Core Insights - The company achieved a revenue of 80.192 billion yuan in the first half of 2025, representing a year-on-year growth of 90.05% [1][5] - Net profit attributable to shareholders reached 799 million yuan, up 34.87% year-on-year, while the net profit excluding non-recurring items grew by 61.1% [3][5] - The gross profit margin decreased to 4.51%, down 3.13 percentage points from the previous year [3][5] Revenue Breakdown - Server product revenue was 75.286 billion yuan, accounting for 93.88% of total revenue, with a gross margin of 4.32% [4][5] - Revenue from storage and switching products was 4.837 billion yuan, representing 6.03% of total revenue, with a gross margin of 7.59% [4][5] - Other products generated 69.612 million yuan, contributing 0.09% to total revenue, showing a decline of 42.45% year-on-year [2] Financial Performance - Operating cash flow was -55.76 billion yuan, a decline of 22.99% compared to -45.33 billion yuan in the previous year, primarily due to increased working capital requirements from business expansion [6] - The company’s total assets reached 107.007 billion yuan, a 50.23% increase from the previous year [1] - Short-term borrowings surged from 1.395 billion yuan at the beginning of the year to 12.397 billion yuan, reflecting increased funding needs due to server sales growth [5] Research and Development - R&D expenses amounted to 15.32 billion yuan, a year-on-year increase of 7.38%, indicating a continued commitment to technological innovation [4][6] - The company has accumulated over 17,000 valid patents globally, enhancing its competitive edge in the market [6]

Group 1: Company Operations and Capacity Utilization - The company's overall business operations are normal, with a comprehensive capacity utilization rate remaining relatively high. The PCB business benefits from sustained demand in computing power and automotive electronics, maintaining high capacity utilization [1] - The packaging substrate business has seen an improvement in capacity utilization compared to Q4 2024 and Q1 2025 due to a relative recovery in the storage sector [1] Group 2: PCB Business Applications and Market Focus - The PCB business focuses on high-end PCB product design, development, and manufacturing, primarily serving communication devices, data centers, automotive electronics, and industrial control sectors [1] - The demand for PCB products in high-speed communication networks, data center switches, AI accelerator cards, and storage devices has increased since 2024, driven by the urgent need for high-performance products [2] Group 3: Expansion Plans and Investments - The company has factories in Shenzhen, Wuxi, Nantong, and a new facility under construction in Thailand. It is enhancing existing factories through technological upgrades and is progressing with the Nantong Phase IV project to build an HDI technology platform [3] - The total investment for the Thailand factory is 1.274 billion RMB, aimed at developing high-layer and HDI PCB technologies to expand overseas market reach [4] Group 4: Packaging Substrate Business Development - The packaging substrate products cover a wide range, including module packaging substrates and storage packaging substrates, with demand improving in Q1 2025 compared to Q4 2024, primarily due to increased demand for storage products [5] - The FC-BGA packaging substrate has achieved mass production capabilities for products with 20 layers or fewer, with ongoing development for higher-layer products [6] Group 5: Raw Material Price Changes and Impact - Key raw materials include copper-clad laminates, prepregs, copper foil, gold salt, and inks. In Q1 2025, prices for some raw materials increased year-on-year due to commodity price fluctuations [7] Group 6: Technology and Industry Trends - The company is actively monitoring industry trends related to PTFE materials in high-frequency applications, having developed mature PCB products for communication and automotive sectors [7]