半导体晶圆代工2.0
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机构:全球第二季度晶圆代工2.0市场 台积电市占增至38%创高
Jing Ji Ri Bao· 2025-09-15 23:13
Group 1 - The global semiconductor foundry market (Foundry 2.0) is expected to see a revenue growth of 19% year-on-year by Q2 2025, driven primarily by advanced processes and advanced packaging [1] - TSMC's market share is projected to increase from 31% in Q2 2024 to 38% in Q2 2025, attributed to the ramp-up of 3nm technology and CoWoS expansion [1] - The OSAT industry is expected to accelerate its revenue growth rate from 5% to 11%, with notable contributions from companies like ASE and KYEC, the latter benefiting from AI GPU demand with over 30% year-on-year growth [1] Group 2 - Advanced packaging technology is becoming increasingly important, with chip manufacturers expected to rely on it to enhance chip performance [2] - The third quarter growth drivers include the traditional consumer electronics peak season, accelerated AI applications and orders, and current subsidy policies in mainland China [2] - Foundry 2.0 is defined as a transformation from traditional foundry services to a technology integration platform, encompassing pure foundry, non-memory IDM, OSAT, and photomask manufacturers [2]
机构:Q1全球半导体晶圆代工2.0市场收入722.9亿美元 同增13%
news flash· 2025-06-24 10:18
Core Insights - The global semiconductor foundry 2.0 market revenue reached $72.29 billion in Q1 2025, reflecting a year-on-year growth of 13% driven by increased demand for artificial intelligence and high-performance computing chips [1] Industry Summary - The growth in the semiconductor foundry market is primarily attributed to the rising demand for advanced nodes (3nm, 4nm/5nm) and advanced packaging technologies [1]