21智讯1月12日电，鼎龙股份在投资者关系活动中表示，公司在OLED新型显示材料YPI、PSPI领域持续 保持国内供应领先地位，仙桃产业园年产1000吨PSPI产线已投产并批量供应，YPI二期项目可满足新增 订单需求。无氟光敏聚酰亚胺（PFASFreePSPI）、黑色像素定义层材料（BPDL）等新产品客户验证进 展符合预期，PI取向液等多款新一代材料已展开客户端验证。此外，临时键合胶、封装光刻胶已实现规 模出货，高端晶圆光刻胶重点型号正冲刺订单，潜江二期量产线计划转入试运行。 ...

Core Insights - Dinglong Co., Ltd. reported a revenue of 2.698 billion yuan for the first three quarters of the year, marking an 11.23% year-on-year increase, and a net profit attributable to shareholders of 519 million yuan, up 38.02% year-on-year [1] - The semiconductor business has shown strong growth, with revenue from the semiconductor segment reaching 1.534 billion yuan, a 41.27% increase year-on-year, and its contribution to total revenue rising from 46% to 57% [1] - The CMP polishing pad business achieved sales revenue of 795 million yuan in the first three quarters, reflecting a 52% year-on-year growth, with a record quarterly revenue of 320 million yuan in Q3, up 42% [1] Semiconductor Segment Performance - The semiconductor materials and integrated circuit chip design and application business generated 1.534 billion yuan in revenue, with a significant year-on-year growth of 41.27% [1] - The CMP polishing pads have penetrated core domestic wafer factories and are being promoted in foreign wafer factories, with production capacity expected to reach 50,000 pieces per month by the end of Q1 2026 [2] - CMP polishing liquids and cleaning liquids generated sales revenue of 203 million yuan, a 45% increase year-on-year, with new products undergoing client validation [2] Product Development and Market Expansion - The semiconductor display materials segment achieved sales revenue of 413 million yuan, up 47% year-on-year, with new products in the validation process [2] - The company is actively validating and expanding its advanced packaging materials and high-end wafer photoresist products, with several key models targeting order acquisition in Q4 [3] - The second phase of the 300-ton annual production line for high-end wafer photoresist is set to enter trial operation in Q4 [3]