Core Viewpoint - Jinghe Integrated aims to deepen its international strategy, accelerate overseas business development, enhance its overall competitiveness and international brand image, and optimize its capital structure through H-share listing [2] Group 1: Company Overview - Jinghe Integrated was established in 2015 and primarily engages in 12-inch wafer foundry services [2] - The company has achieved mass production on process nodes from 150nm to 55nm, with small batch production of 40nm high-voltage OLED display driver chips and successful functional verification of 28nm logic chips [2] - Jinghe Integrated's technology capabilities include wafer foundry for display driver chips (DDIC), CMOS image sensor chips (CIS), power management chips (PMIC), microcontroller chips (MCU), and logic chips [2] Group 2: Market Position - Jinghe Integrated has successfully become the ninth largest wafer foundry globally, driven by market demand and the trend of domestic production [3] - According to TrendForce, the overall revenue of the global wafer foundry industry is expected to decrease by approximately 5.4% in Q1 2025, amounting to $36.4 billion, while Jinghe Integrated's revenue is projected to grow by 2.6% to $353 million due to urgent orders from clients [3][5] Group 3: Strategic Developments - On July 29, Jinghe Integrated introduced Huqin Technology as a strategic shareholder, transferring 120,368,109 shares (6.00% of total shares) at a price of 19.88 yuan per share, totaling approximately 2.4 billion yuan [6] - Following the share transfer, the stake of the previous major shareholder, Liching Innovation Investment Holdings, decreased from 19.08% to 13.08%, while Huqin Technology acquired a 6.00% stake [7] - Huqin Technology specializes in the research, design, production, and operation of smart hardware products, serving various industries including consumer electronics and automotive electronics [7]

Group 1 - The company plans to distribute a cash dividend of 1.00 yuan (including tax) for every 10 shares, with no bonus shares or capital increase from reserves [29][31][34] - As of the report date, the total share capital is 2,006,135,157 shares, with 62,088,500 shares deducted from the repurchase account, resulting in a total cash dividend distribution of 194,404,665.70 yuan (including tax) [29][30] - The total amount of cash dividends and share repurchases is 1,086,081,974.00 yuan, accounting for 203.83% of the net profit attributable to shareholders of the listed company for the year [29][30] Group 2 - The company primarily engages in 12-inch wafer foundry services and related services, focusing on advanced process research and application [9][10] - The company has achieved mass production of process platforms ranging from 150nm to 55nm, with ongoing development in various applications including display driver chips and logic chips [9][10] - The company has established a strong customer base, including partnerships with leading chip design companies both domestically and internationally [16] Group 3 - The semiconductor industry is experiencing rapid growth, driven by the increasing demand for integrated circuits in various sectors such as AI, 5G, and IoT [14][15] - The company is positioned in the wafer foundry sector, which is capital and technology-intensive, requiring significant investment and expertise [15][16] - The company ranks ninth globally and third among domestic companies in the wafer foundry industry, indicating a strong market position [16] Group 4 - The company reported a revenue of 924,925.23 thousand yuan, a year-on-year increase of 27.69%, and a net profit of 48,219.63 thousand yuan, a year-on-year increase of 304.65% [25] - The net profit attributable to the parent company was 53,284.06 thousand yuan, reflecting a year-on-year increase of 151.78% [25] - The operating cash flow net amount was 276,113.13 thousand yuan, an increase of 292,216.72 thousand yuan compared to the previous year [25]