低功耗芯片

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200家全球品牌齐聚CES Asia 2025,亚洲科技盛宴彰显全球辐射力
Sou Hu Cai Jing· 2025-08-11 02:00
Group 1 - CES Asia 2025 has confirmed participation from 200 top global consumer electronics brands, with international exhibitors from 30 countries and regions, exceeding 20% of total participation, highlighting the influence and cohesion of the Asian consumer technology market [2] - The exhibition showcases a complete industry chain, featuring upstream chip companies presenting low-power chips for smart devices, midstream manufacturers offering flexible displays and smart sensors, and downstream brands launching consumer-oriented smart appliances and wearable devices [2] - A notable addition to the low-altitude economy sector is the participation of a global aviation technology brand's Asia-Pacific president, who will attend a closed-door seminar on "Low-altitude Economic Technology Standards and Safety Regulations," aimed at promoting collaborative standards for low-altitude vehicle certification and airspace management [2] Group 2 - CES Asia 2025 will host the "International Brand Asia Channel Expansion Summit," inviting leaders from major Asian retail platforms like JD.com, Alibaba, and Lazada to discuss regional market channel characteristics and cooperation models [3] - The exhibition will feature a "Global Innovative Product Selection" to provide international brands with a platform to showcase products to Asian consumers, facilitating rapid market recognition for quality products [3]
低功耗芯片将成为主流
半导体芯闻· 2025-06-30 10:07
Core Viewpoint - The semiconductor industry is shifting focus from speed and capacity to power efficiency, driven by the increasing power demands of artificial intelligence (AI) applications [1][2]. Group 1: Power Consumption in AI Chips - AI chips are known for their high power consumption, with Nvidia's upcoming B100 chip requiring 1000 watts, while previous models A100 and H100 required 400 watts and 700 watts respectively [1]. - The development of low-power chips is becoming increasingly competitive, as they are essential for devices like smartphones and laptops that need to perform AI computations without internet connectivity [1]. Group 2: Advancements in Low-Power DRAM - Samsung has developed LPDDR5X, a low-power DRAM chip that offers over 30% increased capacity and 25% reduced power consumption compared to its predecessor [2]. - SK Hynix has commercialized LPDDR5T DRAM, which enhances performance by five times and can process 15 full HD movies per second while significantly lowering power usage [2]. - LPDDR stacking technology is being advanced to improve capacity and speed while minimizing power consumption [2]. Group 3: Next-Generation Materials - Development of next-generation materials, such as glass substrates, is underway to enhance semiconductor power efficiency, with the potential to significantly increase data processing speeds without additional power consumption [2][3]. - Companies like SKC and Samsung are investing in glass substrate production, with plans for mass production by 2026 [3]. Group 4: GaN and SiC Technologies - Low-power, high-performance chips based on Gallium Nitride (GaN) and Silicon Carbide (SiC) are being developed as potential alternatives to traditional silicon [4]. - Samsung has established a dedicated GaN semiconductor business team, aiming for mass production by 2025 [4].