Core Performance - The company reported a significant increase in revenue and net profit for Q3 2025, achieving operating income of 6.301 billion yuan, a year-on-year growth of 33.25%, and a net profit of 966 million yuan, which represents a substantial increase of 92.87% [2] - The growth in performance is attributed to the company's ability to capitalize on opportunities in AI computing power upgrades, structural growth in the storage market, and increased demand for automotive electronics [2] Business Development - The PCB business focuses on communication equipment, with key investments in data centers (including servers) and automotive electronics, showing consistent revenue growth in these areas [3] - The packaging substrate business has shown remarkable performance, with revenue from storage packaging substrates experiencing significant growth due to increased demand [3] Capacity and Projects - The company maintains a high overall capacity utilization rate, with PCB and packaging substrate businesses showing strong performance [4] - New factories, including the Nantong Phase IV and Thailand facilities, are expected to enhance PCB production capacity, with the Thailand factory already in trial production [4] Cost Management - The company faces some cost pressures due to rising prices of raw materials such as gold salts and copper, but it is actively managing these through supply chain optimization and product structure adjustments [5] Compliance - The company confirmed that during the investor meeting, it adhered to information disclosure regulations and did not disclose any undisclosed significant information [6]

Group 1: Financial Performance - In Q3 2025, the company achieved a revenue of 6.301 billion CNY, representing a year-on-year growth of 33.25% [1] - The net profit attributable to shareholders reached 966 million CNY, with a year-on-year increase of 92.87% [1] - The non-recurring net profit accumulated to 916 million CNY, showing a year-on-year growth of 94.16% [1] Group 2: Gross Margin Improvement - The overall gross margin improved in Q3 2025, primarily due to increased demand for storage packaging substrates and enhanced capacity utilization [2] - The revenue scale and gross margin of packaging substrates showed significant improvement, aided by the steady ramp-up of the Guangzhou factory [2] Group 3: Business Expansion in PCB Sector - The PCB business focuses on communication equipment, with key expansions in data centers (including servers) and automotive electronics [3] - Revenue from data centers and wired communication businesses continued to grow, maintaining a consistent share across various sectors compared to the first half of the year [3] Group 4: Packaging Substrate Business Growth - The packaging substrate business includes a wide range of products, with significant revenue growth in storage packaging substrates in Q3 2025 [4] - All downstream product demands showed growth, particularly in storage packaging substrates [4] Group 5: Capacity Utilization - The overall capacity utilization remained high in Q3 2025, with a noticeable increase in the utilization rate of packaging substrate business due to rising demand [5] Group 6: New Factory Developments - New factories include the Nantong Phase IV and Thailand projects, with the Thailand factory currently in trial production and Nantong Phase IV expected to commence in Q4 2025 [6] - These new facilities will enhance PCB production capabilities, particularly in high-layer and HDI technologies [6] Group 7: Raw Material Price Changes - Key raw materials such as copper foil and gold salt saw price increases in Q3 2025 due to fluctuations in commodity prices [7] - The company will continue to monitor international commodity price changes and maintain communication with suppliers and customers [7] Group 8: Land Planning in Wuxi - The new land in Wuxi is designated for PCB-related products, with investments planned in phases based on business development and market conditions [8]

Investment Rating - The investment rating for the company is "Buy" and is maintained [6]. Core Insights - The company reported significant year-on-year growth in performance, with a revenue increase of 28.39% to 16.754 billion yuan and a net profit increase of 56.30% to 2.326 billion yuan for the first three quarters of 2025. The gross margin and net margin were 28.20% and 13.90%, respectively [2][4]. - In Q3 2025, the company achieved a revenue of 6.301 billion yuan, reflecting a year-on-year growth of 33.25% and a quarter-on-quarter growth of 11.11%. The net profit for the quarter was 966 million yuan, showing a year-on-year increase of 92.87% and a quarter-on-quarter increase of 11.20%. The gross margin and net margin for the quarter were 31.39% and 15.35%, respectively [2][4]. - The company benefits from the demand for AI computing upgrades, structural growth in the storage market, and increased demand for automotive electronics. The demand for AI accelerator cards, switches, optical modules, servers, and related products continues to rise, contributing to revenue growth [9]. - The company emphasizes a long-term strategy of technological leadership, with R&D investment accounting for 7.36% of revenue in Q3 2025. Ongoing projects include advancements in next-generation communication, data center, and automotive electronics PCB technologies [9]. - The company is expected to achieve net profits of 3.467 billion yuan, 5.056 billion yuan, and 7.025 billion yuan for the years 2025, 2026, and 2027, respectively, with corresponding PE ratios of 41.24, 28.28, and 20.36 [9]. Summary by Sections Financial Performance - For the first three quarters of 2025, the company achieved total revenue of 16.754 billion yuan and a net profit of 2.326 billion yuan, with respective year-on-year growth rates of 28.39% and 56.30% [2][4]. - In Q3 2025, the company reported revenue of 6.301 billion yuan and a net profit of 966 million yuan, with year-on-year growth rates of 33.25% and 92.87% [2][4]. Market Position and Strategy - The company is recognized as a leading player in the PCB industry in China and a pioneer in the packaging substrate sector. The demand for products in the communication and data center sectors is expected to drive future growth [9]. - The company maintains a focus on technological innovation and R&D, with significant investments aimed at enhancing its product offerings and market competitiveness [9].

Financial Performance - In Q3 2025, the company achieved a revenue of 6.301 billion CNY, a year-on-year increase of 33.25% [1] - The net profit attributable to shareholders reached 966 million CNY, reflecting a significant year-on-year growth of 92.87% [1] Gross Margin Improvement - The overall gross margin showed improvement in Q3 2025, driven by increased demand for storage packaging substrates and enhanced production capacity utilization [2] - The revenue from PCB data center and wired communication businesses continued to grow, contributing to a slight increase in gross margin [2] Business Expansion - The PCB business focuses on communication equipment, with key expansions in data centers (including servers) and automotive electronics [3] - The packaging substrate business saw a revenue increase in Q3 2025, with notable growth in storage packaging substrates [4] Capacity Utilization - The overall capacity utilization remained high in Q3 2025, with significant improvements in the packaging substrate business due to increased demand [6] Raw Material Price Changes - Key raw materials such as copper and gold salts experienced price increases in Q3 2025 due to fluctuations in commodity prices [7] R&D Investment - R&D investment in Q3 2025 amounted to approximately 464 million CNY, accounting for 7.37% of the company's revenue [8] New Projects - The company is developing new factories, including the Nantong Phase IV and Thailand projects, with the Thailand factory currently in trial production [5]

Core Insights - The company reported strong financial performance for Q3 2025, with total revenue of 16.754 billion and a net profit of 2.326 billion, reflecting year-on-year growth of 28.39% and 56.30% respectively [1] - In Q3 alone, the company achieved revenue of 6.301 billion, a 33.25% increase year-on-year, and a net profit of 966 million, marking a significant 92.87% growth [1] - The management attributed the performance to opportunities in AI computing power upgrades, structural growth in the storage market, and increased demand for automotive electronics [1] Financial Performance - Total revenue for the first three quarters reached 16.754 billion, with a year-on-year growth of 28.39% [1] - Net profit for the same period was 2.326 billion, showing a year-on-year increase of 56.30% [1] - Q3 revenue was 6.301 billion, up 33.25% year-on-year, while net profit was 966 million, reflecting a 92.87% increase [1] Market Opportunities - The company is capitalizing on the demand for AI accelerator cards, switches, optical modules, servers, and related products, which have seen sustained growth [1] - There is a structural growth opportunity in storage packaging substrate products, leading to increased order revenue [1] - The company is enhancing its market development efforts and optimizing product structure, which contributes to improved profit margins [1] Industry Context - Analysts note that the company's growth is supported by industry trends such as AI computing power upgrades and accelerated global data center construction [2] - Stable orders from key telecommunications equipment manufacturers like Huawei and ZTE provide strong certainty for the company's business growth [2] - The company's "3-In-One" business layout, which focuses on technology and customer synergy, positions it well to benefit from the accelerated development of AI in China [2]

Financial Performance - In Q3 2025, the company achieved a revenue of CNY 6.301 billion, representing a year-on-year growth of 33.25% [2] - The net profit attributable to shareholders reached CNY 966 million, with a year-on-year increase of 92.87% [2] - The net profit excluding non-recurring items totaled CNY 916 million, reflecting a growth of 94.16% year-on-year [2] Business Growth Drivers - The growth was primarily driven by opportunities in AI computing power upgrades, structural growth in the storage market, and the acceleration of automotive electronics [2] - Increased demand for AI chips, servers, and related products contributed to the rise in main business revenue [2] Gross Margin and Cost Management - The overall gross margin showed improvement in Q3 2025, aided by increased demand for storage packaging substrates and enhanced production capacity utilization [2] - The company’s PCB business maintained a high capacity utilization rate, with significant improvements in the packaging substrate business due to rising demand [5] Product Development and R&D Investment - R&D investment in Q3 2025 amounted to approximately CNY 464 million, accounting for 7.37% of total revenue [7] - The company is advancing various R&D projects, including next-generation communication and data center-related PCB technologies [7] Capacity Expansion and New Projects - The company is constructing new factories, including the Nantong Phase IV and a facility in Thailand, which are expected to enhance PCB production capacity [4] - The Thailand factory has commenced trial production, while Nantong Phase IV is set to start operations in Q4 2025 [4] Raw Material Price Trends - In Q3 2025, prices for key raw materials such as gold salt and copper increased due to fluctuations in commodity prices [6] - The company is actively monitoring international commodity price changes and maintaining communication with suppliers and customers [6] Packaging Substrate Business - The packaging substrate business saw a sequential revenue increase in Q3 2025, with notable growth in storage packaging substrates [3] - The company’s FC-BGA packaging substrates have achieved mass production capabilities for products with 20 layers and below [9]

Investment Rating - The report maintains an "Outperform" rating for the company [2] Core Views - The company reported a slight decline in Q3 performance but remains optimistic about the accelerated release of high-frequency and high-speed resins [1][7] - The company is increasing R&D investments, particularly in high-frequency and high-speed resin products, which are expected to benefit from the growing demand in AI computing [7] - The financial outlook has been slightly adjusted, with projected net profits for 2025-2027 revised to 4.00 billion, 5.99 billion, and 7.85 billion respectively [7] Financial Data and Earnings Forecast - Total revenue for Q3 2025 was 3.803 billion, a year-on-year increase of 17% [7] - The net profit attributable to the parent company for Q3 2025 was 283 million, reflecting a year-on-year growth of 20% [7] - The company expects total revenue to reach 5.110 billion in 2025, with a year-on-year growth rate of 14.3% [6] - The gross profit margin for Q3 2025 was 15.56%, with a slight increase year-on-year but a decrease quarter-on-quarter [7] - The projected earnings per share for 2025 is 0.39 yuan, with a PE ratio of 48 [6][7] Segment Performance - In the electronic materials segment, high-frequency and high-speed resins saw a sales volume increase of 50% year-on-year, driven by demand from AI applications [7] - The new energy materials segment reported a sales volume of 15,300 tons in Q3 2025, with revenue of 3.35 billion, although prices faced downward pressure [7] - Optical film materials achieved a sales volume of 32,800 tons, with revenue of 3.75 billion, indicating stable growth [7]

Financial Performance - In the first half of 2025, the company achieved total revenue of 10.453 billion CNY, a year-on-year increase of 25.63% [1] - The net profit attributable to shareholders was 1.360 billion CNY, reflecting a growth of 37.75% compared to the previous year [1] - PCB business revenue reached 6.274 billion CNY, up 29.21%, with a gross margin of 34.42%, an increase of 3.05 percentage points [1] - The packaging substrate business generated 1.740 billion CNY in revenue, a 9.03% increase, but with a gross margin of 15.15%, down 10.31 percentage points [1] - The electronic assembly business reported revenue of 1.478 billion CNY, a growth of 22.06%, with a gross margin of 14.98%, up 0.34 percentage points [1] PCB Business Applications - The PCB business focuses on mid-to-high-end products, primarily serving communication devices, data centers, and automotive electronics [2] - Significant revenue growth in the first half of 2025 was driven by demand in communication, data center, and automotive sectors, particularly for 400G and above high-speed switches and optical modules [2] - The increase in PCB business gross margin was attributed to higher revenue scale and improved factory capacity utilization [2] Production Capacity Utilization - The overall capacity utilization for PCB business remained high due to sustained demand in computing and automotive electronics [3] - The packaging substrate business saw a notable improvement in capacity utilization year-on-year, driven by increased domestic storage market demand [3] Technology and Project Development - The company has achieved mass production capability for FC-BGA packaging substrates with up to 20 layers, while R&D for 22-26 layer products is progressing on schedule [4] - The Guangzhou packaging substrate project is advancing steadily, with the first phase connected in Q4 2023 and ongoing improvements in production capacity [4] Electronic Assembly Business Strategy - The electronic assembly business is positioned as a downstream segment of PCB manufacturing, focusing on communication, data centers, medical, and automotive electronics [5] - Revenue from electronic assembly was 2.823 billion CNY in 2024 and 1.478 billion CNY in the first half of 2025, accounting for 15.76% and 14.14% of total revenue, respectively [5] Raw Material Price Trends - Key raw materials include copper-clad laminates, semi-cured sheets, copper foil, gold salt, and inks, with some prices continuing to rise due to commodity market fluctuations [6] - The company is actively monitoring international commodity price changes and maintaining communication with suppliers and customers [6]

Group 1: Financial Performance - In the first half of 2025, the company achieved total revenue of 10.453 billion CNY, a year-on-year increase of 25.63% [1] - The net profit attributable to shareholders was 1.360 billion CNY, reflecting a growth of 37.75% compared to the previous year [1] - The PCB business generated a revenue of 6.274 billion CNY, up 29.21%, with a gross margin of 34.42%, an increase of 3.05 percentage points [3] - The packaging substrate business reported a revenue of 1.740 billion CNY, a growth of 9.03%, but with a gross margin of 15.15%, down 10.31 percentage points [4] - The electronic assembly business achieved a revenue of 1.478 billion CNY, a year-on-year increase of 22.06%, with a gross margin of 14.98%, up 0.34 percentage points [2] Group 2: Market Trends and Opportunities - The PCB business is benefiting from the demand for AI acceleration cards, servers, and high-speed switches, with significant growth in the data center sector [3] - The packaging substrate business is capitalizing on the recovery of the domestic storage market, leading to increased orders [4] - The company is focusing on the trends of AI computing upgrades, storage market recovery, and the deepening of automotive electrification [1] Group 3: Production Capacity and Utilization - The overall capacity utilization rate for the PCB business is at a relatively high level due to sustained demand in the computing and automotive electronics markets [8] - The packaging substrate business has seen a significant improvement in capacity utilization due to the increased demand in the domestic storage market [8] - The company is expanding its PCB production capacity through technological upgrades and new projects in Nantong and Thailand [9] Group 4: Product Applications and Innovations - The PCB products are primarily applied in communication devices, data centers, and automotive electronics, with a focus on high-end applications [5] - The company has developed capabilities in HDI technology, which is crucial for high-density wiring in PCB products [12] - The electronic assembly business is positioned as a downstream segment of PCB manufacturing, focusing on providing integrated solutions for various industries [12]

Core Viewpoint - The report from Zheshang Securities highlights that Shenzhen South Circuit has effectively seized three major growth opportunities: AI computing power upgrades, recovery in the storage market, and the electrification and intelligence of automobiles, resulting in significant revenue and profit growth in the first half of the year [1] Financial Performance - Revenue reached 10.45 billion yuan, representing a year-over-year increase of 26% [1] - Net profit attributable to the parent company was 1.36 billion yuan, with a year-over-year growth of 38% [1] Market Opportunities - There is a rapid increase in global demand for AI-related products such as GPU/ASIC, servers, 800G switches, and optical modules [1] - The storage market is showing signs of recovery, which is beneficial for the company [1] Strategic Positioning - The company is positioned as a leading domestic PCB manufacturer, a major player in BT substrates, and a frontrunner in ABF substrates [1] - The company is actively promoting the construction of relevant production capacity projects and technological research and development layouts [1] Future Outlook - The company is expected to continue benefiting from the industrial upgrade opportunities brought about by the current wave of AI innovation [1] - The investment rating is maintained at "Buy" [1]