融资方面，中微半导当日融资买入9193.70万元。当前融资余额3.77亿元，占流通市值的6.38%，融资余 额超过近一年90%分位水平，处于高位。 融券方面，中微半导9月1日融券偿还4100.00股，融券卖出3200.00股，按当日收盘价计算，卖出金额 11.19万元；融券余量2.21万股，融券余额77.42万元，超过近一年80%分位水平，处于高位。 资料显示，中微半导体(深圳)股份有限公司位于广东省深圳市前海深港合作区南山街道桂湾三路91号景 兴海上大厦2101，成立日期2001年6月22日，上市日期2022年8月5日，公司主营业务涉及数模混合信号 芯片、模拟芯片的研发、设计与销售。主营业务收入构成为：消费电子芯片39.43%，小家电控制芯片 36.26%，大家电和工业控制芯片21.10%，汽车电子芯片3.11%，其他(补充)0.11%。 9月1日，中微半导涨6.32%，成交额7.25亿元。两融数据显示，当日中微半导获融资买入额9193.70万 元，融资偿还8790.63万元，融资净买入403.08万元。截至9月1日，中微半导融资融券余额合计3.78亿 元。 分红方面，中微半导A股上市后累计派现3.80亿元 ...

8月29日，中微半导跌2.75%，成交额4.39亿元。两融数据显示，当日中微半导获融资买入额6309.47万 元，融资偿还5845.23万元，融资净买入464.23万元。截至8月29日，中微半导融资融券余额合计3.74亿 元。 融资方面，中微半导当日融资买入6309.47万元。当前融资余额3.73亿元，占流通市值的6.71%，融资余 额超过近一年90%分位水平，处于高位。 机构持仓方面，截止2025年6月30日，中微半导十大流通股东中，南方科创板3年定开混合（506000）位 居第四大流通股东，持股125.89万股，为新进股东。香港中央结算有限公司位居第六大流通股东，持股 119.54万股，相比上期增加37.97万股。南方中证1000ETF（512100）位居第七大流通股东，持股111.16 万股，相比上期增加23.23万股。华夏中证1000ETF（159845）位居第十大流通股东，持股65.90万股， 为新进股东。 责任编辑：小浪快报 截至6月30日，中微半导股东户数2.26万，较上期减少0.66%；人均流通股6540股，较上期增加0.66%。 2025年1月-6月，中微半导实现营业收入5.04亿元，同比增 ...

8月28日，中微半导涨3.68%，成交额6.90亿元。两融数据显示，当日中微半导获融资买入额1.16亿元， 融资偿还7210.62万元，融资净买入4419.86万元。截至8月28日，中微半导融资融券余额合计3.69亿元。 融资方面，中微半导当日融资买入1.16亿元。当前融资余额3.69亿元，占流通市值的6.45%，融资余额 超过近一年90%分位水平，处于高位。 融券方面，中微半导8月28日融券偿还1100.00股，融券卖出400.00股，按当日收盘价计算，卖出金额 1.35万元；融券余量2.00万股，融券余额67.77万元，超过近一年70%分位水平，处于较高位。 资料显示，中微半导体(深圳)股份有限公司位于广东省深圳市前海深港合作区南山街道桂湾三路91号景 兴海上大厦2101，成立日期2001年6月22日，上市日期2022年8月5日，公司主营业务涉及数模混合信号 芯片、模拟芯片的研发、设计与销售。主营业务收入构成为：消费电子芯片39.43%，小家电控制芯片 36.26%，大家电和工业控制芯片21.10%，汽车电子芯片3.11%，其他(补充)0.11%。 截至3月31日，中微半导股东户数2.28万，较上期减少2 ...

Core Viewpoint - The article provides a comprehensive overview of the chip design process, emphasizing its complexity and the various stages involved in transforming electronic systems into physical integrated circuits. It highlights the importance of both front-end and back-end design, as well as the tools and methodologies used in the industry. Group 1: Basic Concepts of Chip Design - Chip design is a crucial pre-step in chip manufacturing, involving multiple stages of collaboration and strict validation [8][11] - The design process can be categorized into digital chip design and analog chip design, with a focus on digital chip design in this article [11] - The design hierarchy includes system level, register transfer level (RTL), gate level, transistor level, layout level, and mask level [11][12] Group 2: Chip Design Process - The chip design process consists of four main stages: specification design, system design, front-end design, and back-end design [25][21] - The current mainstream approach is top-down design, starting from system-level design and moving to RTL design [24] - The output of the design process includes specifications, design plans, netlists, layouts, and masks [21][23] Group 3: Front-End Design - Front-end design focuses on converting functional requirements into realizable circuit logic, ensuring functional correctness without considering physical implementation details [29] - Key steps in front-end design include HDL coding, simulation verification, logic synthesis, static timing analysis, and formal verification [52][60][68] - Tools used in front-end design include HDL simulators, logic synthesis tools, and static timing analysis tools [28] Group 4: Back-End Design - Back-end design is based on the netlist obtained from front-end design, focusing on creating the physical layout [72] - Key steps in back-end design include layout planning, physical layout, clock tree synthesis, routing, and physical verification [72][76][97] - The final output of back-end design is the GDSII file, which is used for manufacturing the chip [108] Group 5: Market and Industry Insights - The global chip design market is expected to grow at a compound annual growth rate (CAGR) of 9.8% from 2020 to 2024, with the market size surpassing $480 billion by 2024 [39] - The share of the Chinese market in chip design is rapidly increasing, rising from 19% to 28% [39] - Major players in the EDA industry include Synopsys, Cadence, and Siemens EDA, which collectively hold over 70% market share [38]