Core Viewpoint - Intel is developing new chip packaging technologies to enhance processor capabilities for artificial intelligence, addressing the limitations imposed by Moore's Law and the fixed size of individual silicon chips [1]. Group 1: Innovations in Chip Packaging - Intel announced three innovations aimed at increasing the number and size of silicon chips within a single package, allowing integration of over 10,000 square millimeters of silicon in a package area exceeding 21,000 square millimeters [1]. - The latest EMIB technology, EMIB-T, enhances connection density with vertical copper connections (TSV) and includes a copper mesh for grounding, enabling the connection of 38 or more EMIB-T bridges to over 12 full-size silicon chips [3][4]. Group 2: Thermal Management Solutions - Intel introduced low thermal gradient thermal compression bonding, which improves the predictability and management of thermal expansion mismatches, allowing for the installation of chips on oversized substrates [6]. - The company is addressing the challenge of heat dissipation from larger silicon components by developing modular integrated heat sinks, which can maintain flatness and reliability at higher temperatures [9]. Group 3: Competitive Landscape - These technologies are still in the research and development phase, with no commercial release date announced, but they are expected to be crucial for competing with TSMC's packaging expansion plans in the coming years [9].

日 CPIT Electronics & Information Industry 际贸易促进委员会电子信息行业分会 精彩呈现 ICPF半导体技术和应用创新 IC Packaging Fair 2025 2025年4月22-24日 | 上海世博展览馆 扫码即刻 报名参会 技术论坛 "干不可发展示 3天超30位半导体技术 15个全新国产品牌设备覆盖 功率半导体先进封装技术 昌管莅临分享 惠事颁奖 行业要会 半导体工程师的先进工艺 1,000+半导体行业精英齐聚 技能竞技,专业点评提升 共谋商机 技能并解决工艺难题 半导体行业观察 Semilnsights 2025年4月22-24 ICPF 2.5D和3D及完成 时景 技术及应用大 同励百业·共展商机 2025年4月22日 | 上海世博展览馆 10:20-10:45 谢建反 齐力半导体(绍兴)有限公司 总经理 10:45-11:05 王新 杭州晶通科技有限公司 CTO 11:05-11:30 潘久川 锐德热力设备(东莞) 有限公司 华东区销售总监 11:30-11:55 胡清松 王耀军 日东智能装备科技(深圳) 有限公司 技术总监 14:20-14:45 票云蒙 ...

Core Viewpoint - The article highlights the upcoming IC Packaging Fair (ICPF) 2025, focusing on advancements in semiconductor packaging technologies and applications, scheduled for April 22-24, 2025, at the Shanghai World Expo Exhibition and Convention Center [1]. Event Overview - ICPF 2025 will feature over 30 semiconductor technology executives sharing insights during a three-day technical forum [1]. - The event aims to gather more than 1,000 industry elites to explore business opportunities in the semiconductor sector [1]. Technical Sessions - The agenda includes various presentations from industry leaders, such as: - Xie Jianfan, General Manager of Qili Semiconductor, discussing advancements in semiconductor technology [2]. - Wang Xin, CTO of Hangzhou Jingtong Technology, presenting on innovative applications [2]. - Hu Qingsong, Director of Guangdong Hongqi Chip Intelligent Equipment, sharing insights on equipment advancements [3]. Focus Areas - The event will cover critical topics such as: - 2.5D and 3D packaging technologies and their applications [1][7]. - Power semiconductor packaging techniques, including the use of silver sintering processes [16]. - System-level packaging innovations and challenges [7]. Networking Opportunities - ICPF 2025 will serve as a platform for networking among semiconductor professionals, fostering collaboration and knowledge sharing [1]. Additional Information - The event will also include a skills competition for semiconductor engineers, aimed at enhancing professional capabilities [1]. - Participants can register for the event by scanning a QR code provided in the promotional materials [6][15].

10:20-10:45 谢建反 日 CPIT Electronics & Information Industry 际贸易促进委员会电子信息行业分会 精彩呈现 ICPF半导体技术和应用创新 IC Packaging Fair 2025 2025年4月22-24日 | 上海世博展览馆 扫码即刻 报名参会 技术论坛 "干不可发展示 3天超30位半导体技术 15个全新国产品牌设备覆盖 功率半导体先进封装技术 昌管莅临分享 惠事颁奖 行业要会 半导体工程师的先进工艺 1,000+半导体行业精英齐聚 技能竞技,专业点评提升 共谋商机 技能并解决工艺难题 半导体行业观察 Semilnsights 2025年4月22-24 ICPF 2.5D和3D及完成 时景 技术及应用大 同励百业·共展商机 2025年4月22日 | 上海世博展览馆 王耀军 齐力半导体(绍兴)有限公司 总经理 10:45-11:05 王新 杭州晶通科技有限公司 CTO 11:05-11:30 潘久川 锐德热力设备(东莞) 有限公司 华东区销售总监 11:30-11:55 胡清松 广东鸿骐芯智能装备 有限公司 总监 13:30-13:55 沈里正 博士 环 ...