塑料材质 IC JEDEC 托盘 （又称 电子芯片托盘 、 芯片托盘 ）是半导体封测试企业用于芯片（ IC ）封装、测试及运输的 专用包装容器。其核心功能包括：防静电保护 ：通过抗静电材料或导电改性技术（如添加碳纤维）避免芯片静电损伤；耐高 温特性 ：适应芯片封装前的高温烘烤环境（如 150℃ 以上），确保材料稳定性；机械防护 ：通过凹槽矩阵结构固定芯片位 置，防止引脚弯曲或折断。 JEDEC 标准中定义了芯片尺寸为 3*3mm 至 22*22mm 的 IC 托盘上面盛放 IC 的凹槽的矩阵分布及数量。 01 全球塑料材质IC JEDEC托盘市场规模及趋势 2024 年，全球塑料材质 IC JEDEC 托盘市场规模达到了 442.14 百万美元，预计 2031 年将达到 788.75 百万美元，年复合增长 率（ CAGR ）为 8.09% 。 地区层面来看，中国市场在过去几年变化较快， 2024 年市场规模为 50.81 百万美元，约占全球的 11.49 % ，预计 2031 年将达 到 155.29 百万美元，届时全球占比将达到 19.69 % 。 塑料材质 IC JEDEC 托盘 行业集中度、竞争程度分析 ...

Investment Rating - The report assigns a "Buy" rating to the company, indicating a favorable investment outlook with potential upside [5][10]. Core Insights - The company is positioned to benefit from the structural opportunities arising in the semiconductor industry due to increasing demand for advanced computing chips and HBM (High Bandwidth Memory) in China, especially following the escalation of US-China trade tensions [5][10]. - The company's current stock price reflects a price-to-earnings (P/E) ratio of 42x for 2025, 33x for 2026, and 24x for 2027, suggesting a certain margin of safety in its valuation [5][10]. - The management's confidence in rapid growth is demonstrated through an ambitious stock incentive plan, targeting significant revenue and profit growth over the next few years [10]. Company Overview - The company operates in the electronics industry, specifically focusing on semiconductor equipment, with a significant market share in thin-film deposition equipment and hybrid bonding technology [5][10]. - As of June 23, 2025, the company's stock price is 151.70, with a market capitalization of 424.35 billion RMB [2]. Financial Performance - The company is projected to achieve net profits of 1,003 million RMB in 2025, 1,306 million RMB in 2026, and 1,736 million RMB in 2027, reflecting year-on-year growth rates of 45.8%, 30.2%, and 32.9% respectively [7][10]. - The earnings per share (EPS) are expected to rise from 2.37 RMB in 2023 to 6.21 RMB in 2027, indicating strong growth potential [7][10]. Market Position - The company is recognized as a leading player in hybrid bonding technology, having successfully passed certification with major domestic manufacturers, which positions it well to capitalize on the growing demand for domestic HBM production [10]. - The company’s revenue for 2024 is forecasted to reach 41 billion RMB, representing a 52% increase year-on-year, with continued strong growth expected into 2025 [10].