投资者提问： 董秘您好：请问贵公司有关注英特尔EMIB先进封装解决方案吗？如关注或参与其中了可以简要描述一 下竟争优势有那些？谢谢！ 董秘回答(盛美上海SH688082)： 尊敬的投资者您好，盛美上海密切关注全球先进封装技术的发展趋势，对包括英特尔EMIB在内的多种 先进封装解决方案保持着持续跟踪，公司全线封测设备（包括湿法设备、涂胶、显影设备及电镀铜设 备）亦可应用于大算力芯片2.5D封装工艺。公司将结合高端芯片封装的发展需求，积极加强与产业链上 下游客户的协同合作，不断提升设备在先进封装领域的适用性与市场竞争力，携手合作伙伴共同促进全 球半导体产业的蓬勃发展。感谢您的关注！ 查看更多董秘问答>> 免责声明：本信息由新浪财经从公开信息中摘录，不构成任何投资建议；新浪财经不保证数据的准确 性，内容仅供参考。 来源：问董秘 ...

Core Viewpoint - The company reports a higher order proportion in storage compared to logic, with an average delivery cycle of around 6 months, indicating a positive market trend for advanced packaging demand [1] Group 1: Sales and Orders - The company's sales performance shows that orders in the storage segment are higher than those in the logic segment [1] - The average order delivery cycle is approximately 6 months [1] Group 2: Market Trends - There is an expanding demand for advanced packaging in the current market [1] - The company expects to maintain a strong growth trajectory in advanced packaging equipment in the upcoming year [1] Group 3: Product Offerings - The company is recognized as a global leader in advanced wafer wet processing equipment, offering a comprehensive range of products including coating, developing, stripping, etching, cleaning, and plating equipment [1] - The company has introduced several core products in the panel-level advanced packaging sector, including plating, edge wet etching, and vacuum cleaning equipment, with plans to continue launching similar products [1] Group 4: Industry Position - The company is at the forefront of the industry transition from wafers to panels, positioning itself as a leader in this trend [1]