玻璃基板
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玻璃基板,过热了?
半导体芯闻· 2025-11-18 10:29
Core Viewpoint - Major South Korean electronics companies, including Samsung, SK, and LG, are competing to commercialize next-generation semiconductor glass substrates, facing significant challenges such as technical difficulties and market uncertainty [2][4]. Group 1: Market Dynamics - The glass substrate technology aims to replace traditional PCB materials to enhance power efficiency and thermal resistance, with a notable advantage in reducing warping [2][3]. - The demand for glass substrates is expected to rise due to the increasing size of AI semiconductors, which are more sensitive to warping [2][3]. - Samsung Electro-Mechanics has established a trial production line for glass substrates and plans to deliver initial samples to a global tech giant [3]. - SKC's Absolix is constructing a glass substrate factory in Georgia, with an initial capacity of 12,000 square meters and a future expansion to 72,000 square meters [3][4]. - LG Innotek is also building a trial production line, aiming to produce prototypes by the end of the year and start mass production by 2027 or 2028 [4]. Group 2: Technical Challenges - The processing of glass substrates is more complex than traditional materials, with risks of micro-cracks during cutting and drilling that can lead to overall substrate failure [4][5]. - Issues with reliability and compatibility of glass substrates remain unresolved, leading to skepticism in the packaging industry regarding their exclusive use [4][5]. - The lack of clear demand sources for glass substrates is a concern, as major tech companies are still in the sample testing phase without formal commercialization announcements [4][5]. Group 3: Market Potential and Predictions - Opinions on the market potential for glass substrates vary, with some predicting explosive growth driven by AI semiconductors, while others believe demand will be limited to ultra-high-performance applications [6][7]. - The semiconductor packaging market is estimated to be worth between 10 trillion to 20 trillion KRW, with glass substrates potentially capturing 10% of this market, equating to a value of 1 trillion KRW [6]. - Yole Group forecasts that the high-performance IC substrate market will reach approximately 40 trillion KRW by 2028, with glass substrates accounting for only 58 billion KRW, or 0.14% [6][7]. - A representative from a glass substrate equipment company acknowledges skepticism but suggests that rapid adoption could occur with technological advancements and market changes, estimating a 50% chance of success for glass substrates [7].
玻璃基板,行了吗?
半导体芯闻· 2025-11-17 10:17
Core Viewpoint - Samsung Electronics is in early-stage discussions with Japanese substrate manufacturers, including its subsidiary Samsung Electro-Mechanics, to collaborate on next-generation semiconductor glass substrate technology, but formal sample evaluations are not yet complete [2][3]. Group 1: Collaboration and Development - Samsung Electronics is collaborating with three major substrate partners—Samsung Electro-Mechanics, Ibiden, and Shin-Etsu Chemical—for preliminary sample testing of glass core substrates, which is expected to enhance power efficiency and thermal resistance [2]. - The discussions regarding glass substrates have been ongoing for about one to two years, indicating Samsung's interest in adopting glass substrates to secure advanced packaging technology [2]. Group 2: Technical Challenges and Market Uncertainty - Industry experts believe that Samsung Electronics views glass substrates as a candidate for next-generation technology but has not established any concrete commercialization plans due to the lack of compliant samples from its partners [3]. - The samples provided by the substrate partners are still in very early stages and do not meet Samsung's size and characteristic requirements, leading to slow progress in commercialization discussions [3][4]. - There are significant technical challenges associated with glass substrates, such as the risk of cracks during manufacturing processes like single-crystal formation and through-silicon vias (TSVs), which raises concerns among engineers regarding the necessity of this investment [4].
中国显示产业链发起联盟 重塑供应链体系新格局
Jing Ji Guan Cha Wang· 2025-11-08 13:20
Core Viewpoint - The establishment of the China Glass New Materials Industry Chain Supply Chain Alliance marks a significant step towards enhancing the safety and stability of China's display industry supply chain, which is currently facing substantial risks due to high market concentration in the upstream glass substrate sector [2][3][4]. Group 1: Industry Overview - By the end of 2024, China's display panel output value is expected to account for approximately 50% of the global market, with shipment volume exceeding 70% [4]. - The top three global manufacturers in the substrate/carrier glass sector hold over 90% market share, while domestic companies in China have less than 10% [4][5]. - The display industry chain is divided into three segments: glass/carrier substrate (upstream), liquid crystal panels (midstream), and electronic displays (downstream) [4]. Group 2: Supply Chain Challenges - The current level of self-sufficiency in China's display industry supply chain is considered basic, with critical raw materials and equipment lacking redundancy [5]. - The glass substrate is identified as one of the weakest links in the display panel supply chain, necessitating both technological breakthroughs and the formation of market alliances [5]. Group 3: Alliance Formation and Goals - The China Glass New Materials Industry Chain Supply Chain Alliance aims to break down technological barriers, enhance collaboration, and create a resilient industrial ecosystem [5][6]. - The alliance was initiated during the 2025 Low-Carbon Inorganic Non-Metallic Materials Modern Industry Chain Joint Action and the Second Glass Industry Development Conference, with representatives from various industry sectors participating [4][5]. Group 4: Future Prospects - The display industry in China is projected to benefit from significant investments exceeding 1.5 trillion yuan, with over 60 display panel production lines established, resulting in an annual capacity of approximately 250 million square meters [7]. - The rise of new technologies, such as artificial intelligence, is expected to reshape the industrial landscape, providing substantial growth opportunities for the display industry [7][8]. - The integration of OLED technology into various applications, including automotive displays, is anticipated to create new market spaces, further emphasizing the need for a secure and expansive supply chain [8].
长电科技:1季度-3季度研发投入同比增长25%
Zheng Quan Ri Bao Wang· 2025-11-07 13:13
Core Viewpoint - Longji Technology (600584) emphasizes the importance of localized production capacity support for clients and aims to maintain an international layout while building a resilient and sustainable supply chain [1] Group 1: Company Strategy - The company is committed to international expansion and flexible capacity allocation to enhance business resilience [1] - Longji Technology plans to continue investing in advanced technology and research, with R&D expenditure increasing by 25% year-on-year to reach 1.54 billion yuan [1] Group 2: Technological Advancements - The company has made significant breakthroughs in key technologies such as glass substrates, CPO optoelectronic packaging, and large-size FCBGA [1]
果园港的新变化——长江上游最大枢纽港蹲点记
Xin Hua Wang· 2025-11-07 09:24
Core Insights - The article highlights the transformation of Chongqing's Guoyuan Port into a major logistics hub, significantly enhancing its capacity and connectivity to global markets [1][2][3] Infrastructure Development - Guoyuan Port has expanded to include 18 berths for 5,000-ton vessels and 14 dedicated railway lines, achieving an annual throughput of over 26 million tons and a container handling capacity of 2 million TEUs [1] - The port now connects to over 300 ports in more than 100 countries and regions, establishing itself as a key transit point for the western region of China [1] Technological Advancements - The port has embraced smart and green technologies, with the introduction of remote-controlled, unmanned container trucks that enhance operational efficiency and reduce labor costs [2] - Guoyuan Port has been recognized as a "four-star smart port" and "four-star green port," reflecting its commitment to improving logistics efficiency and reducing costs for businesses [2] Economic Impact - The port's operational efficiency improvements have led to a 15% increase in cargo turnover speed, saving companies over 100 million yuan annually in logistics costs [2] - The integration of various transportation modes has made it easier and more cost-effective for goods from the western region to reach international markets [2][3] Strategic Positioning - Guoyuan Port's location allows it to leverage multiple transport corridors, including the New Western Land-Sea Corridor and the Yangtze River Golden Waterway, enhancing its role in international trade [3] - The port is positioned to support the "dual circulation" strategy, promoting both domestic and international economic activities [4] Future Development - The port aims to establish a "front port and back garden" industrial ecosystem, enhancing its influence on surrounding industries and promoting regional economic integration [4] - The focus is shifting from quantity growth to high-quality development, with plans to incorporate advanced technologies like 5G and big data into port operations [4]
三星发力玻璃基板,成立合资公司
半导体行业观察· 2025-11-05 00:56
Core Viewpoint - Samsung Electro-Mechanics and Sumitomo Chemical Group have signed a memorandum of understanding to explore the establishment of a joint venture for the production of glass cores, a key material for next-generation packaging substrates, to address the limitations of current technologies driven by AI and high-performance computing [2][3]. Group 1: Joint Venture Details - The joint venture aims to combine the technologies and global networks of Samsung Electro-Mechanics, Sumitomo Chemical, and Dongwoo Fine-Chemical to ensure the production and supply of glass cores for packaging substrates [2]. - Samsung Electro-Mechanics will be the controlling shareholder of the joint venture, with negotiations ongoing regarding the equity structure, business plan, and company name, targeting a final contract by next year [2]. - The headquarters will be located at Dongwoo Fine-Chemical's factory in Pyeongtaek, which will serve as the initial production base for glass cores [2]. Group 2: Market Context and Technology - Glass cores are seen as a critical material for next-generation semiconductor packaging, offering lower thermal expansion coefficients and superior flatness compared to existing organic substrates, enabling high-density and large-area packaging [2]. - Samsung plans to adopt glass substrate intermediary layers in its advanced semiconductor products by 2028 to meet customer demands, although this has not been officially confirmed [5]. - The global glass substrate market is projected to grow from $7.2 billion in 2024 to $10.3 billion by 2034, indicating a robust demand for this technology [6]. Group 3: Competitive Landscape - Leading chip manufacturers, including Samsung, Intel, AMD, Broadcom, and NVIDIA, are actively exploring the use of glass substrates in their next-generation products due to their potential to enhance energy efficiency and performance [6]. - Absolics, a subsidiary of SKC, is expected to be the first company to commercialize glass core substrates, with prototype production already underway in Georgia, USA [7]. - Despite the advantages of glass substrates, challenges remain in terms of commercialization, particularly regarding the material's brittleness and the precision required in manufacturing [6][7].
封装基板,飙升
半导体行业观察· 2025-11-02 02:08
Core Insights - The global MEMS packaging substrate market is projected to grow from $2.4 billion in 2025 to $3.23 billion by 2030, driven by the expansion of the medical device industry, accelerated 5G deployment, and widespread adoption of IoT solutions, with a CAGR of 6.1% [2][4]. Market Growth Drivers - Key innovations in substrate materials and advanced packaging technologies are crucial for the design of next-generation sensors and actuators, particularly in automotive, medical, and industrial applications [2]. - The glass substrate segment is expected to experience the fastest growth due to its unique combination of electrical insulation, optical transparency, chemical resistance, and thermal stability, making it ideal for high-performance MEMS designs [2][3]. Regional Insights - The Asia-Pacific region is anticipated to maintain its dominant position in the MEMS packaging substrate market by 2030, supported by leading companies in consumer electronics and IoT device manufacturing [4][5]. - The rapid proliferation of smartphones, wearables, AR/VR systems, and smart home technologies in this region is creating sustained demand for compact and efficient MEMS components [5]. Technological Advancements - Advances in glass processing technologies, such as laser drilling and anodic bonding, are reducing costs and improving scalability, further driving the demand for transparent and inert materials in chip lab diagnostics, optical MEMS, and environmental monitoring sensors [3]. Key Market Players - Major companies in the MEMS packaging substrate market are positioned to play an increasingly important role in supporting the next generation of interconnected, high-performance electronic devices, particularly those based on glass solutions [6].
旗滨集团(601636.SH):已正式确立玻璃基板研发和产业规划
Ge Long Hui· 2025-10-31 08:09
Core Viewpoint - Qibin Group (601636.SH) emphasizes the importance of glass substrates in the display field, which is the largest application area for glass substrates, particularly for LCD and OLED panels [1] Industry Summary - The glass substrate business in the display sector focuses on technological iteration and diversified layout, continuously advancing in large size, ultra-thin, and high stability [1] - The market capacity is characterized by a "display dominance, semiconductor high growth" trend, with the global market scale expected to exceed $10 billion in the coming years [1] Company Summary - Qibin Group entered the electronic glass market in 2018 and has established a product matrix that includes ultra-thin high-alumina, lithium-aluminosilicate, microcrystalline, flexible, and medium-aluminosilicate glass products [1] - These products are widely used in consumer electronics, automotive electronics, and the display field [1] - The company has officially established research and development and industrial planning for glass substrates, focusing on detailed definitions of glass substrate products and analysis of ultra-thin high-end glass production technologies [1] - Currently, the company has no substantial products in display substrate glass, with future product launch plans dependent on production line construction and market conditions [1]
从提供保护到创造价值 AI开启半导体封测新格局
Shang Hai Zheng Quan Bao· 2025-10-29 17:57
Core Insights - The global advanced packaging market is projected to reach $56.9 billion in 2025, with a year-on-year growth of 9.6%, and is expected to grow to $78.6 billion by 2028, reflecting a compound annual growth rate (CAGR) of 10.05% from 2022 to 2028 [3]. Industry Transformation - The logic of semiconductor packaging has shifted from merely providing protective casings to creating economic value, indicating a significant change in the industry dynamics [1][2]. - Advanced packaging is becoming a strategic focal point in the semiconductor supply chain, driven by the demand for AI and high-performance computing [2]. Market Dynamics - The demand for advanced packaging is largely fueled by AI applications, which have significantly increased the need for computing chips [2]. - The advanced packaging sales are expected to surpass traditional packaging for the first time in 2025, with consumer electronics and automotive electronics accounting for 85% of this market [2]. Innovation Directions - The industry is witnessing a surge in new technologies and materials, such as Chiplet technology, CoWoS packaging, and advanced substrates like silicon carbide and glass substrates [4]. - Key challenges in advanced packaging include efficient thermal management, heterogeneous integration of Chiplets, and the need for finer line widths and larger package sizes [5]. Equipment and Material Trends - The global advanced packaging equipment market is expected to reach $30 billion by 2030, with significant investments in hybrid bonding equipment and TSV etching machines [5]. - Glass substrates are emerging as a superior packaging material due to their better electrical and thermal performance, although they face challenges in production and reliability [5]. Strategic Development - The industry requires a collaborative ecosystem that integrates large, medium, and small enterprises to achieve high-quality development and innovation breakthroughs [6]. - There is a need for China to enhance its international influence by developing local standards and actively participating in global standard-setting to secure competitive advantages [6].
全球市场显示面板电子玻璃市场份额预测
Sou Hu Cai Jing· 2025-10-28 09:11
Core Insights - The display panel electronic glass market is projected to exceed $20.527 billion by 2031, with a stable CAGR of 4.7% from 2024 to 2031, driven by the upgrade of consumer electronics and the acceleration of emerging display technologies [1][5] Market Overview - The global display panel electronic glass industry is highly concentrated, with the top three companies holding approximately 84.6% of the market share in 2024, including Corning, Asahi Glass, and NEG [5] Industry Structure - The supply chain of the display panel electronic glass industry is tightly integrated, with significant differences in technical requirements and value distribution across various stages [6] - The upstream focuses on high-purity materials, while the midstream involves critical manufacturing processes requiring high precision and quality control [6][7] Application and Demand - The downstream applications include a diverse customer base, with glass substrates accounting for over 60% of the market share, followed by cover glass at around 30% [7] - Demand in the high-end market is driven by the need for precision and strength, while the mid-low end market emphasizes cost control and stable supply [7][8] Policy Environment - Various countries have included the display industry in strategic emerging industries, promoting development through supportive policies, particularly in China, Korea, and Japan [8] Future Opportunities - Future growth opportunities in the display panel electronic glass industry will focus on the proliferation of high-end display technologies and the expansion of application scenarios, such as automotive displays and smart home devices [8]