公众号记得加星标⭐️，第一时间看推送不会错过。 来源 ：内容 编译自usinesskorea 。 参考链接 https://www.businesskorea.co.kr/news/articleView.html?idxno=250069 *免责声明：本文由作者原创。文章内容系作者个人观点，半导体行业观察转载仅为了传达一种不同的观点，不代表半导体行业观察对该 观点赞同或支持，如果有任何异议，欢迎联系半导体行业观察。 END 今天是《半导体行业观察》为您分享的第 4136 期内容，欢迎关注。 推荐阅读 有分析认为，英特尔的"转变"也将对韩国设备公司的动向产生重大影响。这是因为，将玻璃基板作为 未来增长动力的韩国设备公司数量已超过20家。他们纷纷积极进军玻璃基板市场，声称将克服下游市 场的低迷。这些公司认为，由于技术原理与现有设备类似，因此它们也能在玻璃基板市场保持竞争 力。 但不确定性正在加剧。一家设备公司的代表表示："虽然韩国企业集团已将2026年或2027年定为玻璃 基板量产的时间表，但据我了解，受美国关税政策的影响，他们目前没有足够的能力来应对新业 务。"他还表示："预计今年下半年的玻璃基板设备订单很有 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来 源 ：内容来自 trendforce 。 与此同时，由于预计要到2030年才能实现量产，英特尔似乎正转向授权许可，以此作为其技术货 币化的一种方式。正如报告所指出的，该公司在代工业务方面持续的困境被广泛认为是这一转变背 后的一个关键因素。 市场影响：英特尔授权推动玻璃基板快速发展 英特尔的新方向也有望重塑玻璃基板市场的竞争格局。报道称，英特尔可能不再以制造商的身份参 与竞争，而是以客户的身份重新进入该领域，这将为三星电机和Absolics等供应商创造机会。 此外，报告还强调，英特尔此举或将加速整个玻璃基板行业的商业化进程。报告指出，随着英特尔 庞大的专利组合投入使用，后来者或将能够以更快的速度推进其发展。 行业参与者竞相实现玻璃基板商业化 全 球 企 业 正 在 加 紧 推 进 玻 璃 基 板 的 商 业 化 进 程 。 据 《 ETNews 》 上 个 月 报 道 ， SKC 的 子 公 司 Absolics 正在加大产能。《韩国先驱报》 5 月份的一篇报道称，该公司计划在 2025 年底前完成 量产准备，并有望成为首家实现玻璃基板商业化的公司。该公司已在其位于 ...

该公司主营业务涉及光伏设备制造领域，主要产品包括玻璃基板等。作为河南地区上市公司，凯盛新能 同时被纳入沪股通标的。 从资金流向来看，凯盛新能8月21日主力资金净流入364.61万元，近五个交易日累计净流入1033.96万 元。盘中10点05分曾出现快速反弹，五分钟内股价拉升超过2%，当时成交额达5342.92万元。 风险提示：股市有风险，投资需谨慎。 凯盛新能8月21日收盘报11.39元，较前一交易日下跌0.06元，跌幅0.52%。当日开盘价为11.25元，最高 触及11.53元，最低下探11.20元，成交量为86435手，成交金额达0.98亿元。 ...

Core Viewpoint - Glass is transitioning from a background consumable to a core component in semiconductor packaging, providing essential substrates and dielectric layers for advanced applications [2][5]. Group 1: Glass in Semiconductor Manufacturing - Glass has been utilized in modern wafer fabs, supporting silicon wafers during thinning processes and forming sealed MEMS caps [2]. - The low thermal expansion coefficient (CTE) glass is becoming integral in wafer-level fan-out processes [2]. - The demand for higher bandwidth and power density in AI and high-performance computing (HPC) is driving the need for advanced packaging solutions, where glass serves as a viable alternative to organic laminates and silicon interposers [4][5]. Group 2: Technological Advancements and Market Trends - Leading manufacturers like Intel and Samsung are exploring glass-based platforms for packaging, indicating a shift towards commercial viability for glass substrates [5]. - The introduction of glass core substrates and intermediary layers reflects a broader trend in the semiconductor industry, particularly in advanced packaging and integrated circuit (IC) substrates [5]. - Glass's low dielectric loss and optical transparency are emerging as significant growth drivers beyond computing packaging, particularly in photonic technologies [6]. Group 3: Supply Chain and Competitive Landscape - The transition from pilot lines to mass production for glass substrates hinges on advancements in laser drilling, copper filling, and panel processing technologies [8]. - Understanding the competitive dynamics with silicon and improved organic materials is crucial, as foundries are pushing for mixed wafer-level redistribution, which may diminish glass's advantages [8].

Core Insights - Intel is experiencing significant talent loss due to financial constraints, layoffs, and project cancellations, prompting competitors like Samsung Electronics to aggressively recruit skilled engineers from Intel [1][2][3] - Samsung is particularly targeting engineers with expertise in advanced packaging technology, glass substrates, and backend power delivery systems, which are critical for next-generation semiconductor projects [1][2] - The ongoing layoffs at Intel, which aim to reduce the workforce by 75,000, are seen as an opportunity for Samsung to acquire top talent in the semiconductor industry [1][3] Group 1 - Intel's recent layoffs and project cancellations have led to a talent exodus, with many engineers moving to Samsung Electronics and its subsidiaries [1][2] - Samsung is focusing on hiring experienced packaging process engineers, especially in areas where it lacks expertise, such as backend power delivery and glass substrates [2] - The departure of key engineers, including Intel's chief packaging engineer Gang Duan, highlights the severity of talent loss at Intel [2] Group 2 - Industry experts predict that Intel's ongoing reduction of investment in foundry-related projects will continue to result in talent outflow [3] - Intel's CEO has acknowledged that past investments in capacity exceeded demand, indicating a shift in the company's development strategy [3] - Samsung is advised to selectively recruit talent based on actual departmental needs rather than solely on their Intel background [3]

Group 1 - The stock price of Astone Technology closed at 48.75 yuan on August 19, 2025, down by 3.13 yuan, a decrease of 6.03% from the previous trading day [1] - The opening price was 50.00 yuan, with a highest point of 50.95 yuan and a lowest point of 48.01 yuan, resulting in a trading volume of 1.251 billion yuan and a turnover rate of 22.28% [1] - Astone Technology specializes in the research and production of semiconductor materials, glass substrates, and composite conductors, positioning itself as an upstream player in the semiconductor industry [1] Group 2 - The company's products are widely used in the electronics and photovoltaic sectors, and it is recognized as a specialized and innovative enterprise in Fujian Province [1] - On August 19, there was a net outflow of 126 million yuan in main funds, accounting for 2.27% of the circulating market value [1] - Over the past five trading days, the cumulative net outflow reached 291 million yuan, representing 5.26% of the circulating market value [1]

Core Viewpoint - Corning Inc. has initiated a series of legal actions, including a "337 investigation," against several leading Chinese companies in the new display industry, indicating a significant escalation in the competition between U.S. and Chinese firms in the display supply chain [1][2][6][14]. Group 1: Overview of the Investigation and Lawsuits - The "337 investigation" by Corning is a critical phase in the legal battle, with evidence submission deadlines set by the U.S. International Trade Commission (ITC) [1][10]. - Corning has filed a total of 13 lawsuits against Chinese companies, including Rainbow Technology, TCL Huaxing Optoelectronics, and Huike, across multiple jurisdictions such as the U.S., EU, and India [2][9]. - The investigation targets the entire display industry chain, from materials to end products, highlighting the comprehensive nature of the legal actions [9][21]. Group 2: Market Dynamics and Implications - China's display panel production accounts for approximately 50% of the global market, with over 70% of shipments originating from China [4][19]. - Corning, along with two Japanese companies, dominates about 90% of the glass substrate market, posing a significant challenge for Chinese firms like Rainbow Technology, which has recently achieved a 10% market share [4][15]. - The legal actions are seen as an attempt by Corning to maintain its market position and limit the production capacity of Chinese companies, which have begun to break the technological monopoly in the glass substrate market [14][16]. Group 3: Technological and Competitive Landscape - The glass substrate is a crucial material in the display supply chain, akin to silicon wafers in the semiconductor industry, making the ongoing legal battles pivotal for the future of the Chinese display industry [5][15]. - Both Corning and Rainbow Technology utilize the "overflow method" for glass substrate production, which is essential for achieving the required precision and quality [21]. - The competition is not only about market share but also revolves around intellectual property rights, with Corning leveraging its patents to create barriers for Chinese competitors [22][23]. Group 4: Future Outlook and Industry Response - The outcome of these legal battles could significantly impact the Chinese display industry's ability to secure its supply chain and maintain competitive pricing, as evidenced by the drop in glass substrate prices due to increased local production [16][17]. - Experts emphasize the need for China to develop its own intellectual property in the glass substrate sector to ensure long-term sustainability and independence in the display industry [25][29]. - The ongoing disputes reflect broader trends in global trade and technology competition, with potential implications for other sectors as well [30][31].

Core Viewpoint - The article discusses the ongoing legal battles initiated by Corning Inc. against several leading Chinese companies in the new display industry, highlighting the implications for the industry and the potential risks to China's market position due to patent and intellectual property disputes [2][4][20]. Group 1: Legal Actions and Investigations - As of mid-August this year, Corning has initiated a total of 13 lawsuits related to patents and intellectual property against Chinese companies such as Rainbow Technology, TCL Huaxing Optoelectronics, and HKC in various regions including the US, EU, India, and China [2][4]. - The critical date for evidence submission in the "337 investigation" by the US International Trade Commission (ITC) is set for August 8, 2025, marking a significant point in the legal proceedings [2][8]. - Corning has filed two applications for "337 investigations" against Chinese companies within a short span from late 2024 to early 2025, accusing them of infringing on its patents and trade secrets in the glass substrate sector [6][10]. Group 2: Industry Context and Market Dynamics - The display industry chain is divided into three segments: glass substrates (upstream), liquid crystal panels (midstream), and electronic displays (downstream), with downstream applications in TVs, smartphones, computers, and automotive displays [3]. - China currently accounts for approximately half of the global display panel output value and over 70% of the shipment volume, having invested over 1.5 trillion yuan to establish more than 60 production lines with an annual capacity of about 250 million square meters [4][14]. - Despite this growth, around 90% of the glass substrate market is dominated by Corning and two Japanese companies, with Rainbow Technology being the only Chinese firm to recently overcome the technical barriers of the 8.5-generation production line [4][12]. Group 3: Implications of the Legal Battles - The ongoing legal disputes are seen as a significant threat to the Chinese display industry's future, as the outcome could determine the ability of Chinese companies to maintain their market share and technological advancements [12][20]. - The legal actions initiated by Corning are perceived as efforts to restrict the production capacity of Chinese firms, which have recently begun to challenge the long-standing technological monopoly held by multinational corporations [13][21]. - The article emphasizes the importance of intellectual property rights in the glass substrate market, as both Corning and Rainbow Technology utilize similar manufacturing processes, making the protection of patents crucial for competitive advantage [16][18].

8月14日盘中，阿石创股价出现快速波动。上午9点40分左右出现快速反弹，5分钟内涨幅超过2%；10点 06分后又出现快速回调，5分钟内跌幅超过2%。 阿石创8月14日收盘价为45.94元，较前一交易日下跌3.43元。当日开盘价为48.68元，最高触及49.64元， 最低下探至45.65元，全天振幅达8.08%。成交量为268516手，成交金额12.65亿元。 当日主力资金净流出12572.08万元，占流通市值的2.41%。近五个交易日累计净流出42307.89万元，占 流通市值的8.11%。 该公司主营业务为半导体材料研发生产，产品包括玻璃基板、复合集流体等。阿石创是福建省专精特新 企业，在半导体材料领域具有一定技术积累。 风险提示：股市有风险，投资需谨慎。 ...

Core Viewpoint - The departure of Dr. Gang Duan from Intel to Samsung signifies a shift in the semiconductor industry's glass substrate technology landscape, particularly in the context of rising AI chip demands [2][29]. Group 1: Intel's Historical Context and Innovations - Intel has historically led the transition from ceramic to organic packaging in the 1990s, developing the ABF substrate technology, which became a mainstream choice for high-end chip packaging [3]. - The limitations of ABF substrates have become apparent as AI chips demand higher performance, prompting a shift towards glass substrates, which offer superior electrical performance and manufacturing maturity [3][4]. - Intel's glass substrate research has been ongoing for over a decade, with significant breakthroughs achieved between 2021 and 2023, leading to the establishment of a scalable production line [7]. Group 2: Glass Substrate Advantages and Market Dynamics - Glass substrates provide design flexibility, improved power transmission, and enhanced signal integrity, making them suitable for AI and data center applications [8]. - Intel's announcement of the first glass substrates for advanced packaging in September 2023 has intensified competition in the industry [4]. - Despite the technological advancements, Intel's strategic focus has shifted towards core product lines, indicating a potential move towards outsourcing glass substrate production rather than in-house development [12][13]. Group 3: Samsung's Strategic Moves - Samsung has accelerated its plans for glass substrate production, aiming to establish a trial production line by late 2024 and achieve mass production by 2026 [15][16]. - The recruitment of Dr. Gang Duan enhances Samsung's capabilities in glass substrate technology, positioning the company to meet the growing demand for advanced packaging solutions [15][20]. - Samsung's strategy includes collaboration with its subsidiaries to leverage combined expertise in glass substrate development, contrasting with Intel's shift towards external procurement [21][29]. Group 4: Competitive Landscape and Future Outlook - Other players, including TSMC and various Taiwanese semiconductor equipment manufacturers, are also entering the glass substrate arena, indicating a competitive and rapidly evolving market [23][25]. - Companies like SKC and LG Innotek are actively developing glass substrates, with plans for mass production and partnerships with major tech firms [25][26]. - The overall trend suggests that the glass substrate technology will play a crucial role in the future of AI chips, potentially leading to a new wave of innovation and industry restructuring [29].