微软发动新一波"冷革命"，宣布正发展"微流体（microfluidics）"技术，透过水冷液直接流经在芯片蚀 刻出的微小管道来散热，效果优于现有解热方案，有利开发更强大的芯片，并且不再需要既有散热元 件，恐冲击健策、奇鋐、双鸿等台湾散热相关厂商后市。 微软的微流体技术可能颠覆当下AI伺服器散热技术，改从直接从芯片端结构下手，不再需要均热片、 水冷板等元件，将导致现有散热厂无生意可做，震撼业界。相关消息冲击，专门制造资料中心冷却系统 的Vertiv周二股价收盘大跌6.2%。Eaton和Modine Manufacturing也分别下跌2.6%和3.4%。 微软的"微流体"技术是透过冷却液直接流经芯片蚀刻出的微小管道，直接在芯片上散热。由于冷却液直 接在芯片上散热，因此在相对高温（在某些情况下高达摄氏70度）下依然有效。 微软上周在总部园区展示显微镜下的这项技术，并表示迄今的测试已显示，这种技术效能明显优于传统 散绕方式，可望允许微软借由堆叠方式，开发效能更强大的芯片。 微软也能借由"微流体"技术，刻意运用"超频"让芯片在使用高峰期过热，换取更佳效能。微软技术院士 柯礼温（Jim Kleewein）指出，微软不必 ...

Core Viewpoint - The explosive growth in AI computing power demand is driving the advancement of liquid cooling technology towards higher-end solutions [1] Group 1: Microfluidic Cooling Technology - Microsoft has developed microfluidic cooling technology that delivers cooling liquid directly to the chip's interior through tiny channels, significantly improving cooling efficiency [3] - The cooling efficiency of this technology is three times higher than existing cooling plates, reducing the maximum temperature rise of chips by 65%, which supports denser data center deployments and extends hardware lifespan [3] - AI plays a crucial role in this technology, as Microsoft collaborated with Swiss startup Corintis to design biomimetic structures for precise cooling liquid coverage and to identify thermal signals for adaptive cooling [3][4] Group 2: Technical Challenges and Future Prospects - The design of internal channels in chips poses technical challenges, requiring a balance between sufficient depth to prevent blockage and avoiding excessive etching that could cause breakage [4] - Microsoft has iterated on this technology over a year, and it may enable new chip architectures, such as 3D chips, which generate significant heat [4] - Future research will focus on integrating microfluidic cooling technology into Microsoft's chip products, with advantages in cost and reliability [4] Group 3: Competitive Landscape and Market Implications - Other tech giants, such as NVIDIA, are also pushing for advancements in liquid cooling technologies, with NVIDIA requesting suppliers to develop new micro-channel liquid cooling plate technology [4] - The traditional cold plate liquid cooling method remains prevalent, characterized by high maturity and widespread application, which may dominate the market in the short term due to its operational simplicity and total cost of ownership advantages [5] - The transition to new liquid cooling solutions may alter the supply chain landscape, presenting opportunities for domestic liquid cooling supply chain companies, including traditional VC firms, liquid cooling module manufacturers, heat sink manufacturers, and 3D printing firms [5]