Core Viewpoint - Intel has unveiled several breakthroughs in chip packaging technology at the Electronic Components Technology Conference (ECTC), focusing on the new EMIB-T technology, which enhances power delivery and communication efficiency for advanced chip designs, particularly for HBM4 integration [5][14][32]. Group 1: EMIB-T Technology - EMIB-T integrates Through-Silicon Vias (TSVs) into the existing EMIB technology, improving power delivery efficiency and enabling ultra-high-speed communications between dies [12][14]. - The technology supports larger package sizes exceeding 120 mm x 180 mm and allows for more than 38 bridges, with die-to-die interconnection pitch scaling below 45 micrometers [12][15]. - EMIB-T is designed to be a cost-effective and scalable solution for heterogeneous integration, facilitating the mix and match of different die types on a single package [12][14]. Group 2: Thermal Management Innovations - Intel has introduced a novel disaggregated heat spreader design that improves thermal interface material (TIM) coupling, reducing voids by 25% and effectively cooling processors with a thermal design power (TDP) of up to 1000W [19]. - A new thermo-compression bonding process has been developed to minimize warping during the bonding process, enhancing yield and reliability for large package substrates [23]. Group 3: Strategic Importance of Packaging Technology - Advanced packaging technology is crucial for Intel Foundry as it aims to provide comprehensive chip manufacturing options, allowing integration of various chip types from multiple suppliers [32]. - Intel's packaging services have become a leading offering for external customers, including major industry players like AWS and Cisco, as well as government projects, contributing significantly to revenue generation [32].