Group 1 - The core viewpoint of the articles highlights the rapid growth and significance of the newly launched "Technology Board" for innovative bonds in China's bond market, with over 300 billion yuan issued within three weeks of its launch [1][2][4] - As of May 28, a total of 134 innovative bonds have been issued, amounting to 301.06 billion yuan, with 251.2 billion yuan from the interbank market and 50.11 billion yuan from the exchange market [1] - The issuance of technology innovation bonds is supported by the People's Bank of China and the China Securities Regulatory Commission, which has led to a more unified regulatory framework and reduced costs for issuers [1][4] Group 2 - Technology companies have been significant participants in the bond issuance, with approximately 70 billion yuan raised since the launch of the "Technology Board" [2] - The simplification of issuance requirements and extended validity of financial data have improved the efficiency of bond issuance for technology firms [2][3] - The participation of financial institutions as both issuers and underwriters has increased, with 18 brokerages having completed bond issuances totaling 21.4 billion yuan [4] Group 3 - Private equity investment institutions are utilizing the "Technology Board" to access low-cost, long-term financing, which is crucial for their investment strategies [5] - Over 20 private equity firms have announced or completed bond issuances, with funds directed towards technology sectors such as information technology and intelligent manufacturing [5] - The future development of the bond market will focus on enhancing policy implementation, diversifying bond types, and improving risk management systems [6]