Core Viewpoint - Samsung Electronics is expected to start shipping its fifth-generation high bandwidth memory (HBM3E) products to Broadcom in the second half of this year, but delays have occurred due to quality testing by Nvidia, which has postponed the delivery of 12-layer HBM3E products to its main customers [1][2]. Group 1: Supply Chain Challenges - Samsung has faced three main challenges in supplying Nvidia: it has not met Nvidia's thermal standards, which are twice as strict as Broadcom's; the digital signal quality decreases when Samsung's HBM is connected to Nvidia's NVLink; and Samsung's yield rate is lower compared to competitors [1][2][3]. - The thermal requirements from Broadcom are approximately half of those from Nvidia, allowing Samsung to potentially meet Broadcom's needs more easily [2]. Group 2: Product Design and Performance - Nvidia's AI semiconductors are designed as general-purpose products for a wide range of applications, leading to higher power consumption and heat generation, which can negatively impact performance [2]. - The introduction of NVLink aims to ensure that even with a large number of AI semiconductors installed, each chip can respond quickly to avoid bottlenecks; however, Samsung's HBM has performance issues that affect digital signal quality when connected to NVLink [3]. Group 3: Quality Improvement Efforts - Samsung's lower HBM yield rate is seen as a significant issue that hampers timely delivery and weakens its negotiating position on pricing; the company is reportedly working on redesigning its DRAM products to improve quality and stabilize yield rates [3].