Group 1 - The core viewpoint of the article is that TSMC is accelerating its capacity expansion for 2nm process technology to solidify its market dominance in advanced semiconductor foundry services, with plans to increase monthly production capacity significantly by 2027 [1][2]. - TSMC plans to raise its 2nm wafer capacity to approximately 150,000 wafers per month by 2027, compared to its current capacity of about 40,000 wafers per month, with an interim target of 80,000 to 90,000 wafers per month next year [1]. - UBS forecasts that while the 2nm process will account for less than 10% of TSMC's sales next year, this figure is expected to grow to 15-20% by 2027 [1]. Group 2 - TSMC holds a dominant position in the advanced semiconductor market, with a market share of 70.2% in the foundry sector as of Q2 this year, producing chips for major companies like Apple, Qualcomm, Nvidia, Google, and AMD [2]. - TSMC is planning to build three new 2nm fabrication plants in Taiwan to meet the increasing demand for AI chips, with a total investment of approximately 900 billion New Taiwan Dollars (around 4.21 trillion Korean Won) [2]. - Competitors like Samsung and Intel are also ramping up production to catch up with TSMC, with Samsung expected to double its wafer capacity to 21,000 wafers next year and Intel launching its 18A (1.8nm) process at its Arizona facility [3].