Core Viewpoint - Samsung Electronics is expected to start shipping its fifth-generation high bandwidth memory (HBM3E) products to Broadcom in the second half of this year, but delays have occurred due to quality testing by Nvidia, which has postponed the delivery of 12-layer HBM3E products to its main customers [1][2]. Group 1: Supply Chain Challenges - Samsung has faced three main challenges in supplying Nvidia: it has not met Nvidia's thermal standards, which are twice as strict as Broadcom's; the digital signal quality decreases when Samsung's HBM is connected to Nvidia's NVLink; and Samsung's yield rate is lower compared to competitors [1][2][3]. - The thermal requirements from Broadcom are approximately half of those from Nvidia, allowing Samsung to potentially meet Broadcom's needs more easily [2]. Group 2: Product Design and Performance - Nvidia's AI semiconductors are designed as general-purpose products for a wide range of applications, leading to higher power consumption and heat generation, which can negatively impact performance [2]. - The introduction of NVLink aims to ensure that even with a large number of AI semiconductors installed, each chip can respond quickly to avoid bottlenecks; however, Samsung's HBM has performance issues that affect digital signal quality when connected to NVLink [3]. Group 3: Quality Improvement Efforts - Samsung's lower HBM yield rate is seen as a significant issue that hampers timely delivery and weakens its negotiating position on pricing; the company is reportedly working on redesigning its DRAM products to improve quality and stabilize yield rates [3].

如果您希望可以时常见面，欢迎标星收藏哦~ 来 源： 内容 编译自 zdnet 。 据悉，三星电子将向博通供应12层第五代高带宽存储器（HBM3E）。目前，在具体数量谈判后， 正在推进明年供货计划。随着全球大型科技公司纷纷加大自身专用集成电路（ASIC）开发的力 度，预计这将部分抵消英伟达HBM供应延迟带来的影响。 据业内人士3日透露，三星电子上个月与博通完成了HBM3E 12层质量测试，并计划量产供应该产 品。 目前两家公司商谈的供货量预计为12亿至14亿Gb（千兆位），预计最早将于今年下半年至明年实 现量产。 虽然与每年的HBM市场规模相比，这个数量并不算大，但对于急需确保HBM需求的三星电子来 说，这是一个意义重大的量。三星电子已设定目标，今年将HBM总供应量提升至80亿至90GB，是 去年的两倍。 参考链接 https://zdnet.co.kr/view/?no=20250703105748 点这里加关注，锁定更多原创内容 *免责声明：文章内容系作者个人观点，半导体芯闻转载仅为了传达一种不同的观点，不代表半导体芯闻对该 观点赞同或支持，如果有任何异议，欢迎联系我们。 | | 推荐阅读 | | --- ...

Core Viewpoint - SK Siltron's sales to SK Hynix surpassed those to Samsung Electronics for the first time in Q1 2023, attributed to SK Hynix's success in high bandwidth memory (HBM) and server DRAM, while Samsung faced challenges [1][2]. Group 1: Sales Performance - In Q1 2023, SK Siltron sold wafers worth 124.4 billion KRW to Samsung (Company A) and 128.8 billion KRW to SK Hynix (Company B), marking a 27% decline in sales to Samsung and a 32% increase to SK Hynix compared to the previous year [1]. - This shift is significant as it marks the first time since SK Hynix's acquisition by SK Group in 2017 that sales to SK Hynix exceeded those to Samsung [1]. Group 2: Market Dynamics - The decline in Samsung's sales is attributed to weakened product competitiveness and a reduction in foundry capacity due to poor customer orders, leading to a 50% decrease in capital investment compared to the previous year [2]. - Conversely, SK Hynix has been maximizing production capacity for its 10nm fifth-generation process and has seen strong sales for products like HBM3E, while also investing in new factories [2]. Group 3: SiC Business Challenges - SK Siltron's SiC wafer subsidiary reported Q1 sales of 6.147 billion KRW with an operating loss of 63.4 billion KRW, a significant decline from the previous year's sales of 21.3 billion KRW and an increase in losses from 26.3 billion KRW [3]. - The SiC business, seen as a next-generation power semiconductor opportunity, is facing challenges in technology competitiveness and market conditions, leading to speculation that it may become a liability for SK Group [3].