资料显示，锦州神工半导体股份有限公司位于辽宁省锦州市太和区中信路46号甲，成立日期2013年7月 24日，上市日期2020年2月21日，公司主营业务涉及半导体级单晶硅材料的研发、生产和销售。主营业 务收入构成为：硅零部件53.86%，大直径硅材料44.37%，其中:16英寸以上24.07%，其中:16英寸以下 20.30%，半导体大尺寸硅片1.44%，其他0.33%。 11月4日，神工股份盘中上涨2.05%，截至09:48，报52.29元/股，成交9591.32万元，换手率1.09%，总市 值89.05亿元。 资金流向方面，主力资金净流入1523.89万元，特大单买入421.27万元，占比4.39%，卖出245.08万元， 占比2.56%；大单买入2788.05万元，占比29.07%，卖出1440.35万元，占比15.02%。 神工股份今年以来股价涨123.70%，近5个交易日跌0.17%，近20日涨15.69%，近60日涨62.64%。 今年以来神工股份已经2次登上龙虎榜，最近一次登上龙虎榜为10月24日，当日龙虎榜净买入2354.08万 元；买入总计1.46亿元 ，占总成交额比18.01%；卖出总计1.2 ...

神工股份(688233)10月27日披露投资者关系活动记录表显示，公司于10月26日举行线上会议及现场交 流，中信证券、金鹰基金、宏利基金等50余家机构投资者参与活动。 神工股份专注于半导体级单晶硅材料及应用产品的研发、生产及销售，目前有三大类主营产品，分别是 大直径硅材料、硅零部件以及半导体大尺寸硅片。随着国产自主供应链的不断发展，公司大直径刻蚀用 硅材料国内市场增长迅速，所占比重已超过日韩市场；公司硅零部件产品主要供给国内的刻蚀机原厂及 各大主要的存储和逻辑类Fab厂；硅片产品亦主要针对国内集成电路制造厂家。 当前，中国本土存储芯片制造厂商发展迅猛，已在前沿技术和市场份额两方面不断赶超海外竞争对手， 改变了既有的全球产业格局。中国芯片制造国产化进程进入"深水区"，供应链安全需求迫切，国产设备 厂商技术水平不断提升并追赶世界先进水平，产品持续迭代升级。 "综上，市场机会窗口敞开，公司业绩弹性有望实现。"神工股份表示，分析2025年前三季度经营情况， 公司管理层关注三个趋势：第一，公司主力业务大直径硅材料的毛利率仍然保持在60个点以上，继续保 持着领先的盈利能力，本季度公司的毛利率继续提升；第二，公司成长型业 ...

"综上，市场机会窗口敞开，公司业绩弹性有望实现。"神工股份表示，分析2025年前三季度经营情况， 公司管理层关注三个趋势：第一，公司主力业务大直径硅材料的毛利率仍然保持在60个点以上，继续保 持着领先的盈利能力，本季度公司的毛利率继续提升；第二，公司成长型业务硅零部件占公司总营收的 比重持续超过大直径硅材料，公司第二增长曲线进一步强化。公司已经从一家原材料公司逐步转变为一 家植根中国本土市场的"材料+零部件"公司；第三，以上两项业务的融合，"自产材料+零部件"，有望改 变公司业绩"周期性"的特点，"成长性"将日益明显。 神工股份注意到，半导体硅片产业在因时而变。在8英寸轻掺抛光硅片领域，具备全球竞争优势和寡头 垄断地位的日本厂商，正在将更多产能调配至12英寸轻掺抛光硅片，以在不额外增加资本开支的前提 下，改善其盈利能力。考虑到中国本土8英寸轻掺硅片的潜在市场需求仍然存在增长，日本厂商的动向 有望扩大国产化空间。公司作为国内少数具备8英寸轻掺抛光硅片技术和生产能力的企业，有望在行业 供求关系的变动中，发挥自身独特技术优势，优化变动成本，改善竞争地位。公司已在第三季度投入资 源，针对下游评估的实际需求，小幅增加硅 ...

招商上证科创板综合ETF联接A（023739）基金经理为侯昊、房俊一。 截至发稿，侯昊累计任职时间8年66天，现任基金资产总规模554.59亿元，任职期间最佳基金回报 758.66%， 任职期间最差基金回报-61.23%。 房俊一累计任职时间364天，现任基金资产总规模62.86亿元，任职期间最佳基金回报54.13%， 任职期 间最差基金回报6.7%。 10月24日，神工股份涨5.15%，截至发稿，报45.97元/股，成交1.10亿元，换手率1.43%，总市值78.29亿 元。 资料显示，锦州神工半导体股份有限公司位于辽宁省锦州市太和区中信路46号甲，成立日期2013年7月 24日，上市日期2020年2月21日，公司主营业务涉及半导体级单晶硅材料的研发、生产和销售。主营业 务收入构成为：硅零部件53.86%，大直径硅材料44.37%，其中:16英寸以上24.07%，其中:16英寸以下 20.30%，半导体大尺寸硅片1.44%，其他0.33%。 从基金十大重仓股角度 数据显示，招商基金旗下1只基金重仓神工股份。招商上证科创板综合ETF联接A（023739）二季度持有 股数200股，占流通股的比例为0.0001% ...

数据显示，长信基金旗下1只基金重仓神工股份。长信睿进混合A（519957）二季度持有股数40万股， 占基金净值比例为3.55%，位居第三大重仓股。根据测算，今日浮亏损失约103.6万元。 10月17日，神工股份跌5.22%，截至发稿，报46.98元/股，成交1.30亿元，换手率1.59%，总市值80.01亿 元。 资料显示，锦州神工半导体股份有限公司位于辽宁省锦州市太和区中信路46号甲，成立日期2013年7月 24日，上市日期2020年2月21日，公司主营业务涉及半导体级单晶硅材料的研发、生产和销售。主营业 务收入构成为：硅零部件53.86%，大直径硅材料44.37%，其中:16英寸以上24.07%，其中:16英寸以下 20.30%，半导体大尺寸硅片1.44%，其他0.33%。 从基金十大重仓股角度 责任编辑：小浪快报 长信睿进混合A（519957）成立日期2015年7月6日，最新规模79.39万。今年以来收益25.94%，同类排 名3453/8160；近一年收益25.95%，同类排名3753/8021；成立以来收益0.07%。 长信睿进混合A（519957）基金经理为张思韡。 风险提示：市场有风险，投资需谨 ...

10月14日，神工股份涨5.38%，截至发稿，报52.50元/股，成交4.02亿元，换手率4.58%，总市值89.41亿 元。 资料显示，锦州神工半导体股份有限公司位于辽宁省锦州市太和区中信路46号甲，成立日期2013年7月 24日，上市日期2020年2月21日，公司主营业务涉及半导体级单晶硅材料的研发、生产和销售。主营业 务收入构成为：硅零部件53.86%，大直径硅材料44.37%，其中:16英寸以上24.07%，其中:16英寸以下 20.30%，半导体大尺寸硅片1.44%，其他0.33%。 长信睿进混合A（519957）成立日期2015年7月6日，最新规模79.39万。今年以来收益26.38%，同类排 名3571/8162；近一年收益23.94%，同类排名3944/8015；成立以来收益0.42%。 长信睿进混合A（519957）基金经理为张思韡。 截至发稿，张思韡累计任职时间1年131天，现任基金资产总规模3.58亿元，任职期间最佳基金回报 28.94%， 任职期间最差基金回报28.78%。 风险提示：市场有风险，投资需谨慎。本文为AI大模型自动发布，任何在本文出现的信息（包括但不 限于个股、评论、预测 ...

Group 1: Market Activity - 28 stocks had closing orders exceeding 100 million yuan, indicating strong market interest [2] - The top three stocks by closing order volume were 蓝丰生化 (51.82 million hands), 启迪环境 (36.68 million hands), and 华软科技 (33.88 million hands) [2] - The top three stocks by closing order amount were 北方华创 (874 million yuan), 通富微电 (603 million yuan), and 张江高科 (503 million yuan) [2] Group 2: Company Performance - 北方华创 reported a revenue of 16.142 billion yuan for the first half of 2025, a year-on-year increase of 29.51%, with a net profit of 3.208 billion yuan, up 14.97% [3] - 华软科技 is focusing on the light-sensitive resin business, currently producing light-initiators in small batches based on customer orders [7] - 张江高科 achieved a contract sales area of 36,300 square meters in the first half of 2025, with a contract sales amount of 1.129 billion yuan, reflecting a year-on-year increase of 55.43% [9] Group 3: Sector Trends - The semiconductor sector saw a surge in stock prices, with companies like 神工股份, 江丰电子, and 通富微电 experiencing significant gains [4] - The光刻胶 sector is also witnessing growth, with companies like 联合化学 and 华软科技 leading in the market [7] - The real estate sector is active, with stocks like 渝开发 and 张江高科 showing strong performance in sales and project development [9] Group 4: Investment Activity - Eight stocks on the龙虎榜 had net purchases exceeding 100 million yuan, with 通富微电 leading at 515 million yuan [11] - Institutional buying was notable in stocks like 汇成股份 and 北方华创, indicating strong interest from institutional investors [11]

9月23日，神工股份盘中下跌2.01%，截至10:22，报34.05元/股，成交8775.74万元，换手率1.48%，总市 值57.99亿元。 截至6月30日，神工股份股东户数1.36万，较上期增加13.79%；人均流通股12514股，较上期减少 12.12%。2025年1月-6月，神工股份实现营业收入2.09亿元，同比增长66.53%；归母净利润4883.79万 元，同比增长925.55%。 分红方面，神工股份A股上市后累计派现1.34亿元。近三年，累计派现2870.16万元。 责任编辑：小浪快报 资金流向方面，主力资金净流入184.69万元，特大单买入364.85万元，占比4.16%，卖出270.98万元，占 比3.09%；大单买入2728.50万元，占比31.09%，卖出2637.67万元，占比30.06%。 神工股份今年以来股价涨45.67%，近5个交易日跌1.16%，近20日跌9.08%，近60日涨6.11%。 资料显示，锦州神工半导体股份有限公司位于辽宁省锦州市太和区中信路46号甲，成立日期2013年7月 24日，上市日期2020年2月21日，公司主营业务涉及半导体级单晶硅材料的研发、生产和销售。 ...

Company Performance - In the first half of 2025, the company achieved operating revenue of 209 million yuan, a year-on-year increase of 66.53% [1] - The net profit attributable to shareholders reached 48.84 million yuan, reflecting a significant year-on-year growth of 925.55% [1] - The growth in performance is primarily attributed to the recovery of the semiconductor industry and an increase in orders [1] Business Segments - The large-diameter silicon materials segment generated operating revenue of 92.53 million yuan [1] - Revenue from silicon component products surged to 112.31 million yuan, nearing the total revenue of 118.49 million yuan for the entire year of 2024, indicating a continued growth trend [1] - The semiconductor large-size silicon wafer business is still in the process of process optimization and customer certification, and has not yet achieved profitability [1] Market Outlook - The company recognizes a strong demand for high-end storage chips, with integrated circuit manufacturers increasing capacity utilization and capital expenditures [2] - Domestic semiconductor supply chain security needs are urgent, and local equipment manufacturers are improving their technology to catch up with global standards [2] - The company plans to expand production steadily and increase revenue from silicon component products, while also addressing the localized demand from downstream customers [2] Industry Forecast - SEMI predicts that global semiconductor manufacturing equipment sales will reach 125.5 billion USD in 2025, a year-on-year increase of 7.4% [2] - Sales are expected to further rise to a new high of 138.1 billion USD in 2026, marking three consecutive years of growth [2] Strategic Initiatives - The company aims to enhance its technology and management to meet the expanding downstream demand in the next semiconductor upcycle [3] - The "Silicon Material Expansion Project for Integrated Circuit Etching Equipment" will increase production capacity for etching silicon materials, reinforcing the company's competitive position globally [3] - The company will optimize its product structure based on market demand, focusing on increasing the proportion of high-margin large-diameter products of 16 inches and above [3]

Core Viewpoint - The report highlights the significant growth in revenue and net profit for Jinzhou Shengong Semiconductor Co., Ltd. in the first half of 2025, driven by the recovery of the semiconductor industry and increasing domestic demand for chip manufacturing [3][5][8]. Company Overview and Financial Indicators - Jinzhou Shengong Semiconductor Co., Ltd. reported a revenue of 208.53 million yuan, a 66.53% increase compared to the same period last year [3][5]. - The total profit reached 63.85 million yuan, marking an 884.76% increase year-on-year [3][5]. - The net profit attributable to shareholders was 48.84 million yuan, up 925.55% from the previous year [3][5]. - The company's net assets at the end of the reporting period were 1.83 billion yuan, a 2.03% increase from the end of the previous year [3][5]. Industry and Business Analysis - The global semiconductor market is expected to grow by 11.2% in 2025, with logic chip markets growing by 23.9% and storage chip markets by 11.7% [5][6]. - The company is positioned in the upstream segment of the semiconductor supply chain, which is closely tied to the industry's overall performance [5][6]. - The demand for large-diameter silicon materials is anticipated to increase due to the overall growth of the semiconductor market and stricter requirements for chip manufacturing processes [10]. Operational Performance - The company achieved significant revenue from large-diameter silicon materials, totaling 92.53 million yuan [6][8]. - The silicon component products experienced substantial growth due to advancements in domestic equipment technology [6][8]. - The company is focusing on expanding production capacity based on customer orders and industry demand growth [8][9]. Research and Development - The company emphasizes R&D investment, achieving advancements in silicon wafer technology, particularly in TTV control during the grinding process [8][15]. - The company has established a robust R&D system to align with industry trends and customer needs [8][15]. Market Expansion - The company is optimizing its sales structure for large-diameter silicon materials and has begun supplying products to leading domestic storage IC manufacturers [9][11]. - The company is actively working on meeting the domestic market's demand for silicon materials, particularly in the context of the national strategy for semiconductor material localization [10][11].