Core Viewpoint - Changdian Technology (600584.SH) has launched a one-stop system-level packaging solution targeting high-performance computing scenarios, covering packaging needs for computing, storage, power, and network-related chips [1] Group 1: Product Development - The new packaging solution supports multi-chip heterogeneous integration and has established multi-level packaging and testing capabilities to meet various application fields [1] - In the fields of industrial automation and smart terminals, Changdian Technology has initiated multiple robot-related packaging projects and is collaborating with robot control system customers to develop system-level packaging solutions [1] Group 2: Market Positioning - The company's efforts aim to enhance system integration and reliability, positioning itself as a key player in the evolving landscape of high-performance computing and robotics [1]

格隆汇9月22日丨长电科技(600584.SH)在互动平台表示，长电科技针对高性能计算等场景推出了一站式 系统级封装解决方案，覆盖了计算，存储，电源及网络相关芯片的封装需求，可以支持多芯片异构、异 质集成，已构建多层次的封装与测试能力，满足多个应用领域。长电科技在工业自动化与智能终端领 域，已布局多项机器人相关封装项目并与机器人控制系统客户联合开发系统级封装方案，提升系统集成 度与可靠性。 ...