Group 1 - The State Intellectual Property Office of China has granted a patent titled "Preparation Method of Semiconductor Structure, Semiconductor Structure, Semiconductor Device" to Jingxin Cheng (Beijing) Technology Co., Ltd. and Hefei Jinghe Integrated Circuit Co., Ltd. The patent authorization announcement number is CN120076391B, with an application date of April 2025 [1] - Jingxin Cheng (Beijing) Technology Co., Ltd. was established in 2020 and is primarily engaged in technology promotion and application services. The company has a registered capital of 200,000 RMB and holds 245 patents along with one administrative license [1] - Hefei Jinghe Integrated Circuit Co., Ltd. was founded in 2015 and focuses on the manufacturing of computers, communications, and other electronic devices. The company has a registered capital of 2,007,591,697 RMB, has invested in 10 enterprises, participated in 636 bidding projects, holds 41 trademark records, and possesses 1,586 patents along with 22 administrative licenses [1]

Group 1 - The core viewpoint of the article highlights that Semiconductor Manufacturing International Corporation (SMIC) has obtained a patent for "semiconductor structure, formation method, and mask" with the announcement number CN114068558B, applied for in July 2020 [1] Group 2 - SMIC (Shanghai) was established in 2000, located in Shanghai, with a registered capital of 244 million USD. The company has made investments in 4 enterprises, participated in 127 bidding projects, and holds 150 trademark records and 5000 patent records, along with 446 administrative licenses [1] - SMIC (Beijing) was established in 2002, located in Beijing, with a registered capital of 100 million USD. The company has invested in 1 enterprise, participated in 53 bidding projects, holds 5000 patent records, and has 225 administrative licenses [1]