Core Viewpoint - The company plans to invest in a high-performance HDI printed circuit board expansion and upgrade project to enhance production capacity and technology level, aiming to meet strategic customer demands and strengthen market competitiveness [1][2] Group 1: Project Details - The total investment for the project is estimated at 1.01 billion yuan (excluding tax) [1] - The project will take 1.5 years starting from 2026, involving the optimization of existing facilities and the purchase of advanced production and testing equipment [1] - The project is expected to add an annual production capacity of 240,000 square meters of high-performance HDI printed circuit boards [1] Group 2: Financial Projections - The funding sources for the project include 720 million yuan from bank loans and the remainder from the company's own funds [1] - The project is expected to reach 50% of its designed capacity (10,000 square meters per month) by December 2026 and 100% (20,000 square meters per month) by June 2027 [1] - Once fully operational, the project is projected to generate an additional annual sales revenue of 808 million yuan and an additional profit of 112 million yuan, with a post-tax static investment payback period of 7.29 years [1] Group 3: Strategic Implications - The project will strengthen the company's collaboration with strategic customers and enhance its high-end HDI technology and product competitiveness [2] - The company aims to improve its responsiveness to market demands and strengthen its competitive advantage in international markets [2] Group 4: Market Context - The company is focusing on expanding its presence in high-performance HDI markets and exploring emerging consumer electronics sectors such as AI smartphones, smart wearables, health monitoring, smart home devices, and robotics [2] - The company reported a revenue of 4.674 billion yuan for the first three quarters of 2025, a year-on-year increase of 10.91%, with a net profit of 178 million yuan, up 20.93% [2]

Group 1 - The company plans to invest 1.01 billion yuan in a high-performance HDI printed circuit board expansion and upgrade project to enhance production capacity and technology level to meet strategic customer demands and strengthen market competitiveness [2] - The project will involve optimizing existing facilities and purchasing advanced production and testing equipment, aiming to add an annual production capacity of 240,000 square meters of high-performance HDI printed circuit boards [2] - Funding for the project will come from a bank loan of 720 million yuan and the remainder from the company's own funds, with expected production capacity reaching 50% by December 2026 and 100% by June 2027 [2] Group 2 - The project is expected to generate an additional annual sales revenue of 808 million yuan and a profit of 112 million yuan once fully operational, with a payback period of 7.29 years [2] - The company aims to strengthen its collaboration with strategic customers and enhance its competitive edge in high-end HDI technology and products, improving responsiveness to market demands [3] - The company reported a revenue of 4.674 billion yuan for the first three quarters of 2025, a year-on-year increase of 10.91%, with a net profit of 178 million yuan, up 20.93% [3]

格隆汇12月22日丨金禄电子(301282.SZ)在投资者互动平台表示，公司PCB有应用于商业航天领域。 ...

智通财经APP讯，超声电子(000823.SZ)发布公告，为紧抓人工智能技术驱动下的新一代移动终端、汽车 电子、高端消费电子等产业的发展机遇，公司控股子公司汕头超声印制板(三厂)有限公司拟投资高性能 HDI印制板扩产升级技术改造项目，旨在快速提升高性能HDI印制板的生产能力与技术水平，进而满足 战略客户供货需求，增强公司整体市场竞争力。项目总投资额预计为10.08亿元。 ...

该项目总投资额预计为10.08亿元(不含税)，自2026年起的1.5年时间内，对高性能HDI印制板生产线进行 扩产升级，建成后新增年产24万平方米的高性能HDI印制板的生产能力。 人民财讯12月22日电，超声电子（000823）12月22日公告，公司控股子公司汕头超声印制板(三厂)有限 公司拟投资高性能HDI印制板扩产升级技术改造项目，旨在快速提升高性能HDI印制板的生产能力与技 术水平。 ...

超声电子12月22日公告称，公司控股子公司汕头超声印制板（三厂）有限公司拟投资高性能HDI印制板 扩产升级技术改造项目。项目总投资额预计为10.08亿元（不含税），自2026年起的1.5年时间内，通过 改造优化现有厂房等建筑预留的部分场地，购置先进的生产设备及检测设备，对高性能HDI印制板生产 线进行扩产升级，建成后新增年产24万平方米的高性能HDI印制板的生产能力。 ...

每经AI快讯，12月22日，超声电子（000823）(000823.SZ)公告称，公司控股子公司汕头超声印制板(三 厂)有限公司拟投资高性能HDI印制板扩产升级技术改造项目，总投资额预计为10.08亿元(不含税)，项 目建成后，预计新增年产能24万平方米，达产年(第三年)新增年销售收入80,778万元，新增利润总额 11,226万元。资金来源为银行贷款72000万元、其余自有资金投入。预计2026年12月达到设计产能的 50%，即10000平方米/月；预计2027年6月达到项目设计产能的100%，即20000平方米/月。 ...

细分方向来看，半导体设备龙头方面，拓荆科技涨超6%，盛美上海涨逾5%；PCB（印制电路板）龙头方面，东山精密涨超6%，深南电路涨逾5%，生益科 技、鹏鼎控股、沪电股份携手涨超4%。 图：电子ETF标的指数涨幅前10大成份股 | 序号 名称 | | 涨跌幅 ▼ 两日图 | 申万一级行业 | 申万二级行业 | 申万三级行业 | 总市值 | 成交额 | | --- | --- | --- | --- | --- | --- | --- | --- | | 1 | 拓荆科技 | 6.20% wit | 电子 | 未曾体 | 未曾体设备 | 978 Z | 12.25亿 | | 2 | 东山精密 | 6.18% von | 电子 | 元件 | 印制电路板 | 1471亿 | 22.14亿 | | 3 | 华工科技 | 5.44% - | 机械设备 | 自动化设备 | ■ 激光设备 | 795亿 | 27.91亿 | | 4 | 奥兰米德 | 5.25% - | 电子 | 半导体 | 半导体设备 | 84417 | 4.76 Z | | ર | 深南电路 | 5.16% v | 电子 | 元件 | 印制电路板 | 149 ...

今日（12月22日）科技成长方向大反攻，创业板指、科创50纷纷涨超2%，覆盖创业板+科创板高成长龙 头的硬科技宽基——双创龙头ETF（588330）场内价格一度涨近3%，现涨2.85%，盘中收复10日均 线。 细分方向来看，光模块三巨头方面，中际旭创涨超8%，新易盛涨逾6%再创新高，天孚通信涨超4%；半 导体设备方面，拓荆科技涨超9%，盛美上海涨逾6%。此外，光伏龙头晶盛机电涨超8%，印制电路板 （PCB）龙头胜宏科技涨逾3%。 图：双创龙头ETF标的指数涨幅前10大成份股 消息面上，上海交通大学科研人员近日在新一代光芯片领域取得突破，首次实现了支持大规模语义媒体 生成模型的全光计算芯片。相关成果12月19日发表于《科学》杂志。 资料显示，光芯片是光模块的核心上游组件，承担光电/电光转换的核心功能，其性能直接决定光模块 的速率、功耗与稳定性。中原证券表示，光芯片在不同速率光模块的成本占比通常在30%-70%，而越高 速、越高端的光模块，光芯片的成本占比就越高。 1、跨市场多元配置，百分百战略新兴：标的指数从科创板和创业板中选取市值较大的50只战略新兴产 业上市公司作为指数样本，汇集高成长龙头，囊括新能源、光伏 ...

Group 1 - The core viewpoint of the news is that Hongxin Electronics has shown a significant increase in stock price and financial performance, indicating potential growth in the electronic components industry [1][2][3] Group 2 - As of December 22, Hongxin Electronics' stock price increased by 2.02% to 27.76 CNY per share, with a total market capitalization of 13.396 billion CNY [1] - The company has experienced a year-to-date stock price increase of 22.51%, with a recent decline of 0.79% over the last five trading days [1] - For the period from January to September 2025, Hongxin Electronics achieved a revenue of 5.55 billion CNY, representing a year-on-year growth of 24.75%, and a net profit of 90.51 million CNY, up 65.47% year-on-year [2] Group 3 - The company has a diverse revenue structure, with printed circuit boards accounting for 48.49%, computing-related businesses 42.41%, backlight modules 8.01%, and other revenues 1.09% [1] - Hongxin Electronics has been listed since May 23, 2017, and is primarily engaged in the research, production, and sales of flexible printed circuit boards (FPC), rigid-flex boards, and backlight modules [1] Group 4 - As of September 30, 2025, the number of shareholders increased to 79,100, with an average of 5,927 circulating shares per person, a decrease of 5.80% from the previous period [2][3] - The company has distributed a total of 126 million CNY in dividends since its A-share listing, with no dividends paid in the last three years [3]