Core Viewpoint - Intel is developing new chip packaging technologies to enhance processor capabilities for artificial intelligence, addressing the limitations imposed by Moore's Law and the fixed size of individual silicon chips [1]. Group 1: Innovations in Chip Packaging - Intel announced three innovations aimed at increasing the number and size of silicon chips within a single package, allowing integration of over 10,000 square millimeters of silicon in a package area exceeding 21,000 square millimeters [1]. - The latest EMIB technology, EMIB-T, enhances connection density with vertical copper connections (TSV) and includes a copper mesh for grounding, enabling the connection of 38 or more EMIB-T bridges to over 12 full-size silicon chips [3][4]. Group 2: Thermal Management Solutions - Intel introduced low thermal gradient thermal compression bonding, which improves the predictability and management of thermal expansion mismatches, allowing for the installation of chips on oversized substrates [6]. - The company is addressing the challenge of heat dissipation from larger silicon components by developing modular integrated heat sinks, which can maintain flatness and reliability at higher temperatures [9]. Group 3: Competitive Landscape - These technologies are still in the research and development phase, with no commercial release date announced, but they are expected to be crucial for competing with TSMC's packaging expansion plans in the coming years [9].