Core Insights - Intel and Weimob Intelligence have signed a memorandum of cooperation, establishing a strategic partnership aimed at creating native intelligent cockpit solutions for edge devices [1] Group 1 - The collaboration has already resulted in the launch of the "Intel & Weimob Intelligent Vehicle Large Model GUI Intelligent Agent" [1]

Group 1 - Intel announced a collaboration with Black Sesame (000716) to launch a cockpit integration platform reference design by Q2 2025 and prepare for mass production [1] - Intel will also work with Weimob Intelligent to develop edge-native intelligent cockpits [1] - Collaboration with South Korean semiconductor company BOS Semiconductors is also part of Intel's strategy [1]

4 月 23 日 ， 英 特 尔 首 次 参 加 上 海 车 展 ， 发 布 第 二 代 AI 增 强 型 软 件 定 义 汽 车 系 统 级 芯 片 （ SDV SoC）。这款SoC率先在汽车行业推出基于芯粒架构的设计，相比上一代产品，生成式和多模态AI 性能最高可提升10倍。同时，英特尔与黑芝麻智能联合发布舱驾融合平台、与面壁智能共同研发端 侧原生智能座舱。 ...