作者 | 萧瑟 编辑 | 小白 技术滞后，越卖越亏。 今年6月，证监会在2025陆家嘴论坛上亮出新招。吴主席宣布， 创业板正式启用第三套上市标准，为 那些身怀绝技却尚未盈利的创新型企业敞开大门。 转眼新规已施行半年，继6月大普微之后，创业板在12月再次迎来一单未盈利IPO——粤芯半导体技 术股份有限公司（以下简称"粤芯股份"）。据资料显示，这是一家晶圆代工企业，保荐人为广发证 券。 第三套标准的实施，确实为成长路上的创新者提供了一次机会，但同时也对企业的硬科技属性提出了 更高要求。 这家尚处于亏损阶段的公司，是否具备相应的技术实力呢？ 三年亏掉52亿 ， 窟窿越捅越大 粤芯股份的核心业务是为境内外芯片设计企业提供晶圆代工服务和解决方案，其主要差异化在于专注 于成熟制程下的特色工艺，以及12英寸的大尺寸晶圆。 技术平台方面，粤芯股份主要围绕模拟和数模混合芯片展开。 集成电路代工业务中，覆盖MS（混合信号）、HV（高压显示驱动）、CIS（CMOS图像传感器）、e NVM（嵌入式非易失存储器）、BCD（Bipolar-CMOS-DMOS）和SiPho（硅光）等多种工艺。 相对应的终端产品包括指纹识别芯片、显示驱动芯 ...

中芯国际（688981.SH）12月29日晚间公告称，公司拟向国家集成电路基金等5名中芯北方股东发行股 份购买其所持有的标的公司49.00%股权，交易价格406.01亿元。 | A 股代码:688981 | A 股简称:中芯国际 公告编号:2025-039 | | --- | --- | | 港股代码:00981 | 港股简称:中芯国际 | 本次交易完成后，中芯国际将持有中芯北方100.00%的股权，中芯北方将成为公司的全资子公司。 公开资料显示，中芯北方于2013年7月成立于北京，注册资本48亿美元，由中芯国际与北京市政府共同 投资设立，主要从12英寸晶圆制造，工艺范围涵盖65至28纳米。 中芯国际表示，中芯北方作为上市公司（中芯国际）的控股子公司，主要为客户提供不同工艺平台的12 英寸集成电路晶圆代工及配套服务。中芯国际与中芯北方在工艺技术、客户网络、供应链、核心技术及 产能布局等方面具备协同效应，本次交易有利于进一步提高上市公司资产质量、增强业务上的协同性， 促进上市公司的长远发展，有利于维护上市公司全体股东的利益。 截至2025年12月29日收盘，中芯国际(688981)报收于122.5元，上涨0.3 ...

证券代码：300656 证券简称：民德电子 深圳市民德电子科技股份有限公司投资者关系活动记录表 SBR、高压二极管、恒流管等产品，上述产品可覆盖功率半导体的大部分品类，应用 场景包括数据中心电源、电网智能电表、矿机电源、工业电机电源、汽车电子、光伏、 消费电子等。 广芯微电子的核心竞争力主要包括两方面： 公司未来的投资，将以晶圆代工产能扩产为主，在其他环节的股权投资应该会较 少。此外，对于此前已投资的非核心资产，会考虑在合适的时机出售以收回资金，并 获取一定的投资收益。 近期，公司投资方面主要进展有：（1）公司于 2025 年 11 月出售了物流自动分拣 设备公司君安宏图的控股权，收回 1,480 万元股权转让款和 300 万元借款，减少 2,000 万元银行授信担保，以及减少了约 5 千万的应收和约 7 千万的存货，本次股权转让可 优化资源配置、聚焦核心业务发展、提升公司资产运营效率；（2）特种工艺晶圆代工 厂芯微泰克于近期获得了产业合作方数千万的股权融资；（3）晶圆原材料企业晶睿电 子预计将于近期完成约 2 亿元股权融资，并计划于 2026 年启动上市筹备工作。 编号：2025-05 | | 特定对象调研 ...

点击 最 下方 关注《材料汇》 ， 点击"❤"和" "并分享 添加 小编微信 ，寻 志同道合 的你 正文 广东省半导体与集成电路产业规模 · 广东省半导体与集成电路产业总产值2024年达到3600亿元,其中设计业为2109亿元;制造业为92 亿元；封测业为795亿元；装备和材料业为608亿元。 | | | | | | 总营收 | 2024年广东省集成电路产业营收情况 | | | | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | | 球海市 5% | 其他市 | 序号 | 地区 | (亿元) | 设计 | 制造 | 封测 | 装备材料 | | | 东莞市 5% | 4% | 1 | 深圳市 | 2839.60 | 1914.10 | 56.60 | 567.00 | 301.90 | | | 佛山市 1% | | 2 | 广州市 | 210.51 | 41.92 | 26.01 | 41.49 | 101.09 | | | 广州市 6% | | 3 | 珠海市 | 194.50 | 135.00 | 5.00 | 1.50 | 5 ...

Core Viewpoint - The acquisition of SMIC's subsidiary by Guokewai has failed after six months of controversy, with both companies announcing the termination of the asset transaction due to inability to reach an agreement within the expected timeframe [1] Group 1: Acquisition Details - Guokewai aimed to acquire SMIC Ningbo to create a dual-driven system of "digital chip design + analog chip manufacturing," intending to enhance production capabilities in high-end filters and MEMS, and expand into downstream markets like smartphones and smart connected vehicles [3][12] - The acquisition faced skepticism from the market due to limited synergy between Guokewai's digital chip design and SMIC Ningbo's analog chip manufacturing, raising doubts about the effectiveness of integration [3][4] Group 2: Financial Performance and Challenges - SMIC Ningbo has been operating at a significant loss since its establishment in 2016, with projected revenues of 213 million yuan, 454 million yuan, and 108 million yuan for 2023, 2024, and Q1 2025, respectively, while net losses are expected to be -843 million yuan, -813 million yuan, and -150 million yuan during the same periods [6] - Guokewai's financial situation is also concerning, with a revenue drop of over 50% to 1.978 billion yuan in 2024 and a net profit decline of approximately 90% to 7.4054 million yuan in the first three quarters of 2025 [8][12] Group 3: Strategic Implications - The termination of the acquisition allows Guokewai to avoid the risks associated with integrating a loss-making entity while still facing pressure to improve its own financial performance [12] - Guokewai is focusing on adjusting its business strategy, reducing low-margin product sales, and increasing R&D investment, which accounted for 43.6% of its revenue in the first half of 2025 [12]

Core Insights - Samsung Electronics is intensifying its efforts to catch up with industry leader TSMC by revealing specific performance metrics of its next-generation chip manufacturing technology [1] - The announcement of Samsung's first performance data for its upcoming 2nm chip process marks a shift from conceptual descriptions to concrete specifications, aimed at demonstrating its technological capabilities to the market and potential customers [1] Group 1: Samsung's 2nm Technology - The first-generation 2nm process utilizes Gate-All-Around (GAA) transistor technology, achieving a 5% performance improvement, an 8% increase in power efficiency, and a 5% reduction in chip area compared to the second-generation 3nm process [1] - This release signifies a strategic move for Samsung to enhance its competitive position in the concentrated global foundry market, where TSMC holds over 70% market share while Samsung's share is approximately 7% [1] Group 2: Market Dynamics - Analysts expect TSMC's leading position to remain unchallenged in the short term due to its advantages in high-volume production, stability, and meeting strong demand for AI accelerators and data center chips [1] - However, subtle changes in market dynamics are occurring, as some customers are seeking alternatives due to TSMC's ongoing capacity constraints, creating opportunities for Samsung [1] - Samsung's foundry business is attracting orders from large tech companies and startups, broadening its customer base [1] Group 3: Collaborations and Orders - Samsung has recently begun producing processors based on a 4nm process for the U.S. AI startup Chaboraite [1] - Additionally, Samsung is collaborating with companies like Tesla on its 2nm process [1]

Core Viewpoint - The global wafer foundry market is dominated by TSMC with a market share of 70.2%, while Samsung holds a distant second place with only 7.3% [2] Group 1: Market Dynamics - TSMC leads the global wafer foundry market with a significant gap over Samsung, which has a market share nearly ten times smaller [2] - Samsung's foundry business has been operating at a loss due to insufficient orders, with estimated quarterly losses ranging from 1 trillion to 2 trillion Korean Won since 2022 [4] Group 2: Samsung's Strategy - Samsung has set a clear two-year business plan aiming for profitability in its foundry operations by 2027 and to capture 20% of the market share [4] - Key to achieving this goal is improving the yield rate of its 2nm GAA process and establishing stable partnerships with high-value clients [4] Group 3: Potential Breakthroughs - A significant development occurred when Samsung secured a long-term order worth approximately $16.5 billion from Tesla for the production of next-generation AI6 chips, lasting until the end of 2033 [4] - The successful integration of the Exynos 2600 chip in the upcoming Galaxy S26 series and Qualcomm's potential return to Samsung for Snapdragon 8 series chips could lead to substantial improvements in Samsung's foundry business [4]

Core Insights - Intel's wafer foundry revenue is projected to be only $120 million by 2025, which is merely one-thousandth of TSMC's revenue during the same period, highlighting the significant gap in market presence [2] - Despite initial challenges in attracting external customers for the Intel 18A process, Intel aims to leverage its internal product successes to draw in external clients [3] - Intel's overall foundry business is expected to reach breakeven by the end of 2027, driven by a shift from DUV to EUV processes, which will increase average wafer prices at a rate three times faster than cost increases [4] Financial Projections - Intel's wafer foundry revenue for 2025 is estimated at $120 million, compared to TSMC's approximately $101 billion in revenue for the first ten months of this year [2] - The transition to EUV technology is anticipated to significantly improve Intel's financial performance in the foundry sector, with a projected breakeven point by 2027 [4] Strategic Initiatives - Intel is undergoing structural adjustments across various departments, including foundry services, client products, and artificial intelligence, indicating a proactive approach to transformation under the new CEO [4] - The company has secured over $10 billion in investments from the U.S. government, SoftBank, and NVIDIA, and has established a deep collaboration plan with NVIDIA in the PC and server chip sectors [4] Market Challenges - Intel faces substantial challenges in its foundry business, needing to demonstrate the performance and power efficiency advantages of its Intel 18A process through its own products [4] - Potential collaborations with companies like Tesla, Broadcom, and Microsoft are critical for Intel's ability to regain competitiveness in the global wafer foundry market [4]

Core Viewpoint - Intel's foundry business (IFS) is struggling significantly, with projected revenue of only $120 million in 2025, which is just one-thousandth of TSMC's expected revenue for the same period, indicating a long road ahead to achieve break-even [2]. Group 1: Business Performance - Intel's IFS revenue is expected to be $120 million in 2025, far behind TSMC's revenue, highlighting the challenges in achieving profitability [2]. - The company is undergoing structural adjustments in various departments, including consumer products and AI, reflecting a broader transformation strategy [2]. - The commercialization progress of IFS faces severe challenges, despite some market interest in Intel's upcoming advanced process technologies [2]. Group 2: Market Interest and Future Prospects - Companies like Tesla, Broadcom, and Microsoft are showing interest in Intel's upcoming process nodes, such as Intel 18A and 14A, which are crucial for IFS's potential revival in the global foundry market [2]. - The upcoming Panther Lake and Clearwater Forest processor series are seen as key tests for IFS's technological development [3]. - Intel's future in the foundry business may hinge on the market performance of the 14A process node, with potential delays or cancellations if it fails to secure significant external customers [3]. Group 3: Competitive Landscape - Direct comparisons between Intel and TSMC may not be entirely fair due to significant differences in scale and market position, yet such comparisons highlight the long-term competitive disadvantages of technological lag [3]. - TSMC continues to dominate the global foundry market, while Intel is still searching for breakthrough opportunities [3].

Core Viewpoint - The article discusses Intel's future prospects, particularly focusing on its wafer foundry business and the recent mass production of the 18A process node, which marks the completion of Intel's "Four Nodes in Five Years" strategy aimed at regaining process technology leadership and revitalizing its foundry business [2]. Group 1: Intel's 18A Process Node - The mass production of the 18A process node signifies a critical milestone for Intel, enabling the production of both client and edge computing products, as well as data center processors [2]. - The transition from TSMC manufacturing to in-house production of CPU and GPU chips is expected to enhance Intel's scale, reduce costs, and improve profit margins while delivering competitive products [2]. Group 2: Advanced Packaging Technologies - Chiplet technology is gaining traction in the semiconductor industry, with Intel leveraging its advanced packaging techniques, such as Foveros and EMIB, to enhance chip design and performance [3]. - Foveros technology allows for flexible chip configurations based on application needs, while EMIB technology interconnects multiple 18A chips in the new Clearwater Forest processors [3]. Group 3: Ecosystem Impact - The introduction of 18A chips and products like Panther Lake is anticipated to benefit the entire ecosystem by providing competitive products that enhance battery life and performance while lowering costs for OEM manufacturers [4]. - A healthy and competitive PC chip ecosystem is expected to deliver higher quality products at more competitive prices to consumers [5]. Group 4: Opportunities in Mobile Industry - Intel's foundry success could extend to the smartphone industry, presenting opportunities for cost reduction and supply chain diversification, despite the current dominance of TSMC in this market [5]. - Major smartphone manufacturers, including Apple, rely heavily on TSMC, which produces approximately 90% of global smartphone SoC chips [5]. Group 5: Competitive Landscape - Intel's foundry services could provide a competitive alternative to TSMC, especially with the anticipated introduction of the 14A process node, potentially curbing TSMC's price increases [6]. - TSMC has raised prices significantly over the past five years, and Intel's competitive offerings could alleviate cost pressures on chip suppliers and OEMs [6]. Group 6: Future Prospects for Intel's Foundry - Intel's foundry is actively seeking new clients to utilize its advanced capabilities, with the success of Panther Lake and Clearwater Forest products likely to attract more companies [7]. - The demand for cheaper, low-power chips and the desire for geopolitical supply chain diversification are expected to drive more business towards Intel's foundry services in the future [7].