金融界2025年8月5日消息，国家知识产权局信息显示，中芯国际集成电路制造（上海）有限公司、中芯 国际集成电路制造（北京）有限公司取得一项名为"半导体结构的形成方法"的专利，授权公告号 CN114334619B，申请日期为2020年10月。 中芯国际集成电路制造（北京）有限公司，成立于2002年，位于北京市，是一家以从事计算机、通信和 其他电子设备制造业为主的企业。企业注册资本100000万美元。通过天眼查大数据分析，中芯国际集成 电路制造（北京）有限公司共对外投资了1家企业，参与招投标项目52次，专利信息5000条，此外企业 还拥有行政许可226个。 来源：金融界 天眼查资料显示，中芯国际集成电路制造（上海）有限公司，成立于2000年，位于上海市，是一家以从 事计算机、通信和其他电子设备制造业为主的企业。企业注册资本244000万美元。通过天眼查大数据分 析，中芯国际集成电路制造（上海）有限公司共对外投资了4家企业，参与招投标项目127次，财产线索 方面有商标信息150条，专利信息5000条，此外企业还拥有行政许可451个。 ...

Core Viewpoint - Semiconductor manufacturing companies, specifically SMIC, are advancing their technology by applying for a new patent related to semiconductor structure formation, which aims to improve product yield and reduce sensitivity to environmental impurities [1][2]. Group 1: Patent Application - SMIC has applied for a patent titled "Method for Forming Semiconductor Structure," with publication number CN120261287A, filed on January 2024 [1]. - The patent describes a process that includes forming a silicon layer on a substrate, followed by a metal layer, and involves multiple heat treatments and acid washes to create a metal silicide layer [1]. - The new method enhances the growth of metal silicide by minimizing the impact of environmental factors, thus improving product yield [1]. Group 2: Company Overview - SMIC Beijing was established in 2002, focusing on the manufacturing of computers, communications, and other electronic devices, with a registered capital of 100 million USD [2]. - SMIC Shanghai was founded in 2000, also specializing in similar manufacturing sectors, with a registered capital of 244 million USD [2]. - Both companies have significant patent portfolios, with each holding around 5,000 patents, and have participated in numerous bidding projects [2].