智通财经APP获悉，据港交所12月4日披露，深圳基本半导体股份有限公司(简称"基本半导体")向港交所 主板递交上市申请，中信证券、国金证券(香港)有限公司、中银国际为其联席保荐人。该公司曾于今年 5月27日向港交所递交过上市申请。据招股书，基本半导体是中国第三代半导体功率器件行业的企业， 专注干碳化硅(SiC)功率器件的研发、制造及销售。 754 = BASIC Semiconductor BASiC Semiconductor Co., Ltd. 深圳基本半導體股份有限公司 (於中華人民共和國註冊成立的股份有限公司) 國金讀券(香港)有限公司 中 中 级 图 BOCI | [繼續]的[繼續]數目 | : [編纂]股H股(視乎[編纂]行使與否而定) | [編纂]數目 | .. | [編纂]股H股(可予[編纂]) | | --- | --- | --- | --- | --- | | : [編纂]股H股(可予[編纂]及視乎 | [編纂]數目 | [編纂]行使與否而定) | | | | : 每股H股[編纂]港元,另加1.0%經紀 | 最高[編纂] | 佣金 · 0.0027%證監會交易徵費· | | | | 0. ...

Core Insights - Shanghai Zhanchip Electronics Technology Co., Ltd. has completed its Series C financing round, raising over 1 billion RMB, aimed at expanding its silicon carbide (SiC) production capacity and enhancing product development and market promotion [1] Group 1: Financing and Investment - The Series C financing was led by the National Development Bank's Manufacturing Transformation and Upgrade Fund, with participation from multiple investment institutions, bringing the total financing since its establishment in 2017 to nearly 3 billion RMB [1] - The funds will be used to accelerate domestic substitution of SiC devices and improve product performance and market competitiveness [1] Group 2: Product Development and Market Position - The company has successfully mass-produced three generations of SiC power device products, achieving industry-leading technical specifications and supplying to several well-known electric vehicle manufacturers and Tier 1 suppliers [2] - SiC power devices are recognized as a new generation of energy electronic devices with significant potential in various sectors, including electric vehicles, power grids, photovoltaics, and energy storage [2] Group 3: Industry Trends and Future Prospects - SiC is considered one of the hottest wide bandgap semiconductor materials, representing the core of the "third generation semiconductor" [2] - Recent reports indicate that NVIDIA plans to use 12-inch SiC substrates in the advanced packaging of its next-generation GPU chips to address heat dissipation issues and enhance performance, potentially by 2027 [3]

在功率半导体领域，整合设计与制造等产业链的公司被称为垂直整合商(IDM, Integrated Device Manufacturer)，也是国际头部厂商采用的主流商业模式。作为国内碳化硅(SiC)IDM模式的先行者，瞻芯 电子专注于碳化硅(SiC)功率器件的研发、制造和销售，同时围绕碳化硅(SiC)应用提供包括功率器件、 驱动芯片、控制芯片等在内的完整解决方案。 目前瞻芯电子已成功量产了三代碳化硅(SiC)功率器件产品，核心技术指标达到行业领先水平，已实现 向多家知名新能源汽车厂商及Tier1供货商的规模出货，批量应用于新能源汽车的车载电源 (OBC/DCDC)、空调压缩机、电驱动等领域，并与光伏、储能、充电桩、工业电源等行业众多知名客户 建立了稳定供货关系。 日前，中国领先的碳化硅(SiC)功率器件和芯片方案商——上海瞻芯电子科技股份有限公司（简称"瞻芯 电子"）宣布完成全部C轮融资，融资总金额超过10亿元人民币，近日完成工商变更手续。继年初C轮首 批资金交割后，多家投资机构陆续跟投，投资者持续看好公司长期发展。C轮融资由国开制造业转型升 级基金领投，中金资本、北京市绿色能源和低碳产业基金、国际国方、国投 ...