10月21日，中微半导涨6.17%，截至发稿，报36.82元/股，成交1.91亿元，换手率3.20%，总市值147.41 亿元。 华夏中证1000ETF（159845）成立日期2021年3月18日，最新规模382.27亿。今年以来收益22.8%，同类 排名2080/4218；近一年收益27.27%，同类排名1616/3868；成立以来收益23.56%。 华夏中证1000ETF（159845）基金经理为赵宗庭。 截至发稿，赵宗庭累计任职时间8年190天，现任基金资产总规模3058.09亿元，任职期间最佳基金回报 119.36%， 任职期间最差基金回报-32.63%。 风险提示：市场有风险，投资需谨慎。本文为AI大模型自动发布，任何在本文出现的信息（包括但不 限于个股、评论、预测、图表、指标、理论、任何形式的表述等）均只作为参考，不构成个人投资建 议。 责任编辑：小浪快报 资料显示，中微半导体(深圳)股份有限公司位于广东省深圳市前海深港合作区南山街道桂湾三路91号景 兴海上大厦2101,香港铜锣湾勿地臣街1号时代广场2座31楼，成立日期2001年6月22日，上市日期2022年 8月5日，公司主营业务涉及数模混合信 ...

Group 1 - Core viewpoint: Zhongwei Semiconductor's stock increased by 5.01% to 35.66 CNY per share, with a total market capitalization of 14.277 billion CNY as of the report date [1] - Company overview: Zhongwei Semiconductor, established on June 22, 2001, specializes in the research, design, and sales of analog mixed-signal chips and analog chips, with its main revenue sources being consumer electronics chips (40.58%), small appliance control chips (30.66%), large appliances and industrial control chips (25.25%), automotive electronics chips (3.44%), and others (0.07%) [1] Group 2 - Major shareholders: Huaxia Fund's Huaxia CSI 1000 ETF (159845) entered the top ten circulating shareholders, holding 659,000 shares, which is 0.45% of the circulating shares, with an estimated floating profit of approximately 1.1202 million CNY [2] - Fund performance: Huaxia CSI 1000 ETF has a total asset size of 38.227 billion CNY, with a year-to-date return of 21.9% and a one-year return of 31.95%, ranking 2057 out of 4218 and 1561 out of 3865 in its category, respectively [2]

Core Insights - On October 13, Zhongwei Semiconductor's stock rose by 4.06%, with a trading volume of 556 million yuan [1] - The company reported a financing buy-in of 70.02 million yuan and a net financing outflow of 1.85 million yuan on the same day [1] - As of October 13, the total financing and securities lending balance for Zhongwei Semiconductor was 452 million yuan, indicating a high level of financing activity [1] Financing and Securities Lending - The financing buy-in for Zhongwei Semiconductor on October 13 was 70.02 million yuan, with a current financing balance of 451 million yuan, accounting for 6.80% of the market capitalization [1] - The financing balance is above the 90th percentile of the past year, indicating a high level of investor interest [1] - On the same day, the company repaid 500 shares of securities lending and sold 2,527 shares, with a total selling amount of 99,200 yuan [1] - The securities lending balance was 1.038 million yuan, also above the 90th percentile of the past year [1] Company Performance - As of June 30, Zhongwei Semiconductor had 22,600 shareholders, a decrease of 0.66% from the previous period [2] - The average number of circulating shares per shareholder increased by 0.66% to 6,540 shares [2] - For the first half of 2025, the company achieved a revenue of 504 million yuan, representing a year-on-year growth of 17.56% [2] - The net profit attributable to the parent company was 86.47 million yuan, showing a significant year-on-year increase of 100.99% [2] Dividend and Shareholding Structure - Since its A-share listing, Zhongwei Semiconductor has distributed a total of 380 million yuan in dividends [3] - As of June 30, 2025, the top ten circulating shareholders included new entrants such as Southern Science and Technology Innovation Board 3-Year Open Mixed Fund, holding 1.2589 million shares [3] - Hong Kong Central Clearing Limited increased its holdings by 379,700 shares, now holding 1.1954 million shares [3] - Southern CSI 1000 ETF and Huaxia CSI 1000 ETF also increased their holdings, with 1.1116 million and 659,000 shares respectively [3]

Core Insights - On October 10, Zhongwei Semiconductor experienced a decline of 7.91% in stock price, with a trading volume of 678 million yuan [1] - The company reported a financing buy-in amount of 97.30 million yuan and a net financing buy of 9.39 million yuan on the same day [1] - As of October 10, the total financing and securities lending balance for Zhongwei Semiconductor was 454 million yuan, indicating a high level of financing activity [1] Financing Overview - The financing buy-in on October 10 was 97.30 million yuan, with a current financing balance of 453 million yuan, representing 7.10% of the circulating market value [1] - The financing balance is above the 90th percentile level for the past year, indicating a high level of investor interest [1] - In terms of securities lending, 1,600 shares were repaid and 400 shares were sold on October 10, with a total selling amount of 15,100 yuan [1] Company Profile - Zhongwei Semiconductor (Shenzhen) Co., Ltd. was established on June 22, 2001, and listed on August 5, 2022 [1] - The company specializes in the research, design, and sales of mixed-signal chips and analog chips, with revenue contributions from various segments: 40.58% from consumer electronics chips, 30.66% from small appliance control chips, 25.25% from large appliances and industrial control chips, 3.44% from automotive electronics chips, and 0.07% from other sources [1] Shareholder Information - As of June 30, the number of shareholders for Zhongwei Semiconductor was 22,600, a decrease of 0.66% from the previous period [2] - The average number of circulating shares per shareholder increased by 0.66% to 6,540 shares [2] - The company has distributed a total of 380 million yuan in dividends since its A-share listing [3]

9月24日，中微半导涨5.02%，截至发稿，报35.58元/股，成交2.20亿元，换手率3.75%，总市值142.45亿 元。 资料显示，中微半导体(深圳)股份有限公司位于广东省深圳市前海深港合作区南山街道桂湾三路91号景 兴海上大厦2101，成立日期2001年6月22日，上市日期2022年8月5日，公司主营业务涉及数模混合信号 芯片、模拟芯片的研发、设计与销售。主营业务收入构成为：消费电子芯片40.58%，小家电控制芯片 30.66%，大家电和工业控制芯片25.25%，汽车电子芯片3.44%，其他0.07%。 从中微半导十大流通股东角度 数据显示，华夏基金旗下1只基金位居中微半导十大流通股东。华夏中证1000ETF（159845）二季度新 进十大流通股东，持有股数65.9万股，占流通股的比例为0.45%。根据测算，今日浮盈赚取约112.02万 元。 华夏中证1000ETF（159845）成立日期2021年3月18日，最新规模382.27亿。今年以来收益25.57%，同 类排名1956/4220；近一年收益67.36%，同类排名1299/3814；成立以来收益26.34%。 华夏中证1000ETF（15984 ...

Group 1 - The core viewpoint of the news highlights the recent performance and financial metrics of Zhongwei Semiconductor, including stock price movements and trading volumes [1] - On September 1, Zhongwei Semiconductor's stock rose by 6.32%, with a trading volume of 725 million yuan, and a net financing purchase of 403.08 million yuan [1] - As of September 1, the total margin balance for Zhongwei Semiconductor was 378 million yuan, with a financing balance of 377 million yuan, representing 6.38% of the circulating market value [1] Group 2 - As of June 30, the number of shareholders for Zhongwei Semiconductor was 22,600, a decrease of 0.66% from the previous period, while the average circulating shares per person increased by 0.66% to 6,540 shares [2] - For the first half of 2025, Zhongwei Semiconductor reported a revenue of 504 million yuan, a year-on-year increase of 17.56%, and a net profit attributable to shareholders of 86.47 million yuan, reflecting a growth of 100.99% [2] Group 3 - Since its A-share listing, Zhongwei Semiconductor has distributed a total of 380 million yuan in dividends [3] - As of June 30, 2025, among the top ten circulating shareholders, Southern Science and Technology Innovation Board 3-Year Open Mixed Fund was the fourth largest shareholder with 1.2589 million shares, marking a new entry [3] - Hong Kong Central Clearing Limited was the sixth largest shareholder with 1.1954 million shares, an increase of 379,700 shares from the previous period [3]

Core Insights - The stock of Zhongwei Semiconductor experienced a decline of 2.75% on August 29, with a trading volume of 439 million yuan [1] - The company reported a financing buy-in amount of 63.09 million yuan and a net financing buy of 4.64 million yuan on the same day [1][2] - As of June 30, 2025, Zhongwei Semiconductor achieved a revenue of 504 million yuan, reflecting a year-on-year growth of 17.56%, and a net profit of 86.47 million yuan, marking a 100.99% increase [2] Financing and Shareholding - The total financing and securities balance for Zhongwei Semiconductor reached 374 million yuan, with financing balance accounting for 6.71% of the circulating market value [1] - The company has a total of 22,600 shareholders as of June 30, 2025, with an average of 6,540 circulating shares per person, indicating a slight increase in individual holdings [2] - The company has distributed a total of 380 million yuan in dividends since its A-share listing [3] Institutional Holdings - As of June 30, 2025, the fourth largest circulating shareholder is Southern Science and Technology Innovation Board 3-Year Open Mixed Fund, holding 1.2589 million shares as a new shareholder [3] - Hong Kong Central Clearing Limited is the sixth largest circulating shareholder, increasing its holdings by 379,700 shares to 1.1954 million shares [3] - Southern CSI 1000 ETF and Huaxia CSI 1000 ETF are also among the top ten circulating shareholders, with increases in their holdings [3]

Company Overview - Zhongwei Semiconductor (Shenzhen) Co., Ltd. was established on June 22, 2001, and listed on August 5, 2022. The company is located in the Qianhai Shenzhen-Hong Kong Cooperation Zone, Nanshan District, Shenzhen, Guangdong Province. Its main business involves the research, design, and sales of mixed-signal chips and analog chips [1]. Financial Performance - For the period from January to March 2025, Zhongwei Semiconductor achieved operating revenue of 206 million yuan, representing a year-on-year growth of 0.52%. The net profit attributable to the parent company was 34.42 million yuan, reflecting a year-on-year increase of 19.40% [2]. - As of March 31, 2025, the company had a cumulative cash distribution of 380 million yuan since its A-share listing [3]. Shareholder Information - As of March 31, 2025, the number of shareholders for Zhongwei Semiconductor was 22,800, a decrease of 2.92% compared to the previous period. The average number of circulating shares per person increased by 3.01% to 6,497 shares [2]. - The top ten circulating shareholders included Southern CSI 1000 ETF, which held 879,400 shares, a decrease of 81,800 shares from the previous period. Hong Kong Central Clearing Limited was the eighth largest shareholder with 815,700 shares, down by 956,700 shares [3]. Market Activity - On August 28, Zhongwei Semiconductor's stock rose by 3.68%, with a trading volume of 690 million yuan. The financing buy-in amount for that day was 116 million yuan, while the financing repayment was 72.11 million yuan, resulting in a net financing buy-in of 44.20 million yuan. The total financing and securities lending balance reached 369 million yuan, accounting for 6.45% of the circulating market value, which is above the 90th percentile of the past year [1]. - In terms of securities lending, on August 28, the company repaid 1,100 shares and sold 400 shares, with a selling amount of 13,500 yuan. The remaining securities lending volume was 20,000 shares, with a balance of 677,700 yuan, also above the 70th percentile of the past year [1]. Revenue Composition - The revenue composition of Zhongwei Semiconductor is as follows: consumer electronics chips account for 39.43%, small appliance control chips 36.26%, large appliances and industrial control chips 21.10%, automotive electronics chips 3.11%, and other (supplementary) 0.11% [1].

Core Viewpoint - The article provides a comprehensive overview of the chip design process, emphasizing its complexity and the various stages involved in transforming electronic systems into physical integrated circuits. It highlights the importance of both front-end and back-end design, as well as the tools and methodologies used in the industry. Group 1: Basic Concepts of Chip Design - Chip design is a crucial pre-step in chip manufacturing, involving multiple stages of collaboration and strict validation [8][11] - The design process can be categorized into digital chip design and analog chip design, with a focus on digital chip design in this article [11] - The design hierarchy includes system level, register transfer level (RTL), gate level, transistor level, layout level, and mask level [11][12] Group 2: Chip Design Process - The chip design process consists of four main stages: specification design, system design, front-end design, and back-end design [25][21] - The current mainstream approach is top-down design, starting from system-level design and moving to RTL design [24] - The output of the design process includes specifications, design plans, netlists, layouts, and masks [21][23] Group 3: Front-End Design - Front-end design focuses on converting functional requirements into realizable circuit logic, ensuring functional correctness without considering physical implementation details [29] - Key steps in front-end design include HDL coding, simulation verification, logic synthesis, static timing analysis, and formal verification [52][60][68] - Tools used in front-end design include HDL simulators, logic synthesis tools, and static timing analysis tools [28] Group 4: Back-End Design - Back-end design is based on the netlist obtained from front-end design, focusing on creating the physical layout [72] - Key steps in back-end design include layout planning, physical layout, clock tree synthesis, routing, and physical verification [72][76][97] - The final output of back-end design is the GDSII file, which is used for manufacturing the chip [108] Group 5: Market and Industry Insights - The global chip design market is expected to grow at a compound annual growth rate (CAGR) of 9.8% from 2020 to 2024, with the market size surpassing $480 billion by 2024 [39] - The share of the Chinese market in chip design is rapidly increasing, rising from 19% to 28% [39] - Major players in the EDA industry include Synopsys, Cadence, and Siemens EDA, which collectively hold over 70% market share [38]