Core Viewpoint - The article discusses the recent "2025 Heterogeneous Integration Frontier Forum" held in Ningbo, focusing on advancements in heterogeneous integration technology and its implications for various industries, particularly in optical interconnects and chiplet technologies [3]. Group 1: Forum Highlights - The forum attracted leading companies and research institutions from both domestic and international backgrounds, facilitating in-depth discussions on cutting-edge achievements, technological trends, and key challenges in the field [3]. - Key topics included the challenges in high-speed optical interconnect chip manufacturing, where domestic capabilities are strong in design and demonstration but face issues in mass production and reliability [8]. Group 2: Technological Challenges - The new technical challenges in heterogeneous integration chiplet technology primarily revolve around signal integrity, power integrity, multi-physical field issues, and electromagnetic interference [9]. - The development of optical interconnect solutions is seen as essential for overcoming AI computing power bottlenecks, emphasizing the need for collaborative innovation in devices and advanced packaging technologies [16]. Group 3: Industry Trends - The integration of heterogeneous and optoelectronic technologies is identified as a significant future direction, with AI technology being a major driver for the growth in advanced packaging demands [18]. - The transition from 2G to 5G has significantly increased the value of RF components in mobile devices, with the value of RF devices per smartphone rising from $0.5 to over $12 [22].