声明：市场有风险，投资需谨慎。本文为AI基于第三方数据生成，仅供参考，不构成个人投资建议。 来源：市场资讯 国家知识产权局信息显示，中芯国际集成电路制造（上海）有限公司、中芯国际集成电路制造（北京） 有限公司取得一项名为"半导体结构的形成方法"的专利，授权公告号CN114823291B，申请日期为2021 年1月。 天眼查资料显示，中芯国际集成电路制造（上海）有限公司，成立于2000年，位于上海市，是一家以从 事计算机、通信和其他电子设备制造业为主的企业。企业注册资本244000万美元。通过天眼查大数据分 析，中芯国际集成电路制造（上海）有限公司共对外投资了4家企业，参与招投标项目129次，财产线索 方面有商标信息150条，专利信息5000条，此外企业还拥有行政许可446个。 中芯国际集成电路制造（北京）有限公司，成立于2002年，位于北京市，是一家以从事计算机、通信和 其他电子设备制造业为主的企业。企业注册资本100000万美元。通过天眼查大数据分析，中芯国际集成 电路制造（北京）有限公司共对外投资了1家企业，参与招投标项目53次，专利信息5000条，此外企业 还拥有行政许可225个。 ...

Core Insights - Semiconductor manufacturing company SMIC (Semiconductor Manufacturing International Corporation) has obtained a patent for a method of forming semiconductor structures, with the patent number CN120076397B, applied for on November 2023 [1] Company Overview - SMIC was established in 2000 and is located in Shanghai, primarily engaged in the manufacturing of computers, communications, and other electronic devices [1] - The company has a registered capital of 244 million USD [1] - SMIC has made investments in 4 companies and participated in 127 bidding projects [1] - The company holds 150 trademark registrations and 5000 patent records, along with 446 administrative licenses [1]

Group 1 - The core point of the article is that Semiconductor Manufacturing International Corporation (SMIC) has obtained a patent for a method of forming semiconductor structures, which could enhance its technological capabilities in the semiconductor industry [1] Group 2 - SMIC Shanghai was established in 2000, has a registered capital of 244 million USD, and has participated in 127 bidding projects [1] - SMIC Beijing was established in 2002, has a registered capital of 100 million USD, and has participated in 52 bidding projects [1] - Both SMIC Shanghai and SMIC Beijing have a significant number of patents, with each holding around 5000 patent records [1]

Core Viewpoint - Semiconductor manufacturing companies, specifically SMIC, are advancing their technology by applying for a new patent related to semiconductor structure formation, which aims to improve product yield and reduce sensitivity to environmental impurities [1][2]. Group 1: Patent Application - SMIC has applied for a patent titled "Method for Forming Semiconductor Structure," with publication number CN120261287A, filed on January 2024 [1]. - The patent describes a process that includes forming a silicon layer on a substrate, followed by a metal layer, and involves multiple heat treatments and acid washes to create a metal silicide layer [1]. - The new method enhances the growth of metal silicide by minimizing the impact of environmental factors, thus improving product yield [1]. Group 2: Company Overview - SMIC Beijing was established in 2002, focusing on the manufacturing of computers, communications, and other electronic devices, with a registered capital of 100 million USD [2]. - SMIC Shanghai was founded in 2000, also specializing in similar manufacturing sectors, with a registered capital of 244 million USD [2]. - Both companies have significant patent portfolios, with each holding around 5,000 patents, and have participated in numerous bidding projects [2].