Core Viewpoint - Glass is transitioning from a background consumable to a core component in semiconductor packaging, providing essential substrates and dielectric materials for advanced applications [2][4]. Group 1: Glass in Semiconductor Manufacturing - Glass substrates are increasingly used in modern wafer fabs, supporting silicon wafers and forming sealed MEMS caps [2]. - The demand for higher bandwidth and power density in AI and high-performance computing (HPC) is driving the need for advanced packaging solutions, where glass can offer better performance than traditional organic laminates and silicon interposers [3][4]. Group 2: Market Potential and Applications - The low dielectric loss and optical transparency of glass make it a significant growth driver beyond computing packaging, particularly in photonic applications [6]. - Co-packaged optical devices (CPO) are being developed to simplify fiber connections, leveraging glass's capabilities to support electrical redistribution layers and low-loss waveguides [6]. Group 3: Supply Chain Insights - The transition from pilot lines to mass production for glass substrates hinges on advancements in laser drilling, copper filling, and panel processing technologies [8]. - Understanding the competitive landscape with silicon and improved organic materials is crucial, as foundries push for mixed wafer-level redistribution, which may diminish glass's advantages [8].