Core Progress in China's Chip Technology - China's chip technology has achieved multiple breakthroughs, marking a shift from "single-point breakthroughs" to "systematic innovation" in the domestic semiconductor industry [1] Disruptive Computing Chips: Breaking Physical Barriers - The world's first 24-bit precision analog matrix chip developed by Peking University enhances traditional analog computing precision from 8 bits to 24 bits with an error rate below 0.1% [1] - This chip achieves a computational throughput over 1000 times that of top GPUs when solving 128×128 matrix equations, with energy efficiency improved by over 100 times [2] - It provides new pathways for AI large model training and edge computing by overcoming the century-old problem of low precision and scalability in analog computing [3] Integrated Storage and Computing Chips - Tsinghua University has developed the world's first memristor chip that integrates storage, computing, and on-chip learning, achieving a 75-fold energy efficiency improvement over traditional ASICs [4] - This chip supports direct AI training on hardware, reducing reliance on cloud services [4] Core Processes and Materials: Breaking Monopolies - The launch of a 1nm ion beam etching machine by Guoguang Liangzuo achieves a precision of 0.02 nanometers, outperforming mainstream 2nm equipment by a factor of 100 [7] - Shanghai Microelectronics has achieved mass production of immersion lithography machines, with a domestic equipment matching rate exceeding 50% [7] - Fudan University has developed the world's first two-dimensional-silicon-based hybrid architecture flash memory chip, achieving read and write speeds a million times faster than traditional flash memory [7] High-End Chip Design and Manufacturing: Entering the First Tier - Xiaomi has launched the first self-developed 3nm mobile SoC in mainland China, integrating 19 billion transistors and achieving performance close to Apple's A18 Pro with a 30% energy efficiency improvement [8] - Huawei's Ascend 910B supports 8-card interconnection, significantly reducing dependence on imported AI computing power from 95% to 50% [9] - The Loongson 3C6000 chip, based on a fully autonomous architecture, surpasses Intel's Xeon 8380 in performance and has received the highest national security certification [10] Future Directions and Challenges - A joint research project between Peking University and Hong Kong City University has developed a full-band 6G chip with a speed of 120Gbps, supporting integrated networking [11] - The introduction of a 504-qubit superconducting quantum computer "Tianyan 504" by China Telecom is expected to enhance quantum chip yield [12] - The industry still relies on EUV lithography machines for processes below 7nm, with domestic EUV expected to be developed by 2027 [13] - There is a need to accelerate the development of GPU toolchains and EDA design software to enhance the software ecosystem [14] Summary - China's chip technology is achieving "leapfrog" advancements through multi-path innovation, with short-term goals focusing on a fully autonomous 28nm supply chain, mid-term goals on reshaping computing power with new architectures, and long-term goals on seizing high ground in quantum chips and two-dimensional materials [14][15]