投资者关系 活动类别 ■特定对象调研 □分析师会议 □媒体采访 □业绩说明会 □新闻发布会 □路演活动 ■现场参观 □其他 参与单位名称 及人员姓名 2025 年 8 月 27 日下午 14:00~15:00：工银瑞信基金：金兴；南方基金：吴春 林；华商基金：彭雾、康译丹、朱锟旭、彭欣杨，财通证券：王雨然、白宇 等，共 10 名投资者及证券人员 时间 2025 年 8 月 27 日下午 14:00~15:00 地点 公司 9 楼会议室 上市公司接待 人员姓名 2025 年 8 月 27 日下午 14:00~15:00：董事会秘书杨平彩女士 投资者 关系活动 主要内容 介绍 管理层介绍公司基本情况，并与投资者就公司半导体业务、打印复印通 用耗材业务的经营及其他投资者关心的问题进行深入交流，主要交流内容如 下： 问 1：公司 CMP 抛光垫业务收入拓展情况怎样？ 答：公司是国内唯一一家全面掌握 CMP 抛光垫全流程核心研发技术和 生产工艺的 CMP 抛光垫供应商，是 CMP 抛光垫国产供应龙头。2025 年上 半年度，公司 CMP 抛光垫实现产品销售收入 4.75 亿元，同比增长 59.58%， 在国内主流晶圆厂 ...

鼎龙股份 20250822 摘要 鼎龙股份在 2025 年上半年取得了哪些主要经营成果？ 2025 年上半年，鼎龙股份实现营业收入 17.32 亿元，同比增长 14%；归属于 上市公司的净利润为 3.11 亿元，同比增长 42%。若剔除股权激励的影响，净 利润为 3.34 亿元。此外，如果将尚处于孵化期并亏损的晶圆光刻胶和齐杰半 导体芯片业务的亏损 4,000 万元加回，公司盈利产品的实际净利润约为 3.8 亿 元。第二季度，公司实现营业收入 9.08 亿元，环比增长 10%，同比增长 12%；归属于上市公司的净利润为 1.7 亿元，环比增长 20%。 鼎龙股份在 2025 年上半年有哪些重要投入和其对未来业绩的影响？ 2025 年上半年，鼎龙股份在人才和产品验证测试方面进行了重要投入。公司 新入职了 90 多名高端研发和市场端人才，这些人才将助力未来市场扩展和研 发进展。此外，公司在抛光液、清洗液及柔性显示材料等多个品类进行了大量 公司预计 2025 年下半年半导体及柔性显示行业景气度提升，新产品销 售转化及现有重点产品放量将在三、四季度保持显著增长态势，有信心 完成全年归母净利润 7 亿元目标。 2025 ...

Group 1 - The company reported a revenue of 415 million yuan for the first half of 2025, representing a year-on-year growth of 10.63%, while the net profit attributable to shareholders decreased by 37.90% to 31 million yuan [2] - The decline in net profit is attributed to ongoing investments in research and development as well as the construction of new production lines, reflecting competitive pressures in the display materials industry [2] - The liquid crystal display materials segment continues to develop steadily, with significant breakthroughs in high-performance negative liquid crystal materials for various applications including automotive and gaming [2] Group 2 - The OLED materials business has emerged as a new highlight, particularly with substantial progress in expanding overseas markets, which is expected to provide new growth points for the company [2] - The semiconductor materials segment has also made significant advancements, with the Shanghai facility completing multiple client certifications for KrF resin and achieving stable shipments at the hundred-kilogram level [2] - The completion and production launch of the Xuyou electronic materials base is a key milestone, enhancing the company's capacity and technological level, and marking a shift from a single liquid crystal materials supplier to a diversified materials platform [3] Group 3 - The company is transitioning towards a diversified materials platform, with initial successes in high-end liquid crystal materials, OLED overseas markets, and semiconductor photoresists, despite short-term profit pressures [3] - The full production launch of the Xuyou base and the gradual ramp-up of new products are expected to usher in a new growth cycle for the company [3]

Key Points Summary - The article emphasizes the critical role of packaging materials in the integrated circuit industry, accounting for 40%-60% of total packaging costs, and highlights the urgent need for domestic alternatives due to foreign monopolies in high-end materials [3][6]. Group 1: Importance of Materials - Packaging materials are a key bottleneck in the development of the integrated circuit industry, comprising 40%-60% of total packaging costs [3][6]. Group 2: Urgency for Domestic Alternatives - High-end materials are dominated by Japanese and American companies, with low domestic production rates: photoresists (<2%), PSPI (93% by four foreign companies), and silicon powder (70% by Japanese companies) [3]. - The "Made in China 2025" policy is driving local companies to achieve technological breakthroughs, such as Dinglong Co. and Shanghai Xinyang [3]. Group 3: High-Growth Segments - Photo-sensitive materials: The global PSPI market is expected to grow at a CAGR of 25.16%, reaching $2.032 billion by 2029; the Chinese market for photoresists is projected to reach $5.95 million by 2025 [3][18]. - Epoxy molding compounds (EMC): The global market is expected to reach $9.9 billion by 2027, with advanced packaging EMC growing even faster [3]. - Silicon powder: The Chinese market is projected to grow at a CAGR of 22.3%, reaching $5.5 billion by 2025 [3]. - Electroplating and polishing liquids: Global copper electroplating liquids are expected to grow at a CAGR of 10.79%, while CMP polishing liquids in China are expected to grow at 15% [3]. Group 4: Core Materials and Technical Barriers - Photo-sensitive materials: PSPI and BCB are mainstream media for wafer-level packaging, with PSPI being a trend [3]. - Temporary bonding adhesives and underfill materials are critical for 3D packaging, with a market CAGR of 8.2% [3]. - TSV materials are dominated by foreign companies, with the highest cost share (34% for temporary bonding and electroplating) [3]. Group 5: Key Domestic Enterprises - Key players in photo-sensitive materials include Dinglong Co. (mass production of PSPI) and Qiangli New Materials (in certification phase) [3]. - In epoxy molding compounds, Huahai Chengke and Hengsu Huawai are notable companies [3]. - For silicon powder, Lianrui New Materials is focusing on domestic alternatives [3]. - In photoresists and electroplating liquids, Shanghai Xinyang and Tongcheng New Materials are key players [3]. - The fields with low domestic production rates (under 10%) include photoresists, PSPI, spherical silicon powder, and TSV materials, indicating significant replacement potential [3]. Group 6: Investment Logic - Focus on high-growth areas (PSPI, silicon powder), high barriers (photoresists), and high domestic replacement potential (EMC, electroplating liquids) [3].

Core Viewpoint - The article emphasizes the importance of domestic substitution in the chemical industry, particularly focusing on the localization of "choke point" materials to enhance supply chain security and reduce production costs in rapidly expanding sectors like semiconductors, OLED, AR/VR, and humanoid robots [2]. Group 1: Domestic Substitution and Material Localization - The concept of "domestic substitution" has gained attention as China's chemical industry improves its production technology, breaking through overseas technical barriers [2]. - Achieving breakthroughs in "choke point" materials and the localization of equipment and processes is essential for "safe development" [2]. - Enhancing the self-supply capability of upstream materials in industries like semiconductors can improve overall supply chain security [2]. Group 2: COC/COP Materials - COC/COP, a high-end optical material, is recognized for its excellent properties such as high thermal deformation temperature, high transparency, low birefringence, and low dielectric constant [3]. - Currently, the production capacity of COC/COP is mainly held by Japanese manufacturers, but domestic companies are beginning to establish a foundation for industrialization [3]. - Akolai's COC production line has entered trial production in Q3 2024, with plans for a 30,000-ton optical materials project in Hubei [3]. Group 3: PSPI Development - PSPI serves dual functions as both a photoresist and dielectric insulation layer, with applications in integrated circuits, MEMS, and OLEDs [4]. - Domestic companies like Aolide and Dinglong have made breakthroughs in the localization of PSPI, indicating a promising increase in domestic supply [4]. Group 4: Semiconductor Market Outlook - The global semiconductor sales are projected to reach approximately $630.5 billion in 2024, reflecting a year-on-year growth of about 19.7% [5]. - The Asia-Pacific region's semiconductor sales are expected to be around $340.79 billion, with a growth rate of 17.5% [5]. - The steady growth of the semiconductor market is anticipated to drive an increase in demand for semiconductor materials, including photoresists and electronic specialty gases [6].

Investment Rating - The report maintains an "Overweight" rating for the basic chemical industry [6] Core Viewpoints - The report is optimistic about the domestic breakthroughs in COC materials, packaging materials, and semiconductor materials, emphasizing the importance of "domestic substitution" in achieving supply chain security and reducing production costs for end products [1][22] Summary by Sections Semiconductor Materials - The global semiconductor sales are projected to reach approximately $630.5 billion in 2024, representing a year-on-year growth of about 19.7%, with the Asia-Pacific region expected to see a growth of 17.5% [4][38] - The steady growth in the semiconductor market is anticipated to drive an increase in demand for semiconductor materials, including photoresists and electronic specialty gases [4][43] COC/COP Materials - COC/COP, a high-end optical material, has shown significant potential, with Akolai's thousand-ton production line entering trial production in Q3 2024 [2][29] - COC/COP materials are characterized by high thermal deformation temperature, high transparency, low birefringence, and low dielectric loss, making them ideal for optical components [25][28] - The domestic production of COC/COP is gaining momentum, with several companies, including Akolai, making strides in industrialization [28][29] PSPI Materials - PSPI combines the functions of photoresist and dielectric insulation layer, showing promise in integrated circuits and OLED applications [3][35] - Domestic companies like Aolide and Dinglong have achieved breakthroughs in the localization of PSPI, indicating a potential increase in domestic supply [3][36] Investment Recommendations - The report suggests focusing on high-value new materials, particularly semiconductor materials, OLED supply chains, and wind power materials [5] - It also highlights the importance of monitoring the development of new capacities in the semiconductor materials sector [43]

Core Viewpoint - The article discusses the significance and market potential of Photosensitive Polyimide (PSPI) in the semiconductor industry, highlighting its advantages over traditional materials and the impact of supply chain disruptions caused by major suppliers like Asahi Kasei [1][2][3]. Market Overview - The global market for PSPI is projected to reach $402 million in 2024 and $802 million by 2030, indicating a strong growth trajectory [2]. - Major suppliers, including Toray, Fujifilm, HD Microsystems, Asahi Kasei, and SK Materials, dominate approximately 95% of the market, primarily serving processes below 28nm [2]. Supply Chain Disruption - Asahi Kasei announced supply adjustments for its PSPI product, leading to significant supply shortages for key semiconductor manufacturers such as TSMC and Samsung, which could severely impact their production plans [2]. Industry Challenges - The article emphasizes the conflict between the surging demand for AI computing power and the limited production capacity of PSPI, which is exacerbating supply chain issues [3]. Conference Insights - The 2025 TrendBank Lithography Industry Conference will address PSPI-related topics, featuring participation from various industry players, including Hubei Dinglong Advanced Materials and Bomi Technology [4]. Company Profiles - Hubei Dinglong focuses on semiconductor materials and has developed over 100 high-tech products, holding more than 1,000 patents [5]. - Bomi Technology specializes in polyimide materials and has achieved mass production of PSPI for integrated circuit packaging [8]. - Taiwan's Eternal Chemical has a strong emphasis on R&D, with over 190 patents and a commitment to high-tech chemical products [9]. - Weifang Xingtai Technology is dedicated to high-end photoresists and has developed a range of products that meet both domestic and international standards [10][11]. Conference Agenda - The conference will feature discussions on advanced lithography technologies, challenges in photoresist and wet electronic chemicals, and the current state of domestic lithography materials [22][23]. - Key topics include the development of self-assembly lithography techniques, advancements in photoresist technology, and the analysis of the Chinese mainland photoresist market [14]. Conference Details - The 2025 TrendBank Lithography Industry Conference is scheduled for July 9-10, 2025, in Hefei, Anhui, with an expected attendance of 300 participants [21][32].

Investment Rating - The investment rating for the semiconductor industry is "Positive" (maintained) [1] Core Insights - The semiconductor industry is expected to see a recovery in downstream demand, leading to improved market conditions [3] - The domestic high-end semiconductor packaging and testing leader, Shenghe Jingwei, has entered the guidance acceptance stage for its IPO, focusing on mid-stage silicon wafer manufacturing and advanced packaging [3] - The global semiconductor packaging materials market is estimated to be approximately $21.98 billion in 2023, with a domestic localization rate of about 15% for semiconductor materials and less than 30% for packaging materials [4] Summary by Sections - **Shenghe Jingwei's IPO**: Shenghe Jingwei's IPO guidance status has changed to acceptance, with its 12-inch high-density bumping processing and packaging capabilities reaching world-class levels. The company is also developing advanced three-dimensional system integration chip business [3] - **Market Size and Localization**: The global semiconductor packaging materials market is valued at $21.98 billion, with significant portions allocated to various materials. The localization rate for semiconductor materials in China is around 15%, and for packaging materials, it is less than 30% [4] - **Key Materials and Beneficiaries**: Various materials critical to advanced packaging processes are identified, including electroplating solutions, PSPI, photoresists, polishing materials, masks, and target materials, with specific companies highlighted as beneficiaries [6]

Group 1 - The core viewpoint of the article highlights that Shanghai Minxin Technology Co., Ltd. has recently completed a nearly 100 million RMB B+ round financing led by Fangguo Capital, with participation from Juhe Materials, Yunjiu Capital, and KIP Capital [1][3] Group 2 - Minxin Technology, established in 2019, focuses on the research, production, and sales of light and heat-curing functional materials and electronic-grade wet chemicals, building a comprehensive capability from resin synthesis to terminal applications [2] - The CEO of Minxin Technology stated that the financing will primarily be used for expanding new product lines, team expansion, and establishing an overseas R&D center, aiming to enhance production capacity and product competitiveness [3] Group 3 - Fangguo Capital's investment vice president noted that the materials industry is entering a golden period of development as domestic industries are breaking through from downstream to upstream, with Minxin Technology filling domestic gaps in multiple products [4] - The founder of Shangdao Venture Capital expressed that this financing round reflects the high attention of the domestic venture capital market towards the high-end materials sector, supported by government policies promoting the semiconductor and display industries [5]

Core Viewpoint - The company has demonstrated significant growth in revenue and profit for 2024, driven primarily by its semiconductor business expansion and cost control measures [1][2]. Financial Performance Summary - In 2024, the company achieved revenue of approximately 3.34 billion yuan, a year-on-year increase of about 25.1%, and a net profit attributable to shareholders of approximately 520 million yuan, up 134.5% year-on-year [1]. - For Q1 2025, the company reported revenue of approximately 820 million yuan, a year-on-year increase of about 16.4%, but a quarter-on-quarter decrease of about 9.7% [1]. - The gross profit margin for Q1 2025 was approximately 48.8%, reflecting a year-on-year increase of about 4.6 percentage points [1]. Semiconductor Business Growth - The semiconductor segment generated main business revenue of 1.52 billion yuan in 2024, representing a year-on-year growth of 77.4% [2]. - CMP polishing pads contributed 720 million yuan in revenue, a year-on-year increase of 71.5% [2]. - CMP polishing liquids and cleaning liquids achieved revenue of 220 million yuan, up 178.9% year-on-year, with notable improvements in market acceptance [2]. - Semiconductor display materials generated revenue of 400 million yuan, a year-on-year increase of 131.1%, with market share and production capacity continuing to grow [2]. Emerging Business Areas - High-end wafer photoresists and advanced semiconductor packaging materials are in the early stages of market development and have not yet turned profitable [3]. - The company has secured orders for high-end wafer photoresists from major domestic manufacturers and is progressing with production capacity expansion [3]. - The company has also received its first orders for semiconductor packaging materials, generating sales revenue of 5.44 million yuan [3]. Investment Outlook - The company is expected to achieve net profits attributable to shareholders of 768 million yuan, 1.021 billion yuan, and 1.392 billion yuan for 2025, 2026, and 2027 respectively, with adjustments made to previous profit forecasts [4]. - Corresponding price-to-earnings ratios are projected at 36, 27, and 20 times for the respective years [4].