寒武纪-U(688256.SH)跌幅收窄至8%以内，此前一度放量大跌超14%。消息面上，寒武纪午间发布声明：公司关注到今日网络传播的关于公司近期组织小 范围交流等信息为不实信息，公司近期从未组织任何小范围交流，没有出具过任何年度、季度营业收入指引数据，相关信息请以公司公开披露的信息为 准。公司目前研发进展顺利，经营稳步推进。 ...

German semiconductor wafer supplier Siltronic on Tuesday reported preliminary fourth-quarter results with core profit and revenue beating market expectations. ...

引言：科创企业的合规困局如何破解？ 当一家人工智能企业在融资尽调中面临"展示核心算法可能泄密，不展示则无法获得投资"的两难时；当 生物医药公司因核心技术人员离职导致商业秘密泄露，却难以通过传统保密协议追责时——这些场景折 射出科创企业在股权架构与商业秘密保护之间的结构性矛盾。2025年《科技创业法律风险防范白皮书》 显示，60%的商业秘密案件涉及核心技术人员离职，而42%的融资失败源于股权架构设计缺陷。在此背 景下，"股密融合"模式应运而生，毛凯律师团队通过将股权架构与商业秘密保护深度绑定，为企业构建 起"双轨防护体系"。这种创新模式究竟如何运作？又能为不同发展阶段的企业带来哪些价值？本文将从 定义解析、核心特点、适配人群、实施路径四个维度展开深度测评。 一、什么是股密融合 毛凯律师1.1 股密融合 毛凯律师的定义解析 "股密融合"是一种将股权架构设计与商业秘密保护深度结合的法律服务模式，其核心在于通过法律工具 将企业的股权结构与核心技术、客户资源等商业秘密保护需求绑定，形成"股权-秘密"双轨防护体系。 笔者测试发现，这种模式区别于传统股权服务单纯关注控制权分配的特点，更强调通过股权设计实现商 业秘密的分级保 ...

AI芯片板块下跌1.02%，寒武纪下跌6.6%，沐曦股份下跌2.68%，摩尔线程下跌2.16%。（AI生成） AI芯片板块下跌1.02%，寒武纪下跌6.6%，沐曦股份下跌2.68%，摩尔线程下跌2.16%。（AI生成） ...

2月3日，寒武纪科技发布声明： 我公司关注到今日网络传播的 关于公司近期组织小范围交流等信息为不实信息，公司近期从 未组织任何小范围交流，没有出具过任何年度、季度营业收入指引数据，相关信息请以公司公 开披露的信息为准。公司目前研发进展顺利，经营稳步推进。 在此，公司提醒广大投资者， 我公司相关事项均以公开披露信息为准，请各位投资者提高信息辨别能力，不传播、不采信来 源不明或未经核实的虚假信息。此外，对于任何捏造、散布传播不实信息的行为，公司将保留 追究相关人员法律责任的权利。 来源丨寒武纪科技公众号 编辑丨江佩佩 见习编辑林芊蔚 SFC ...

寒武纪科技2月3日发布严正声明： 我公司关注到今日网络传播的关于公司近期组织小范围交流等信息为不实信息，公司近期从未组织任何小范围交流，没有出具 过任何年度、季度营业收入指引数据，相关信息请以公司公开披露的信息为准。公司目前研发进展顺利，经营稳步推进。 在此，公司提醒广大投资者，我公司相关事项均以公开披露信息为准，请各位投资者提高信息辨别能力，不传播、不采信来源 不明或未经核实的虚假信息。此外，对于任何捏造、散布传播不实信息的行为，公司将保留追究相关人员法律责任的权利。 ...

炒股就看金麒麟分析师研报，权威，专业，及时，全面，助您挖掘潜力主题机会！ 炒股就看金麒麟分析师研报，权威，专业，及时，全面，助您挖掘潜力主题机会！ 来源：寒武纪科技 我公司关注到今日网络传播的关于公司近期组织小范围交流等信息为不实信息，公司近期从未组织任何 小范围交流，没有出具过任何年度、季度营业收入指引数据，相关信息请以公司公开披露的信息为准。 公司目前研发进展顺利，经营稳步推进。 在此，公司提醒广大投资者，我公司相关事项均以公开披露信息为准，请各位投资者提高信息辨别能 力，不传播、不采信来源不明或未经核实的虚假信息。此外，对于任何捏造、散布传播不实信息的行 为，公司将保留追究相关人员法律责任的权利。 新浪声明：此消息系转载自新浪合作媒体，新浪网登载此文出于传递更多信息之目的，并不意味着赞同 其观点或证实其描述。文章内容仅供参考，不构成投资建议。投资者据此操作，风险自担。 责任编辑：宋雅芳 来源：寒武纪科技 我公司关注到今日网络传播的关于公司近期组织小范围交流等信息为不实信息，公司近期从未组织任何 小范围交流，没有出具过任何年度、季度营业收入指引数据，相关信息请以公司公开披露的信息为准。 公司目前研发进展顺 ...

来源：市场资讯 经营范围含技术服务、技术开发、技术咨询、技术交流、技术转让、技术推广；电子专用材料研发；工 程和技术研究和试验发展；半导体器件专用设备制造；电子专用材料制造；电子元器件与机电组件设备 制造；电子专用材料销售；半导体器件专用设备销售；电子元器件与机电组件设备销售；进出口代理； 技术进出口；货物进出口（除依法须经批准的项目外，凭营业执照依法自主开展经营活动） 企业名称盛吉盛半导体技术（无锡）有限公司法定代表人项习飞注册资本10000万人民币国标行业制造 业>计算机、通信和其他电子设备制造业>电子器件制造地址无锡市惠山区洛社镇洛圻路107-12号1层101 企业类型有限责任公司（外商投资企业法人独资）营业期限2026-2-2至无固定期限登记机关无锡市惠山 区数据局 天眼查显示，近日，盛吉盛半导体技术（无锡）有限公司成立，法定代表人为项习飞，注册资本10000 万人民币，由盛吉盛（宁波）半导体科技有限公司全资持股。 序号股东名称持股比例1盛吉盛（宁波）半导体科技有限公司100% ...

Core Viewpoint - Naxin Micro (02676) shares rose over 8%, reaching HKD 146.1 with a trading volume of HKD 50.63 million, following the announcement of expected revenue growth and reduced losses for 2025 [1] Company Summary - Naxin Micro anticipates achieving revenue between RMB 3.3 billion and RMB 3.4 billion for the fiscal year 2025, representing a year-on-year growth of 68.34% to 73.45% [1] - The company expects a net loss attributable to shareholders of between RMB -250 million and RMB -200 million for 2025, indicating a narrowing of losses compared to previous periods [1] Industry Summary - Media reports indicate that major IC design companies, such as MediaTek, plan to adjust prices to reflect rising manufacturing costs [1] - Analog chip companies, including Analog Devices, are set to implement price increases starting February 1, which may signal a shift in the supply-demand dynamics within the analog chip sector [1] - Galaxy Securities notes that the analog chip design sector is showing signs of recovery, with price hikes from companies like Analog Devices and Texas Instruments [1]

Summary of Conference Call Notes Industry Overview - The semiconductor packaging and testing industry is entering a strong cycle, with price increases reported by both Taiwanese and mainland Chinese companies. Price hikes for storage packaging have started, with companies like Nanya increasing prices by 30%-40% and major players like ASE raising prices close to 20% [1][5][4]. Key Points on Advanced Packaging - Domestic companies are accelerating their positioning in advanced packaging, with 2026 expected to mark the transition from small-scale to large-scale production. Companies such as Changdian Technology, Tongfu Microelectronics, and others have made significant progress in 2.5D technology [1][6][8]. - The IPO of Shenghe Jingwei is anticipated to reshape the valuation system of the packaging and testing industry, with the company raising 8.4 billion yuan for the development of multi-chip integration packaging technology [1][8]. Domestic Computing Power - The domestic computing power sector is entering a period of intensive model releases, with companies like ByteDance launching new models that significantly drive demand for inference capabilities. ByteDance's average daily token consumption reached approximately 60 trillion in January, with a mid-term target of 180 trillion [1][10]. - Major cloud providers are shifting from single-card to super-node procurement strategies to enhance inference performance and cost-effectiveness, marking 2026 as a pivotal year for the domestic computing power industry [1][10]. CPU Market Trends - CPU demand continues to grow, driven by Microsoft's development of enterprise-level AI applications. The number of enterprise users spending over $1 million quarterly has increased by approximately 82%, with M365 new seat additions growing by 160% year-on-year [2][12]. - The transition to MRDIMM memory modules is noted, which are suitable for high-performance computing and AI applications, with peak bandwidth increasing by nearly 40% compared to standard DDR5 RDIMM [12]. Storage Market Dynamics - The storage market is experiencing robust growth, with contract prices exceeding expectations in Q1 and anticipated further increases in Q2. The strong demand in the storage industry has extended to the semiconductor packaging sector, with domestic packaging companies operating at full capacity [5][4]. Investment Recommendations - Recommended companies for investment include: - Advanced Packaging: Changdian Technology, Tongfu Microelectronics, and Huicheng Co. - Domestic Computing Power: Xinyuan Co. as a core beneficiary. - CPU-related: Guanghetong (PCB), Tongfu Microelectronics (PCB and memory interface chips), and others [9]. Additional Insights - The overall semiconductor packaging sector is in a strong cycle, with high capacity utilization and potential for further price increases. The advancements in 2.5D technology and the upcoming IPOs are expected to create significant investment opportunities [8][6].