Investment Rating - The report assigns a "Buy" rating to the company, indicating a favorable investment outlook with potential upside [5][10]. Core Insights - The company is positioned to benefit from the structural opportunities arising in the semiconductor industry due to increasing demand for advanced computing chips and HBM (High Bandwidth Memory) in China, especially following the escalation of US-China trade tensions [5][10]. - The company's current stock price reflects a price-to-earnings (P/E) ratio of 42x for 2025, 33x for 2026, and 24x for 2027, suggesting a certain margin of safety in its valuation [5][10]. - The management's confidence in rapid growth is demonstrated through an ambitious stock incentive plan, targeting significant revenue and profit growth over the next few years [10]. Company Overview - The company operates in the electronics industry, specifically focusing on semiconductor equipment, with a significant market share in thin-film deposition equipment and hybrid bonding technology [5][10]. - As of June 23, 2025, the company's stock price is 151.70, with a market capitalization of 424.35 billion RMB [2]. Financial Performance - The company is projected to achieve net profits of 1,003 million RMB in 2025, 1,306 million RMB in 2026, and 1,736 million RMB in 2027, reflecting year-on-year growth rates of 45.8%, 30.2%, and 32.9% respectively [7][10]. - The earnings per share (EPS) are expected to rise from 2.37 RMB in 2023 to 6.21 RMB in 2027, indicating strong growth potential [7][10]. Market Position - The company is recognized as a leading player in hybrid bonding technology, having successfully passed certification with major domestic manufacturers, which positions it well to capitalize on the growing demand for domestic HBM production [10]. - The company’s revenue for 2024 is forecasted to reach 41 billion RMB, representing a 52% increase year-on-year, with continued strong growth expected into 2025 [10].