半导体晶圆代工巨头华虹公司（688347.SH，股价78.5元，市值1357.64亿元）迎来大动作。8月17日晚间，华虹公司公告拟收购华虹五厂。 华虹集团为全球排名前列的晶圆代工巨头，旗下华虹公司主要包括华虹一厂、华虹二厂、华虹三厂和华虹七厂。华虹集团旗下华力微主要包括华虹五厂、 华虹六厂等。 按晶圆尺寸看，华虹一厂、二厂、三厂为8英寸产线，而华虹五厂、六厂、七厂为12英寸产线。此次华虹公司收购华虹五厂，或将大幅增加其12英寸晶圆 代工能力。 值得一提的是，8月15日，华虹公司股价涨幅达11.35%。 收购为解决同业竞争问题 华虹公司公告称，为解决IPO（首次公开募股）时承诺的同业竞争事项，公司正在筹划以发行股份及支付现金的方式购买华力微旗下华虹五厂对应的股 权，同时配套募集资金。据悉，本次收购标的资产为华力微所运营的、与华虹公司65/55nm（纳米）和40nm工艺存在同业竞争的资产（即华虹五厂）对应 的股权。目前，该标的资产正处于分立阶段。 2023年，华虹公司科创板上市之初，华虹集团发布了《关于避免同业竞争的补充承诺函》，"自发行人首次公开发行人民币普通股股票并于科创板上市之 日起三年内，按照国家战略部署 ...

Core Viewpoint - Huahong Company is planning to acquire Huahong Fifth Factory to enhance its 12-inch wafer foundry capacity, addressing competition issues and fulfilling commitments made during its IPO [1][2] Group 1: Acquisition Details - The acquisition involves purchasing equity from Huahong Micro, specifically targeting assets that compete with Huahong Company's 65/55nm and 40nm processes [1] - The transaction is in the planning stage, with initial discussions involving several investment entities, and is not expected to constitute a major asset restructuring [2] Group 2: Market Context and Capacity - The demand for semiconductor wafers is expected to exceed supply by the first half of 2025, driven by domestic needs and international IDM companies adopting a "China for China" strategy [2] - Huahong Company's total 8-inch wafer capacity is projected to be 447,000 pieces with a utilization rate of 108.3% in Q2 2025, reflecting a 5.6 percentage point increase from the previous quarter [3] Group 3: Revenue and Growth - In Q2 2025, the revenue from 12-inch wafers increased from $233 million to $334 million year-over-year, indicating a shift in revenue composition towards 12-inch products [4] - The revenue share of 12-inch wafers rose to 59.0% in Q2 2025, up from 48.7% in the same period last year, while the share of 8-inch wafers decreased to 41.0% [3]

出大事了！ 号称广州第一芯的粤芯半导体，要来A股了！ 证监会网站显示，粤芯半导体4月24日向广东证监局提交IPO辅导备案，辅导机构为广发证券。 粤芯半导体，成立于2017年12月，注册资本23.66亿元，总部位于广州市黄埔区，是广东省首个实现量 产的12英寸晶圆制造平台。 公司业务涵盖了12英寸混合信号、高压显示驱动、图像传感器、电源管理、功率分立器件（包括 MOSF-ET、IGBT）等在内的晶圆代工服务，应用于物联网、汽车电子、人工智能及5G等创新应用的模 拟芯片与分立器件的市场需求。 经过4轮融资融资后，目前市场的给以粤芯半导体的估值大概160亿元，在目前A股半导体代工上市公司 中排在晶合集成的后面，第6名。 半导体又要新增一家上市公司了！ | 序号 证券代码 | | 证券名称 | | 总市值 | | | --- | --- | --- | --- | --- | --- | | | | | > | 欧元日期 [货币币种] [单位] 亿元 | 202500 75 原始而种 | | 1 | 688981 SH | | 中芯国际 √ | | 4,267.60 | | 2 | 688347.SH | | 绅公司 ...

Group 1 - The company plans to distribute a cash dividend of 1.00 yuan (including tax) for every 10 shares, with no bonus shares or capital increase from reserves [29][31][34] - As of the report date, the total share capital is 2,006,135,157 shares, with 62,088,500 shares deducted from the repurchase account, resulting in a total cash dividend distribution of 194,404,665.70 yuan (including tax) [29][30] - The total amount of cash dividends and share repurchases is 1,086,081,974.00 yuan, accounting for 203.83% of the net profit attributable to shareholders of the listed company for the year [29][30] Group 2 - The company primarily engages in 12-inch wafer foundry services and related services, focusing on advanced process research and application [9][10] - The company has achieved mass production of process platforms ranging from 150nm to 55nm, with ongoing development in various applications including display driver chips and logic chips [9][10] - The company has established a strong customer base, including partnerships with leading chip design companies both domestically and internationally [16] Group 3 - The semiconductor industry is experiencing rapid growth, driven by the increasing demand for integrated circuits in various sectors such as AI, 5G, and IoT [14][15] - The company is positioned in the wafer foundry sector, which is capital and technology-intensive, requiring significant investment and expertise [15][16] - The company ranks ninth globally and third among domestic companies in the wafer foundry industry, indicating a strong market position [16] Group 4 - The company reported a revenue of 924,925.23 thousand yuan, a year-on-year increase of 27.69%, and a net profit of 48,219.63 thousand yuan, a year-on-year increase of 304.65% [25] - The net profit attributable to the parent company was 53,284.06 thousand yuan, reflecting a year-on-year increase of 151.78% [25] - The operating cash flow net amount was 276,113.13 thousand yuan, an increase of 292,216.72 thousand yuan compared to the previous year [25]

股票简称：晶合集成 股票代码：688249 合肥晶合集成电路股份有限公司 Nexchip Semiconductor Corporation （住所：安徽省合肥市新站区合肥综合保税区内西淝河路 88 号） 首次公开发行股票科创板上市公告书 保荐人（主承销商） （住所：北京市朝阳区建国门外大街1号国贸大厦2座27层及28层） 2023 年 5 月 4 日 合肥晶合集成电路股份有限公司 上市公告书 特别提示 合肥晶合集成电路股份有限公司（以下简称"晶合集成""公司""发行人"）股票将于 2023 年 5 月 5 日在上海证券交易所科创板上市。 本公司提醒投资者应充分了解股票市场风险及本公司披露的风险因素，在新股上市 初期切忌盲目跟风"炒新"，应当审慎决策、理性投资。 1 合肥晶合集成电路股份有限公司 上市公告书 第一节 重要声明与提示 一、重要声明与提示 本公司及全体董事、监事、高级管理人员保证上市公告书所披露信息的真实、准确、 完整，承诺上市公告书不存在虚假记载、误导性陈述或者重大遗漏，并依法承担法律责 任。 上海证券交易所、有关政府机关对本公司股票上市及有关事项的意见，均不表明对 本公司的任何保证。 本公司提 ...