing profits [9] - SK Hynix has lost its position as the global leader in the DRAM market and is focusing on domestic energy storage orders [9]

该媒体援引阿蒙在采访中透露的消息表示，这家智能手机与PC端芯片领军者正在与包括三星电子在内 的多家晶圆代工厂就采用最前沿的大规模2nm芯片制造工艺进行合同代工制造展开磋商；阿蒙表示，高 通面向PC、智能手机甚至AI数据中心的绝大多数新一代核心芯片设计工作已经完成，以便在不久的将 来实现大规模代工以及全面商业化。 相较N3E制程(等同于3nm先进制程)，N2约可实现同功耗下性能+10%到15%，或同性能下功耗缩减 25%~30%，以及晶体管密度+15%~20%(具体取决于芯片架构设计)。 另一芯片制造巨头英特尔，则跳过2nm整数制程，聚焦于1.8nm级别制程(即18A)。英特尔表示，18A已 经从"制程节点承诺"走到"终端产品发布与量产爬坡"，而14A仍在研发与路线图/客户导入阶段。英特尔 在CES2026重磅发布/展示了基于18A制程打造的Panther Lake(Core Ultra Series3)，并将其作为18A的"首 批产品平台"对外确认。18A的关键工艺特征，即GAA/RibbonFET+背面供电PowerVia，也作为该代产品 与制程卖点被媒体与英特尔官方材料同步强调，但是具体的生产良率指标仍未 ...

智通财经APP获悉，有媒体援引美国高通公司首席执行官克里斯蒂亚诺·阿蒙(Cristiano Amon)的话报道 称，高通(QCOM.US)很可能将使用三星电子的2nm级别芯片代工工艺来制造其下一代移动应用处理器。 高通过去几年在领先制程上"几乎完全依赖台积电"，而此次若把下一代移动AP的一部分先进节点订单 转向三星2nm，意味着高通在"最核心、最量大的手机SoC"上启动双供应链策略或者分散化，会在份额 与议价权层面对台积电形成轻微压力，但是对于台积电基本面增长前景无任何重大扰动。 台积电与英特尔的先进芯片制程布局 该媒体援引阿蒙在采访中透露的消息表示，这家智能手机与PC端芯片领军者正在与包括三星电子在内 的多家晶圆代工厂就采用最前沿的2nm芯片制造品工艺进行合同代工制造展开磋商;阿蒙表示，高通面 向OC、智能手机甚至数据中心的绝大多数新一代核心芯片设计工作已经完成，以便在不久的将来实现 大规模代工以及全面商业化。 有着"全球芯片代工之王"称号的台积电方面同样全面聚焦于2nm及以下这一最先进芯片制程产能，该公 司在其官网制程介绍中明确写到：2nm(N2)"已于2025年第四季度(4Q25)按计划开始量产"，并强 ...

台积电悄悄按下了「2nm」量产启动键，标志着先进芯片制程正式迈入2nm时代，拉开了新一轮半导体技术竞赛的序幕。 台积电2nm制程芯片已投入量产！ 没有盛大的产品发布，只是在官网的技术介绍页面上低调提了一句： 台积电2nm（N2）技术已按计划于2025年第四季度投入量产。 简单的一句话，背后是半导体技术物理极限的一次重大突破，标志着台积电2nm级制程进入量产阶段，全球科技迈入了2nm芯片的新时代。 据台积电官方介绍，其N2技术采用了第一代纳米片晶体管（nanosheet transistor）技术。 与已经非常优秀的N3E工艺相比，N2技术在性能与功耗方面实现了全节点的显著提升： 在同样功耗下，性能（速度）提升10%–15%。 在同样速度下，功耗降低25%–30%。 这意味着我们手中的智能手机、驱动AI世界的庞大算力、以及未来一切智能设备，都即将迎来一场性能革命。 位于台湾高雄的晶圆二十二厂（Fab 22）是台积电2nm制程的生产基地 此前台积电已多次表示N2芯片将于2025年第四季度按计划进入量产阶段，此举也意味着该项计划现已兑现。 由「鳍」到「片」，突破3nm极限 一切变革，都始于最微观的结构。 过去十年， ...

转自：天天 IC 加入"中国IC独角兽联盟"，请点击进入 是说芯语转载，欢迎关注分享 与目前的3nm芯片相比，台积电的2nm工艺在相同功耗下可实现高达15%的性能提升，或在相同 性能下降低25%至30%的功耗。该工艺还实现了约15%的晶体管密度提升，从而可以在相同的 物理空间内集成更多功能。 苹果首款2nm芯片很可能将应用于iPhone 18 Pro系列和首款可折叠iPhone，预计这些产品将于 2026年底发布。除了iPhone之外，苹果未来Mac电脑的M6系列芯片也可能采用台积电的2nm工 艺，尽管目前尚未有任何确切消息证实这一点。 三星正式发布了Exynos 2600，这是全球首款采用2nm制程工艺的移动系统芯片（SoC），基于 三星的Gate-All-Around（GAA）工艺制造。 这款10核ARM架构芯片旨在为即将推出的Galaxy S26系列等旗舰设备带来更佳的性能和能效。 这款芯片采用Arm最新内核，并支持全新指令集，可显著提升CPU速度和设备端AI性能。 三星声 称，CPU性能提升高达39%，NPU性能提升高达113%，从而能够处理更大规模、更高效的AI工 作负载。 其GPU基于最新的Xcl ...

（原标题：白春礼：国际竞争加速向基础前沿前移，企业创新角色正在升级） 南方财经21世纪经济报道记者郑青亭、实习生王馨梓 北京报道 面向"十五五"时期加快高水平科技自立自强、发展新质生产力的战略目标，白春礼提出四项核心建议： 第一，把企业基础研究纳入国家战略任务体系，形成稳定牵引和长期安排。围绕国家重大战略需求和未 来产业制高点，建立企业参与基础研究的任务清单和组织机制，支持领军企业牵头组建跨领域联合团队 进行长周期攻关。 12月18日，《财经》年会2026：预测与战略暨2025全球财富管理论坛在北京拉开帷幕。中国科学院院 士、中国科学院原院长白春礼在演讲中表示，随着科学与技术边界加速融合，产业迭代周期显著缩短， 技术路线快速演进，国际竞争明显前移，基础研究越来越成为产业竞争的"先手棋"，越来越成为国家竞 争力的"源头工程"。 白春礼指出，基础研究是国家竞争力的源头，而企业基础研究则决定了产业优势的长久性。当前，国际 竞争加速向基础前沿前移，科技创新与产业创新的边界日益模糊，企业在国家创新体系中的角色正从技 术的"应用者"升级为科学的"创造者"。 他援引历史与当代案例予以说明：从贝尔实验室的晶体管发明引爆信息产 ...

近日，光通信行业市场研究机构LightCounting在最新的报告中提到，2025年第三季度， Alphabet、亚马逊、Meta和微软的资本开支创下新纪录。甲骨文的资本开支环比下降6%，但同 比则大幅增长269%。Meta的资本开支相比2024年第三季度增长了一倍多。 这五家公司在2025年前九个月的总资本开支已超过3070亿美元，对供应链造成了前所未有的压 力。LightCounting估计，目前许多产品（包括光模块）的需求量已超过供应量两倍或更多。市场 对未来一年的预测将取决于供应商增加产能的能力。 如果您希望可以时常见面，欢迎标星收藏哦~ 台积电计划明年将2nm芯片的产能提高一倍，并且目前正在继续增加3nm芯片的产能，这帮助英 伟达在第三季度创下新的营收纪录：570亿美元，同比增长62%，环比增长22%，远超8月份给出 的业绩指引上限。其前四大客户贡献了总营收的61%，其中前两大客户合计占总营收的37%。 博通的营收创下180亿美元的纪录，同比增长28%，环比增长13%，显著高于9月份的业绩指引。 该公司人工智能相关的订单积压总额超过730亿美元，计划在未来18个月内交付。AMD报告的营 收为92亿美 ...

财政部明确明年发债支持国补 12月14日消息，财政部党组召开会议传达学习中央经济工作会议精神。会议提出，明年用好用足各类政府债券资金，发行超长期特别国债，持续支持"两 重"建设、"两新"工作。为了提振消费，中央财政首次在2024年发行了1500亿元超长期特别国债资金，对消费者汽车以旧换新、购买相关家电给予财政补 贴，也就是"国补"。由于这一政策有效激发消费活力，2025年中央财政发行了3000亿元超长期特别国债资金来支持"国补"。 目前"国补"针对的是商品消费，且商品范围不断拓宽。商务部数据显示，今年1—11月，消费品以旧换新带动相关商品销售额超2.5万亿元，惠及超3.6亿人 次。（第一财经） ｜点评｜"国补"政策在过去两年内对提振国内消费起到了积极的效果，也因此造成国内消费市场修复的不均衡。今年会议定调"保持必要的债务总规模"， 预计明年国债的发行规模或将与今年基本相当，"国补"政策的总资金大概率变化也不大，主要以优化资金下发方式为主。冰箱、电视等耐用消费品经过两 年补贴，潜在需求得到大量释放，明年"国补"政策的覆盖面有望得到继续拓宽。 今年下半年，多地"国补"政策在短暂暂停后，拿出了新的补贴发放优化政策。 ...

Core Viewpoint - TSMC's investment plans in the U.S. have become increasingly complex, with U.S. Secretary of Commerce Gina Raimondo stating that TSMC's previous commitments are insufficient, now requiring a minimum investment of $200 billion and the creation of 30,000 jobs [1][4]. Group 1: Investment and Financial Implications - The starting point of this negotiation was the CHIPS Act signed during the Biden administration, which provided TSMC with $6 billion in subsidies, but only resulted in an initial investment of approximately $60 billion for factory construction, which Raimondo deemed inadequate [4]. - TSMC has since raised its planned investment to $165 billion, but U.S. expectations have now increased to $200 billion, which is a reduced target from earlier internal expectations exceeding $300 billion [4]. - TSMC's U.S. subsidiary reported a significant drop in profits, with earnings of only NT$41 million in Q3 2025, down 99% from NT$4.223 billion in Q2, reflecting the financial pressures and challenges faced in the U.S. market [6]. Group 2: Technological and Operational Challenges - TSMC is facing multiple challenges in the U.S., including high costs, talent shortages, and cultural conflicts, which have directly impacted its financial performance [5]. - The advanced process and packaging technologies, previously considered core assets, are gradually being transferred to the U.S., with TSMC's Arizona facility already producing 4nm chips and plans for 3nm and 2nm processes in the future [4].

Core Viewpoint - The global semiconductor industry is engaged in a strategic competition centered around the establishment of 2nm wafer fabs, which are seen as critical for AI-era computing sovereignty [1][20]. Group 1: TSMC's Expansion Plans - TSMC plans to increase its 2nm fab count from seven to ten, with an estimated cost of approximately NT$300 billion (US$80-100 billion) per fab, totaling around NT$900 billion for the additional three fabs [2][3]. - TSMC's strategy focuses on serving top-tier clients in AI GPU, high-end CPUs, and mobile SoCs, ensuring long-term capacity even amid macroeconomic fluctuations [2][3]. - The company emphasizes that the most advanced nodes must remain in Taiwan, with overseas fabs primarily serving political and customer relationship needs [3][4]. Group 2: Intel's 18A Technology - Intel's 18A process technology is positioned to compete with TSMC's 2nm, with recent reports indicating a steady improvement in yield rates [6][8]. - The U.S. government has become Intel's largest single shareholder, converting subsidies into equity, which strengthens Intel's capital structure [8][9]. - Intel's success in the 2nm race will depend not only on the 18A technology but also on its ability to establish itself as a true foundry company [9]. Group 3: Samsung's Progress - Samsung's 2nm process yield has improved to 55-60%, with plans to increase monthly production from 8,000 wafers in 2024 to 21,000 by the end of 2025 [10][12]. - The company secured a significant contract with Tesla for AI6 chip production, valued at US$16.5 billion over eight years, which is crucial for enhancing Samsung's position in the U.S. foundry market [11][12]. - Samsung aims to regain profitability in its foundry business within two years while targeting a 20% market share [12][13]. Group 4: Japan's Rapidus Initiative - Rapidus, a smaller player, is focused on establishing domestic 2nm production capacity with government support, aiming for mass production by the second half of the 2027 fiscal year [15][17]. - The company plans to build a second factory in Hokkaido, with significant investment expected from the Japanese government and private sector [17][18]. - Rapidus's approach involves a unique single-wafer processing method, which may lead to higher capital expenditures but aims for better yield control [18]. Group 5: Market Dynamics and Geopolitical Implications - The 2nm node is viewed as a critical infrastructure for AI, with significant implications for capital expenditure and industry dynamics [20][21]. - The construction of 2nm fabs is heavily influenced by government policies and partnerships with major clients, making it a tool for national industrial policy [21][22]. - The concentration of 2nm production capacity in Taiwan and a few allied nations raises concerns about supply chain resilience and geopolitical risks [22]. Group 6: Potential Beneficiaries - Semiconductor equipment manufacturers are expected to benefit significantly from the construction of 2nm fabs, as these facilities require advanced equipment for production [24]. - Major clients like NVIDIA, Apple, and AMD will gain more bargaining power with multiple 2nm suppliers, but risks remain if AI demand declines or yields do not meet expectations [25][26].