Group 1 - The company closely monitors global advanced packaging technology trends, including Intel's EMIB solution [1] - The company's entire line of packaging and testing equipment is applicable to high-performance chip 2.5D packaging processes [1] - The company aims to enhance collaboration with upstream and downstream clients in the industry chain to improve equipment applicability and market competitiveness in advanced packaging [1]

Core Viewpoint - The company reports a higher order proportion in storage compared to logic, with an average delivery cycle of around 6 months, indicating a positive market trend for advanced packaging demand [1] Group 1: Sales and Orders - The company's sales performance shows that orders in the storage segment are higher than those in the logic segment [1] - The average order delivery cycle is approximately 6 months [1] Group 2: Market Trends - There is an expanding demand for advanced packaging in the current market [1] - The company expects to maintain a strong growth trajectory in advanced packaging equipment in the upcoming year [1] Group 3: Product Offerings - The company is recognized as a global leader in advanced wafer wet processing equipment, offering a comprehensive range of products including coating, developing, stripping, etching, cleaning, and plating equipment [1] - The company has introduced several core products in the panel-level advanced packaging sector, including plating, edge wet etching, and vacuum cleaning equipment, with plans to continue launching similar products [1] Group 4: Industry Position - The company is at the forefront of the industry transition from wafers to panels, positioning itself as a leader in this trend [1]