Core Viewpoint - The National Integrated Circuit Industry Investment Fund Phase III is being adjusted to enhance China's semiconductor capabilities in response to U.S. technology restrictions, focusing on domestic innovation and reducing reliance on foreign technologies [1][2]. Group 1: Fund Overview - The National Integrated Circuit Industry Investment Fund Phase III was established in 2024 with a registered capital of 344 billion yuan, following the first phase at 138.7 billion yuan and the second phase at 204.15 billion yuan [1]. - The fund aims to support semiconductor equipment and materials, particularly high-value DRAM chips, AI chips, advanced semiconductor equipment, and materials like photoresists [1][2]. Group 2: Market Context - The ongoing U.S.-China tech friction has led to tighter export controls on high-end chips and related technologies, prompting a shift in funding priorities towards domestic development of lithography machines and EDA tools [2]. - Analysts suggest that the adjustments in the fund could accelerate breakthroughs in critical areas of the semiconductor supply chain, although fully replacing foreign technology in the short term remains challenging [2]. Group 3: Upcoming Conference - The 2025 TrendBank Lithography Industry Conference will be held on July 9-10, 2025, in Hefei, Anhui, gathering experts and industry leaders to discuss advancements and challenges in lithography technology and materials [5]. - The conference will feature various sessions on advanced lithography technologies, materials, and applications, including discussions on the development of photoresist materials and their market analysis [7][8].