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汇成股份(688403):DRAM存储封装开启布局
China Post Securities· 2025-10-22 09:31
Investment Rating - The report maintains a "Buy" rating for the company [1][8] Core Insights - The company is strategically investing in DRAM storage packaging through direct and indirect investments in Xinfeng Technology, aiming to enhance its capabilities in advanced packaging for 3D DRAM chips [4][11] - The partnership with Huadong Technology is expected to leverage both companies' resources to expand the 3D DRAM packaging business, addressing the growing market demand driven by AI infrastructure [5][11] - The company anticipates revenue growth, projecting revenues of 1.78 billion, 2.05 billion, and 2.40 billion yuan for 2025, 2026, and 2027 respectively, with net profits of 186.49 million, 247.75 million, and 316.55 million yuan for the same years [8][10] Company Overview - The latest closing price of the company's stock is 15.93 yuan, with a total market capitalization of 137 billion yuan and a debt-to-asset ratio of 30.3% [3][10] - The company holds a significant stake of 27.5445% in Xinfeng Technology after recent investments, which positions it to influence the operations of Xinfeng without consolidating it into its financial statements [4][11] Financial Projections - The company is expected to achieve a revenue growth rate of 21.22% in 2024, followed by 18.83% in 2025, and 14.93% in 2026 [10][13] - The projected earnings per share (EPS) are expected to increase from 0.19 yuan in 2024 to 0.37 yuan in 2027 [10][13]
半导体封测业绩哪家强?通富微电延长相关设备折旧年限致净利润大涨,汇成股份增收不增利
Mei Ri Jing Ji Xin Wen· 2025-04-15 13:29
Core Viewpoint - The recent performance reports of major semiconductor packaging and testing companies in the A-share market indicate a mixed outlook, with significant growth in net profits for Tongfu Microelectronics and Huada Semiconductor, while Huicheng Co., focused on display driver chip packaging, faces declining profits due to increased competition and lower gross margins [1][2][3]. Group 1: Performance Summary of Major Companies - Longji Technology reported a revenue of 35.96 billion yuan for 2024, a year-on-year increase of 21.2%, and a net profit of 1.61 billion yuan, up 9.5% [1]. - Tongfu Microelectronics achieved a revenue of 23.882 billion yuan, a growth of 7.24%, with a remarkable net profit increase of 299.9% to 677 million yuan [1][2]. - Huada Technology's revenue reached 14.462 billion yuan, reflecting a growth of 28%, while its net profit increased by 172.29% to 616 million yuan [1]. Group 2: Financial Dynamics and Challenges - The significant net profit growth for Tongfu Microelectronics and Huada Technology is based on a low comparison from 2023, where their profits had previously declined [2]. - Despite the net profit surge, Tongfu Microelectronics experienced a decline in net cash flow from operating activities, which fell by 9.68% to 3.877 billion yuan, attributed to increased depreciation expenses [2]. - The EBITDA for Tongfu Microelectronics was reported at 4.815 billion yuan, showing a modest growth of 9.38% [2][3]. Group 3: Industry Competition and Gross Margin Trends - Huicheng Co. reported a revenue of 1.501 billion yuan for 2024, a year-on-year increase of 21.22%, but its net profit decreased by 18.48% to 160 million yuan due to intensified competition in the display driver chip packaging sector [3][4]. - The average gross margin for Huicheng Co. was 22.34%, down 4.83 percentage points, while Tongfu Microelectronics and Huada Technology reported lower gross margins of 14.50% and 12.29%, respectively [4][5]. - The competitive landscape is expected to further pressure gross margins, as new entrants and expanded capacities in the display driver chip packaging market could lead to price declines [5].