Core Viewpoint - Zhuhai Yueya Semiconductor Co., Ltd. has recently received acceptance for its IPO on the ChiNext board, indicating a significant step towards public listing and capital raising in the semiconductor industry [1] Company Overview - Zhuhai Yueya Semiconductor specializes in the research, production, and sales of advanced packaging key materials and products [1] - The company's product offerings include RF module packaging substrates, ASIC chip packaging substrates, flip chip ball grid array packaging substrates, power management chip packaging substrates, and embedded packaging modules [1] IPO Details - The company aims to raise approximately 1.224 billion yuan through its IPO [1] - The net proceeds, after deducting issuance costs, will be allocated to the expansion project for high-efficiency embedded packaging modules targeting the AI sector, a research and development center project, and to supplement working capital [1]

Core Viewpoint - Zhuhai Yueya Semiconductor Co., Ltd. has submitted its prospectus for an IPO on the Hong Kong Stock Exchange, aiming to raise approximately 1.224 billion yuan for expansion projects and working capital [3][4]. Financial Summary - The company plans to allocate 1.037 billion yuan for the AI-focused high-performance embedded packaging module expansion project, 107 million yuan for the R&D center project, and 80 million yuan for working capital [4]. - In the first half of 2023, Yueya Semiconductor reported a revenue of 811 million yuan [5]. - Projected revenues for 2022, 2023, and 2024 are 1.667 billion yuan, 1.7 billion yuan, and 1.796 billion yuan, respectively, with net profits of 415 million yuan, 188 million yuan, and 215 million yuan [4][5]. Shareholder Structure - The largest shareholder is AMITEC Company, holding 39.9452% of shares, followed by Xin Xin Chuan with 30.9106% [6][9]. - Other notable shareholders include Oriental Fortune Management and Zhuhai Huajin Lingrui, holding 2.221% and 2.7104% respectively [8][9]. Ownership Changes Post-IPO - After the IPO, AMITEC's shareholding will decrease to 33.9535%, while Xin Xin Chuan's will drop to 26.274% [10]. - The total number of shares post-IPO will be approximately 1.049 billion, with the public holding 15% [10].

（文/罗叶馨梅）9月30日，据深交所官网显示，珠海越亚半导体股份有限公司（简称：越亚半导体）创业板IPO申请已获受理。 （校对/秋贤） 在技术方面，公司掌握了独立自主知识产权的铜柱法技术，实现了无芯封装载板产业化，并基于此研发出主被动元器件混合嵌埋封装技术。作为全球少数实 现嵌埋芯片技术产业化的厂商之一，越亚半导体能够将晶圆与被动元器件嵌埋在封装载板内，从而显著减少封装面积、提升产品性能。目前，公司已量产应 用于5G射频功率放大器、通信基站、AI服务器的封装载板及电源管理模组，并在3纳米节点ASIC芯片和中高端CPU/GPU的FC-BGA封装载板上实现突破。 市场布局方面，公司深耕射频前端与电源管理类模拟芯片市场，同时积极开拓以高性能计算为代表的数字芯片市场。越亚半导体已获得包括A公司、威讯 （Qorvo）、德州仪器（TI）、展讯通信、卓胜微、唯捷创芯、芯原微等国内外知名客户的认可，并形成了长期稳定的合作关系，展现出较强的国际竞争 力。 业内人士认为，随着5G通信和人工智能产业加速发展，先进封装需求持续上升，越亚半导体有望借助此次IPO进一步提升资本实力，加快产能扩张与技术迭 代，从而巩固其在全球高端封装载板 ...