Core Viewpoint - TSMC's Direct-to-Silicon Liquid Cooling (IMC-Si) technology demonstrates significant potential in addressing high power and power density challenges in high-performance computing and AI applications, particularly when integrated with advanced packaging like CoWoS-R [1][4][31] Group 1: Technology Overview - The IMC-Si solution utilizes a silicon-integrated micro-cooler that requires minimal modifications to existing CoWoS processes, achieving cooling power of up to 3.4 kW at a uniform thermal flux of 2.5 W/mm² using 40°C water as the coolant [1][8] - Direct silicon liquid cooling technology is shown to outperform traditional cooling methods, with previous studies indicating cooling capabilities of up to 2 kW at 3.2 W/mm² power density [5][18] - The integration of IMC-Si into the CoWoS-R platform allows for effective heat dissipation, addressing the limitations of indirect cooling systems [7][10] Group 2: Reliability Testing - Early reliability tests, including helium leak tests, confirm that the IMC-Si integrated CoWoS-R packaging maintains helium leak rates at least an order of magnitude lower than critical thresholds, demonstrating robust sealing performance [23][28] - The integrated system successfully passed multiple reflow soldering cycles, thermal cycling tests, and high-temperature storage tests, indicating strong reliability under stress [29][28] - Accelerated liquid immersion tests at high temperature and pressure further validate the longevity and stability of the sealing agent used in the IMC-Si solution [28][29] Group 3: Future Directions - Future work will focus on optimizing micro-pillar designs and reducing warpage to enhance cooling efficiency, ensuring the scalability and reliability of the IMC-Si solution in demanding environments [31]