Core Insights - Semiconductor manufacturing company SMIC has applied for a patent titled "Semiconductor Structure and Its Formation Method," with publication number CN120529616A, filed on February 2024 [1] - The patent describes a semiconductor structure that includes a substrate with channel and source-drain regions, an insulating layer, a channel structure layer, a gate structure, and a source-drain doping layer [1] Company Overview - SMIC was established in 2000 and is located in Shanghai, primarily engaged in the manufacturing of computers, communications, and other electronic devices [1] - The company has a registered capital of 244 million USD [1] - SMIC has made investments in 4 companies, participated in 127 bidding projects, and holds 150 trademark records and 5000 patent records, along with 449 administrative licenses [1]

Core Insights - Semiconductor companies, specifically SMIC, are actively pursuing innovation through patent applications, indicating a focus on enhancing semiconductor structures and methods [1][2] Company Overview - SMIC Beijing was established in 2002, primarily engaged in the manufacturing of computers, communications, and other electronic devices, with a registered capital of 100 million USD [1] - SMIC Shanghai was founded in 2000, also focusing on the same sectors, with a registered capital of 244 million USD [2] Patent Application - SMIC has applied for a patent titled "Semiconductor Structure and Its Formation Method," published under CN119920780A, with an application date of October 2023 [1] - The patent aims to improve device functionality and increase circuit diversity in semiconductor structures [1] Investment and Projects - SMIC Beijing has made one external investment and participated in 51 bidding projects, holding 5000 patent records and 226 administrative licenses [1] - SMIC Shanghai has invested in four companies, engaged in 117 bidding projects, and possesses 149 trademark records along with 5000 patent records and 443 administrative licenses [2]

Core Points - Semiconductor companies, including SMIC Beijing and SMIC Shanghai, have applied for a patent titled "Semiconductor Structure and Its Formation Method" with publication number CN 119833523 A, filed on October 2023 [1] - The patent describes a method for forming a semiconductor structure that enhances device integration by reducing height differences on the surface of wafers and minimizing the chip area in the horizontal direction [1] Company Overview - SMIC Beijing was established in 2002 and is primarily engaged in the manufacturing of computers, communications, and other electronic devices, with a registered capital of 100 million USD [2] - The company has made one external investment, participated in 51 bidding projects, and holds approximately 5000 patent records, along with 226 administrative licenses [2]