Core Viewpoint - The company, Jinghe Integrated Circuit Co., Ltd., has shown significant growth in revenue and net profit, indicating a strong performance in the semiconductor industry, particularly in the 12-inch wafer foundry business [2][3]. Financial Performance - As of June 30, 2025, Jinghe Integrated Circuit achieved a revenue of 5.198 billion yuan, representing a year-on-year growth of 18.21% [2]. - The net profit attributable to shareholders for the same period was 332 million yuan, reflecting a substantial increase of 77.61% year-on-year [2]. Shareholder and Market Activity - As of September 23, 2023, the company had a total financing balance of 1.030 billion yuan, which accounts for 3.61% of its market capitalization, indicating a high level of financing activity [1]. - The number of shareholders decreased by 3.90% to 62,800, while the average number of circulating shares per person increased by 4.95% to 18,907 shares [2]. Institutional Holdings - As of June 30, 2025, major institutional shareholders include: - Huaxia SSE Sci-Tech Innovation Board 50 ETF, holding 44.4063 million shares, decreased by 739,200 shares [3]. - E Fund SSE Sci-Tech Innovation Board 50 ETF, holding 33.2288 million shares, increased by 697,000 shares [3]. - Other notable shareholders include the Hong Kong Central Clearing Limited and Huaxia National Index Semiconductor Chip ETF, with significant changes in their holdings [3]. Dividend Distribution - Since its A-share listing, Jinghe Integrated Circuit has distributed a total of 194 million yuan in dividends [3].

9月11日，晶合集成涨5.13%，截至发稿，报23.36元/股，成交7.46亿元，换手率2.76%，总市值468.63亿 元。 从基金十大重仓股角度 数据显示，国投瑞银基金旗下1只基金重仓晶合集成。国投瑞银上证科创板综合价格指数增强A （023903）二季度持有股数30.67万股，占基金净值比例为1.34%，位居第八大重仓股。根据测算，今日 浮盈赚取约34.97万元。 国投瑞银上证科创板综合价格指数增强A（023903）成立日期2025年4月23日，最新规模1.62亿。成立以 来收益27.7%。 国投瑞银上证科创板综合价格指数增强A（023903）基金经理为殷瑞飞、钱瀚。 截至发稿，殷瑞飞累计任职时间11年354天，现任基金资产总规模33.79亿元，任职期间最佳基金回报 234.4%， 任职期间最差基金回报-22.36%。 钱瀚累计任职时间2年29天，现任基金资产总规模9.36亿元，任职期间最佳基金回报32.2%， 任职期间 最差基金回报-0.16%。 风险提示：市场有风险，投资需谨慎。本文为AI大模型自动发布，任何在本文出现的信息（包括但不 限于个股、评论、预测、图表、指标、理论、任何形式的表述等）均只作为 ...

Core Viewpoint - Huahong Semiconductor, a major player in the semiconductor foundry industry, is planning to acquire Huahong's fifth factory to enhance its 12-inch wafer foundry capacity, addressing competitive issues and fulfilling commitments made during its IPO [1][3]. Group 1: Acquisition Details - The acquisition involves purchasing equity in Huahong's fifth factory, which operates in the 65/55nm and 40nm process nodes, addressing competition with Huahong Semiconductor [3]. - The transaction is in the planning stage, with potential partners including Shanghai Huahong Group and various investment funds [3][4]. - The acquisition is not expected to constitute a major asset restructuring or change the actual controller of the company [4]. Group 2: Market Context and Capacity - The demand for semiconductor foundry services is expected to exceed supply by the first half of 2025, driven by domestic needs and the "China for China" strategy from overseas IDM companies [6]. - By Q2 2025, Huahong's total 8-inch capacity is projected to be 447,000 wafers, with a utilization rate of 108.3%, an increase of 5.6 percentage points from the previous quarter [7]. - The revenue share from 12-inch wafers is expected to rise significantly, with 12-inch wafer revenue increasing from $233 million to $334 million year-over-year in Q2 2025 [8]. Group 3: Financial Performance - As of August 15, Huahong's stock price was 78.50 yuan, with a total market capitalization of 135.76 billion yuan, reflecting a year-to-date increase of 68.93% [9].

Core Viewpoint - Huahong Company is planning to acquire Huahong Fifth Factory to enhance its 12-inch wafer foundry capacity, addressing competition issues and fulfilling commitments made during its IPO [1][2] Group 1: Acquisition Details - The acquisition involves purchasing equity from Huahong Micro, specifically targeting assets that compete with Huahong Company's 65/55nm and 40nm processes [1] - The transaction is in the planning stage, with initial discussions involving several investment entities, and is not expected to constitute a major asset restructuring [2] Group 2: Market Context and Capacity - The demand for semiconductor wafers is expected to exceed supply by the first half of 2025, driven by domestic needs and international IDM companies adopting a "China for China" strategy [2] - Huahong Company's total 8-inch wafer capacity is projected to be 447,000 pieces with a utilization rate of 108.3% in Q2 2025, reflecting a 5.6 percentage point increase from the previous quarter [3] Group 3: Revenue and Growth - In Q2 2025, the revenue from 12-inch wafers increased from $233 million to $334 million year-over-year, indicating a shift in revenue composition towards 12-inch products [4] - The revenue share of 12-inch wafers rose to 59.0% in Q2 2025, up from 48.7% in the same period last year, while the share of 8-inch wafers decreased to 41.0% [3]

Group 1 - Core viewpoint: Yu Xin Semiconductor, known as the first chip company in Guangzhou, is preparing for an IPO in the A-share market, having submitted its IPO guidance filing to the Guangdong Securities Regulatory Bureau [1][2] - Yu Xin Semiconductor was established in December 2017 with a registered capital of 2.366 billion yuan and is the first 12-inch wafer manufacturing platform in Guangdong to achieve mass production [2] - The company provides wafer foundry services covering 12-inch mixed signal, high-voltage display drivers, image sensors, power management, and power discrete devices, catering to markets such as IoT, automotive electronics, AI, and 5G [2] Group 2 - After four rounds of financing, Yu Xin Semiconductor is currently valued at approximately 16 billion yuan, ranking sixth among A-share semiconductor foundry companies [2] - The market is keenly observing the potential stock performance of companies that have stakes in Yu Xin Semiconductor, as successful IPOs typically benefit these stakeholders significantly [4][5] - One A-share listed company has a direct or indirect stake in Yu Xin Semiconductor, which could lead to substantial gains if the IPO is successful [4][5]

Group 1 - The company plans to distribute a cash dividend of 1.00 yuan (including tax) for every 10 shares, with no bonus shares or capital increase from reserves [29][31][34] - As of the report date, the total share capital is 2,006,135,157 shares, with 62,088,500 shares deducted from the repurchase account, resulting in a total cash dividend distribution of 194,404,665.70 yuan (including tax) [29][30] - The total amount of cash dividends and share repurchases is 1,086,081,974.00 yuan, accounting for 203.83% of the net profit attributable to shareholders of the listed company for the year [29][30] Group 2 - The company primarily engages in 12-inch wafer foundry services and related services, focusing on advanced process research and application [9][10] - The company has achieved mass production of process platforms ranging from 150nm to 55nm, with ongoing development in various applications including display driver chips and logic chips [9][10] - The company has established a strong customer base, including partnerships with leading chip design companies both domestically and internationally [16] Group 3 - The semiconductor industry is experiencing rapid growth, driven by the increasing demand for integrated circuits in various sectors such as AI, 5G, and IoT [14][15] - The company is positioned in the wafer foundry sector, which is capital and technology-intensive, requiring significant investment and expertise [15][16] - The company ranks ninth globally and third among domestic companies in the wafer foundry industry, indicating a strong market position [16] Group 4 - The company reported a revenue of 924,925.23 thousand yuan, a year-on-year increase of 27.69%, and a net profit of 48,219.63 thousand yuan, a year-on-year increase of 304.65% [25] - The net profit attributable to the parent company was 53,284.06 thousand yuan, reflecting a year-on-year increase of 151.78% [25] - The operating cash flow net amount was 276,113.13 thousand yuan, an increase of 292,216.72 thousand yuan compared to the previous year [25]

股票简称：晶合集成 股票代码：688249 合肥晶合集成电路股份有限公司 Nexchip Semiconductor Corporation （住所：安徽省合肥市新站区合肥综合保税区内西淝河路 88 号） 首次公开发行股票科创板上市公告书 保荐人（主承销商） （住所：北京市朝阳区建国门外大街1号国贸大厦2座27层及28层） 2023 年 5 月 4 日 合肥晶合集成电路股份有限公司 上市公告书 特别提示 合肥晶合集成电路股份有限公司（以下简称"晶合集成""公司""发行人"）股票将于 2023 年 5 月 5 日在上海证券交易所科创板上市。 本公司提醒投资者应充分了解股票市场风险及本公司披露的风险因素，在新股上市 初期切忌盲目跟风"炒新"，应当审慎决策、理性投资。 1 合肥晶合集成电路股份有限公司 上市公告书 第一节 重要声明与提示 一、重要声明与提示 本公司及全体董事、监事、高级管理人员保证上市公告书所披露信息的真实、准确、 完整，承诺上市公告书不存在虚假记载、误导性陈述或者重大遗漏，并依法承担法律责 任。 上海证券交易所、有关政府机关对本公司股票上市及有关事项的意见，均不表明对 本公司的任何保证。 本公司提 ...