Core Viewpoint - Samsung Electronics is expected to start shipping its fifth-generation high bandwidth memory (HBM3E) products to Broadcom in the second half of this year, but delays have occurred due to quality testing by Nvidia, which has postponed the delivery of 12-layer HBM3E products to its main customers [1][2]. Group 1: Supply Chain Challenges - Samsung has faced three main challenges in supplying Nvidia: it has not met Nvidia's thermal standards, which are twice as strict as Broadcom's; the digital signal quality decreases when Samsung's HBM is connected to Nvidia's NVLink; and Samsung's yield rate is lower compared to competitors [1][2][3]. - The thermal requirements from Broadcom are approximately half of those from Nvidia, allowing Samsung to potentially meet Broadcom's needs more easily [2]. Group 2: Product Design and Performance - Nvidia's AI semiconductors are designed as general-purpose products for a wide range of applications, leading to higher power consumption and heat generation, which can negatively impact performance [2]. - The introduction of NVLink aims to ensure that even with a large number of AI semiconductors installed, each chip can respond quickly to avoid bottlenecks; however, Samsung's HBM has performance issues that affect digital signal quality when connected to NVLink [3]. Group 3: Quality Improvement Efforts - Samsung's lower HBM yield rate is seen as a significant issue that hampers timely delivery and weakens its negotiating position on pricing; the company is reportedly working on redesigning its DRAM products to improve quality and stabilize yield rates [3].

Core Viewpoint - Samsung Electronics is set to supply 12-layer HBM3E to Broadcom, with plans for mass production starting as early as the second half of this year to next year, aiming to mitigate the impact of NVIDIA's HBM supply delays [1][3]. Group 1: Supply Agreements - Samsung has completed quality testing for HBM3E 12-layer with Broadcom and is negotiating supply volumes estimated between 12 billion to 14 billion Gb, with mass production expected soon [1]. - Samsung is also in active discussions to supply HBM3E 12-layer memory to Amazon Web Services (AWS), which plans to produce the next generation AI semiconductor "Trainium 3" using this memory [2]. Group 2: Market Dynamics - The surge in development of proprietary ASICs by major tech companies presents an opportunity for Samsung to offset the downturn in its HBM business [3]. - Samsung's initial plan to supply NVIDIA with HBM3E 12-layer was delayed due to performance issues, and the company is now adjusting its production rates for HBM3E lines [3]. Group 3: Production Goals - Samsung aims to double its total HBM supply to between 8 billion to 9 billion GB this year, compared to last year [1]. - The successful supply to NVIDIA and acquisition of more ASIC clients in the second half of this year is crucial for stabilizing Samsung's HBM business [3].

Core Viewpoint - SK Siltron's sales to SK Hynix surpassed those to Samsung Electronics for the first time in Q1 2023, attributed to SK Hynix's success in high bandwidth memory (HBM) and server DRAM, while Samsung faced challenges [1][2]. Group 1: Sales Performance - In Q1 2023, SK Siltron sold wafers worth 124.4 billion KRW to Samsung (Company A) and 128.8 billion KRW to SK Hynix (Company B), marking a 27% decline in sales to Samsung and a 32% increase to SK Hynix compared to the previous year [1]. - This shift is significant as it marks the first time since SK Hynix's acquisition by SK Group in 2017 that sales to SK Hynix exceeded those to Samsung [1]. Group 2: Market Dynamics - The decline in Samsung's sales is attributed to weakened product competitiveness and a reduction in foundry capacity due to poor customer orders, leading to a 50% decrease in capital investment compared to the previous year [2]. - Conversely, SK Hynix has been maximizing production capacity for its 10nm fifth-generation process and has seen strong sales for products like HBM3E, while also investing in new factories [2]. Group 3: SiC Business Challenges - SK Siltron's SiC wafer subsidiary reported Q1 sales of 6.147 billion KRW with an operating loss of 63.4 billion KRW, a significant decline from the previous year's sales of 21.3 billion KRW and an increase in losses from 26.3 billion KRW [3]. - The SiC business, seen as a next-generation power semiconductor opportunity, is facing challenges in technology competitiveness and market conditions, leading to speculation that it may become a liability for SK Group [3].