Core Viewpoint - The conference emphasizes the importance of thermal management technology in various key sectors, including AI computing, advanced packaging, new energy, and electric vehicles, aiming to drive innovation and collaboration within the industry [2][5][19]. Group 1: Conference Overview - The 6th Thermal Management Industry Conference and Expo, hosted by DT New Materials, took place in Shenzhen, gathering experts from academia and industry to discuss technological innovations and engineering practices in thermal management [2]. - The conference featured multiple forums and discussions on trending applications such as AI data centers, advanced packaging, power devices, and liquid cooling technology, providing a comprehensive communication platform for the industry [4][19]. Group 2: Keynote Highlights - Dr. Zhang Lisheng, CEO of DT New Materials, highlighted Shenzhen's role as a hub for electronic information and advanced manufacturing, aiming to create a robust ecosystem for thermal management, integrated circuits, and new materials [5][7]. - Notable presentations included topics on directional heat transfer mechanisms, thermal management in communication and AI products, and intelligent thermal control mechanisms, showcasing advancements in materials and system-level solutions [9][10][12][14][16]. Group 3: Industry Trends and Innovations - The conference discussions revealed key trends such as high heat flux density, advanced packaging, and the engineering of liquid cooling systems, indicating the main development lines for the industry over the next 3-5 years [52]. - The exhibition area featured numerous new products and solutions, facilitating direct interactions between engineers and procurement leaders, leading to potential collaborations [53]. Group 4: Future Outlook - The conference aims to create tangible value for the industry through connectivity and collaboration, with ongoing discussions between academic experts and industry representatives for future research and project implementations [56][59]. - More forums and significant content updates are expected in the following days, reflecting the growing importance of thermal management in the era of increased computational power [59].

Core Viewpoint - The rapid advancement of electronic technology is driving the demand for efficient thermal management materials and innovative solutions across various sectors, including consumer electronics, 5G, AI, and energy storage, to ensure product efficiency, reliability, and safety [2]. Group 1: Conference Information - The 6th Thermal Management Industry Conference and Exposition (iTherM 2025) will be held from December 3-5, 2025, at the Shenzhen International Convention and Exhibition Center, focusing on the theme of "Fusion and Innovation" [3]. - The conference will feature over 350 exhibitors and a 20,000 m² exhibition area, aiming to provide a one-stop, high-efficiency value service platform for the thermal management industry [3][4]. - The event is expected to attract over 2,000 participants, including renowned scholars, technical experts, and executives from leading companies [3]. Group 2: Organizational Structure - The conference is organized by the China Productivity Promotion Center Association's New Materials Professional Committee and DT New Materials, with several prominent figures serving as advisors and executive chairs [5]. - Various activities will be conducted, including innovation showcases, closed-door seminars, expert consultations, and one-on-one exchanges to foster collaboration and innovation in the thermal management field [5]. Group 3: Conference Topics - The conference will address the current challenges and future opportunities in the thermal management industry, focusing on market dynamics, technological evolution, and high-quality industrial development [7]. - Key topics will include thermal science, functional materials, technical applications, and engineering solutions, with specialized sessions on areas such as liquid cooling technology, power device thermal management, and data center thermal management [7]. Group 4: Registration and Participation - Registration fees for participants are set at ¥2,200 for early birds (before October 31, 2025) and ¥3,000 for regular registration, with discounts available for students [8]. - Payment methods include bank transfer, Alipay, and WeChat Pay, with on-site payment options also available [8].