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CINNO创始人陈丽雅受邀参加第三代半导体产业合作大会并发表主旨演讲
CINNO Research· 2025-10-25 13:27
Core Viewpoint - The third-generation semiconductor industry is a key focus for growth in Yancheng, with an emphasis on developing a complete industrial chain centered around silicon carbide and gallium nitride technologies to support advancements in artificial intelligence and other sectors [4][5]. Group 1: Conference Overview - The Third Generation Semiconductor Industry Cooperation Conference was held in Yancheng High-tech Zone, featuring key officials and industry experts discussing future trends and technological advancements in the semiconductor sector [2][4]. - The conference theme was "Empowering New Dynamics, Co-building the 'Chip' Ecosystem," highlighting the collaborative efforts needed to advance the industry [4]. Group 2: Government and Institutional Support - Local government officials emphasized the importance of the third-generation semiconductor industry as a growth sector, with existing companies like Fulehua and Konka leading in global markets for power semiconductor substrates and small-pitch LED packaging [4][5]. - The provincial government plans to enhance support for key technologies, innovation platforms, and major projects to foster the development of a regional semiconductor innovation hub [5]. Group 3: Expert Contributions and Discussions - Industry experts from various institutions shared insights on technological frontiers, market trends, and practical experiences during the conference, enriching the discussions for attendees [6]. - The event included the announcement of new standards aimed at accelerating the application of advanced semiconductor technologies, which will inject strong momentum into technological innovation and industry collaboration [18]. Group 4: Future Opportunities - Yancheng High-tech Zone aims to leverage the conference as a springboard to capture opportunities in the rapidly growing fields of new energy vehicles and artificial intelligence, focusing on a comprehensive industrial ecosystem that includes substrate and epitaxial wafer production, chip packaging, and optoelectronic applications [18].