半导体结构的制备方法
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晶芯成取得半导体结构制备方法相关专利
Sou Hu Cai Jing· 2026-01-27 00:34
Group 1 - The State Intellectual Property Office of China has granted a patent titled "Preparation Method of Semiconductor Structure, Semiconductor Structure, Semiconductor Device" to Jingxin Cheng (Beijing) Technology Co., Ltd. and Hefei Jinghe Integrated Circuit Co., Ltd. The patent authorization announcement number is CN120076391B, with an application date of April 2025 [1] - Jingxin Cheng (Beijing) Technology Co., Ltd. was established in 2020 and is primarily engaged in technology promotion and application services. The company has a registered capital of 200,000 RMB and holds 245 patents along with one administrative license [1] - Hefei Jinghe Integrated Circuit Co., Ltd. was founded in 2015 and focuses on the manufacturing of computers, communications, and other electronic devices. The company has a registered capital of 2,007,591,697 RMB, has invested in 10 enterprises, participated in 636 bidding projects, holds 41 trademark records, and possesses 1,586 patents along with 22 administrative licenses [1]